Cypress Semiconductor CY7C1511JV18 Specification Sheet

72-mbit qdr-ii sram 4-word burst architecture

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Features
Separate independent read and write data ports
Supports concurrent transactions
300 MHz clock for high bandwidth
4-word burst for reducing address bus frequency
Double Data Rate (DDR) interfaces on both read and write ports
(data transferred at 600 MHz) at 300 MHz
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Single multiplexed address input bus latches address inputs
for read and write ports
Separate port selects for depth expansion
Synchronous internally self-timed writes
QDR-II operates with 1.5 cycle read latency when the Delay
Lock Loop (DLL) is enabled
Operates like a QDR-I device with 1 cycle read latency in DLL
off mode
Available in x8, x9, x18, and x36 configurations
Full data coherency, providing most current data
Core V
= 1.8 (± 0.1V); IO V
DD
Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
Variable drive HSTL output buffers
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Selection Guide
Maximum Operating Frequency
Maximum Operating Current
Cypress Semiconductor Corporation
Document Number: 001-12560 Rev. *C
= 1.4V to V
DDQ
DD
Description
198 Champion Court
CY7C1511JV18, CY7C1526JV18
CY7C1513JV18, CY7C1515JV18
72-Mbit QDR™-II SRAM 4-Word
Configurations
CY7C1511JV18 – 8M x 8
CY7C1526JV18 – 8M x 9
CY7C1513JV18 – 4M x 18
CY7C1515JV18 – 2M x 36

Functional Description

The CY7C1511JV18, CY7C1526JV18, CY7C1513JV18, and
CY7C1515JV18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR-II architecture. QDR-II architecture consists
of two separate ports: the read port and the write port to access
the memory array. The read port has dedicated data outputs to
support read operations and the write port has dedicated data
inputs to support write operations. QDR-II architecture has
separate data inputs and data outputs to completely eliminate
the need to "turn-around" the data bus that exists with common
IO devices. Each port can be accessed through a common
address bus. Addresses for read and write addresses are
latched on alternate rising edges of the input (K) clock. Accesses
to the QDR-II read and write ports are completely independent
of one another. To maximize data throughput, both read and write
ports are equipped with DDR interfaces. Each address location
is associated with four 8-bit words (CY7C1511JV18), 9-bit words
(CY7C1526JV18), 18-bit words (CY7C1513JV18), or 36-bit
words (CY7C1515JV18) that burst sequentially into or out of the
device. Because data can be transferred into and out of the
device on every rising edge of both input clocks (K and K and C
and C), memory bandwidth is maximized while simplifying
system design by eliminating bus "turn-arounds".
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
300 MHz
x8
x9
x18
x36
,
San Jose
CA 95134-1709
Burst Architecture
Unit
300
MHz
1090
mA
1090
1115
1140
408-943-2600
Revised March 10, 2008
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Summary of Contents for Cypress Semiconductor CY7C1511JV18

  • Page 1: Functional Description

    To maximize data throughput, both read and write ports are equipped with DDR interfaces. Each address location is associated with four 8-bit words (CY7C1511JV18), 9-bit words (CY7C1526JV18), 18-bit words (CY7C1513JV18), or 36-bit words (CY7C1515JV18) that burst sequentially into or out of the device.
  • Page 2 Logic Block Diagram (CY7C1511JV18) [7:0] Address (20:0) Register Gen. DOFF Control Logic [1:0] Logic Block Diagram (CY7C1526JV18) [8:0] Address (20:0) Register Gen. DOFF Control Logic Document Number: 001-12560 Rev. *C CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 Write Write Write Write Address Register...
  • Page 3 Control Logic [1:0] Logic Block Diagram (CY7C1515JV18) [35:0] Address (18:0) Register Gen. DOFF Control Logic [3:0] Document Number: 001-12560 Rev. *C CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 Write Write Write Write Address Register Control Logic Read Data Reg. Reg. Reg. Reg. Write...
  • Page 4: Pin Configuration

    Pin Configuration The pin configuration for CY7C1511JV18, CY7C1513JV18, and CY7C1515JV18 follow. DOFF DOFF Note 1. NC/144M and NC/288M are not connected to the die and can be tied to any voltage level. Document Number: 001-12560 Rev. *C CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 165-Ball FBGA (15 x 17 x 1.4 mm) Pinout...
  • Page 5 Pin Configuration The pin configuration for CY7C1511JV18, CY7C1513JV18, and CY7C1515JV18 follow. NC/144M DOFF NC/288M DOFF Document Number: 001-12560 Rev. *C CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 165-Ball FBGA (15 x 17 x 1.4 mm) Pinout CY7C1513JV18 (4M x 18) NC/288M CY7C1515JV18 (2M x 36)
  • Page 6: Pin Definitions

    Internally, the device is organized as 8M x 8 (4 arrays each of 2M x 8) for CY7C1511JV18, 8M x 9 (4 arrays each of 2M x 9) for CY7C1526JV18, 4M x 18 (4 arrays each of 1M x 18) for CY7C1513JV18 and 2M x 36 (4 arrays each of 512K x 36) for CY7C1515JV18.
  • Page 7 Power Supply Power Supply Inputs to the Core of the Device. Ground Ground for the Device. Power Supply Power Supply Inputs for the Outputs of the Device. Document Number: 001-12560 Rev. *C CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 Pin Description Switching Characteristics on page 23.
  • Page 8: Functional Overview

    Single Clock Mode The CY7C1511JV18 can be used with a single clock that controls both the input and output registers. In this mode the device recognizes only a single pair of input clocks (K and K) that control both the input and output registers.
  • Page 9 All pending transactions (read and write) are completed before the device is deselected. Document Number: 001-12560 Rev. *C CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 Programmable Impedance An external resistor, RQ, must be connected between the ZQ pin...
  • Page 10: Application Example

    ASIC) