Cypress Semiconductor CY7C1510JV18 Specification Sheet

72-mbit qdr-ii sram 2-word burst architecture

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Features
Separate independent read and write data ports
Supports concurrent transactions
267 MHz clock for high bandwidth
2-word burst on all accesses
Double Data Rate (DDR) interfaces on both read and write ports
(data transferred at 534 MHz) at 267 MHz
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Single multiplexed address input bus latches address inputs
for both read and write ports
Separate port selects for depth expansion
Synchronous internally self-timed writes
QDR-II operates with 1.5 cycle read latency when Delay Lock
Loop (DLL) is enabled
Operates like a QDR-I device with 1 cycle read latency in DLL
off mode
Available in x8, x9, x18, and x36 configurations
Full data coherency, providing most current data
Core V
= 1.8V (±0.1V); IO V
DD
Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
Variable drive HSTL output buffers
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Selection Guide
Description
Maximum Operating Frequency
Maximum Operating Current
Cypress Semiconductor Corporation
Document #: 001-14435 Rev. *C
= 1.4V to V
DDQ
DD
x8
x9
x18
x36
198 Champion Court
CY7C1510JV18, CY7C1525JV18
CY7C1512JV18, CY7C1514JV18
72-Mbit QDR™-II SRAM 2-Word
Configurations
CY7C1510JV18 – 8M x 8
CY7C1525JV18 – 8M x 9
CY7C1512JV18 – 4M x 18
CY7C1514JV18 – 2M x 36

Functional Description

The CY7C1510JV18, CY7C1525JV18, CY7C1512JV18, and
CY7C1514JV18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR-II architecture. QDR-II architecture consists
of two separate ports: the read port and the write port to access
the memory array. The read port has dedicated data outputs to
support read operations and the write port has dedicated data
inputs to support write operations. QDR-II architecture has
separate data inputs and data outputs to completely eliminate
the need to "turn-around" the data bus that exists with common
IO devices. Access to each port is through a common address
bus. Addresses for read and write addresses are latched on
alternate rising edges of the input (K) clock. Accesses to the
QDR-II read and write ports are completely independent of one
another. To maximize data throughput, both read and write ports
are equipped with DDR interfaces. Each address location is
associated with two 8-bit words (CY7C1510JV18), 9-bit words
(CY7C1525JV18), 18-bit words (CY7C1512JV18), or 36-bit
words (CY7C1514JV18) that burst sequentially into or out of the
device. Because data can be transferred into and out of the
device on every rising edge of both input clocks (K and K and C
and C), memory bandwidth is maximized while simplifying
system design by eliminating bus "turn-arounds".
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
267 MHz
250 MHz
267
1375
1385
1495
1710
,
San Jose
CA 95134-1709
Burst Architecture
Unit
250
MHz
1245
mA
1255
1365
1580
408-943-2600
Revised March 10, 2008
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Summary of Contents for Cypress Semiconductor CY7C1510JV18

  • Page 1: Functional Description

    To maximize data throughput, both read and write ports are equipped with DDR interfaces. Each address location is associated with two 8-bit words (CY7C1510JV18), 9-bit words (CY7C1525JV18), 18-bit words (CY7C1512JV18), or 36-bit words (CY7C1514JV18) that burst sequentially into or out of the device.
  • Page 2 Logic Block Diagram (CY7C1510JV18) [7:0] Address (21:0) Register Gen. DOFF Control Logic [1:0] Logic Block Diagram (CY7C1525JV18) [8:0] Address (20:0) Register Gen. DOFF Control Logic Document #: 001-14435 Rev. *C CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 Write Write Address Register Control Logic Read Data Reg.
  • Page 3 Control Logic [1:0] Logic Block Diagram (CY7C1514JV18) [35:0] Address (19:0) Register Gen. DOFF Control Logic [3:0] Document #: 001-14435 Rev. *C CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 Write Write Address Register Control Logic Read Data Reg. Reg. Reg. Reg. Write Write Address...
  • Page 4: Pin Configuration

    Pin Configuration The pin configuration for CY7C1510JV18, CY7C1525JV18, CY7C1512JV18, and CY7C1514JV18 follow. DOFF DOFF Note 1. NC/144M and NC/288M are not connected to the die and can be tied to any voltage level. Document #: 001-14435 Rev. *C CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 165-Ball FBGA (15 x 17 x 1.4 mm) Pinout...
  • Page 5 Pin Configuration The pin configuration for CY7C1510JV18, CY7C1525JV18, CY7C1512JV18, and CY7C1514JV18 follow. NC/144M DOFF NC/288M DOFF Document #: 001-14435 Rev. *C CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 165-Ball FBGA (15 x 17 x 1.4 mm) Pinout CY7C1512JV18 (4M x 18) NC/288M CY7C1514JV18 (2M x 36)
  • Page 6: Pin Definitions

    These address inputs are multiplexed for both read and write operations. Internally, the device is organized as 8M x 8 (2 arrays each of 4M x 8) for CY7C1510JV18, 8M x 9 (2 arrays each of 4M x 9) for CY7C1525JV18, 4M x 18 (2 arrays each of 2M x 18) for CY7C1512JV18, and 2M x 36 (2 arrays each of 1M x 36) for CY7C1514JV18.
  • Page 7 Power Supply Power Supply Inputs to the Core of the Device. Ground Ground for the Device. Power Supply Power Supply Inputs for the Outputs of the Device. Document #: 001-14435 Rev. *C CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 Pin Description Switching Characteristics on page 22.
  • Page 8: Functional Overview

    Single Clock Mode The CY7C1510JV18 can be used with a single clock that controls both the input and output registers. In this mode the device recognizes only a single pair of input clocks (K and K) that control both the input and output registers.
  • Page 9: Application Example

    Delayed K Delayed K# R = 50ohms Document #: 001-14435 Rev. *C CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 These chips use a DLL that is designed to function between 120 MHz and the specified maximum clock frequency. During power up, when the DOFF is tied HIGH, the DLL is locked after 1024 cycles of stable clock.
  • Page 10: Truth Table

    Truth Table The truth table for CY7C1510JV18, CY7C1525JV18, CY7C1512JV18, and CY7C1514JV18 follows. Operation Write Cycle: Load address on the rising edge of K; input write data on K and K rising edges. Read Cycle: Load address on the rising edge of K;...
  • Page 11 L–H – L–H – L–H – L–H – Document #: 001-14435 Rev. *C CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 [2, 8] Comments [2, 8] Comments – During the Data portion of a write sequence, all four bytes (D the device. L–H During the Data portion of a write sequence, all four bytes (D the device.
  • Page 12 TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK. Document #: 001-14435 Rev. *C CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 Instruction Register Three-bit instructions can be serially loaded into the instruction register.
  • Page 13 Document #: 001-14435 Rev. *C CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 BYPASS When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a Shift-DR state, the bypass register is placed between the TDI and TDO pins.
  • Page 14: Tap Controller State Diagram

    The state diagram for the TAP controller follows. TEST-LOGIC RESET TEST-LOGIC/ IDLE Note 9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document #: 001-14435 Rev. *C CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 SELECT DR-SCAN CAPTURE-DR SHIFT-DR EXIT1-DR PAUSE-DR...
  • Page 15 10. These characteristics pertain to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in the 11. Overshoot: V (AC) < V + 0.85V (Pulse width less than t 12. All Voltage referenced to Ground. Document #: 001-14435 Rev. *C CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 Bypass Register Instruction Register Identification Register Boundary Scan Register...
  • Page 16 14. Test conditions are specified using the load in TAP AC Test Conditions. t Document #: 001-14435 Rev. *C CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 Description [14] Figure 2.
  • Page 17: Instruction Codes

    RESERVED Do Not Use: This instruction is reserved for future use. BYPASS Places the bypass register between TDI and TDO. This operation does not affect SRAM operation. Document #: 001-14435 Rev. *C CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 Value CY7C1525JV18 CY7C1512JV18 11010011010001100...
  • Page 18 Boundary Scan Order Bit # Bump ID Bit # Document #: 001-14435 Rev. *C CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 Bump ID Bit # Bump ID Bit # Bump ID Internal Page 18 of 26 [+] Feedback [+] Feedback...
  • Page 19: Power-Up Sequence

    Power Up Waveforms Unstable Clock Clock Start (Clock Starts after DOFF Document #: 001-14435 Rev. *C CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 DLL Constraints ■ DLL uses K clock as its synchronizing input. The input must have low phase jitter, which is specified as t ■...
  • Page 20: Maximum Ratings

    18. V (min) = 0.68V or 0.46V , whichever is larger, V Document #: 001-14435 Rev. *C CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 Current into Outputs (LOW) ... 20 mA Static Discharge Voltage (MIL-STD-883, M. 3015).. > 2001V Latch-up Current ... > 200 mA...
  • Page 21: Thermal Resistance

    19. Unless otherwise noted, test conditions are based on signal transition time of 2V/ns, timing reference levels of 0.75V, Vref = 0.75V, RQ = 250Ω, V pulse levels of 0.25V to 1.25V, and output loading of the specified I Document #: 001-14435 Rev. *C CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 Test Conditions Test Conditions = 25°C, f = 1 MHz, V...
  • Page 22: Switching Characteristics

    , are specified with a load capacitance of 5 pF as in part (b) of 24. At any given voltage and temperature t is less than t Document #: 001-14435 Rev. *C CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 Description [21] , BWS...
  • Page 23: Switching Waveforms

    27. In this example, if address A2 = A1, then data Q20 = D10 and Q21 = D11. Write data is forwarded immediately as read results. This note applies to the whole diagram. Document #: 001-14435 Rev. *C CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18...
  • Page 24: Ordering Information

    CY7C1514JV18-250BZI CY7C1510JV18-250BZXI CY7C1525JV18-250BZXI CY7C1512JV18-250BZXI CY7C1514JV18-250BZXI Document #: 001-14435 Rev. *C CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 Package Diagram Package Type 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
  • Page 25: Package Diagram

    Figure 4. 165-ball FBGA (15 x 17 x 1.40 mm), 51-85195 TOP VIEW PIN 1 CORNER SEATING PLANE Document #: 001-14435 Rev. *C CY7C1510JV18, CY7C1525JV18 CY7C1512JV18, CY7C1514JV18 0.15(4X) NOTES : SOLDER PAD TYPE : NON SOLDER MASK DEFINED (NSMD) PACKAGE WEIGHT : 0.65g JEDEC REFERENCE : MO-216 / DESIGN 4.6C...
  • Page 26 Document History Page Document Title: CY7C1510JV18/CY7C1525JV18/CY7C1512JV18/CY7C1514JV18, 72-Mbit QDR™-II SRAM 2-Word Burst Architecture Document Number: 001-14435 ISSUE ORIG. OF REV. ECN NO. DATE CHANGE 1060980 See ECN 1397384 See ECN 1462588 See ECN VKN/AESA Converted from preliminary to final 2189567 See ECN VKN/AESA Minor Change-Moved to the external web ©...

This manual is also suitable for:

Cy7c1512jv18Cy7c1514jv18Cy7c1525jv18

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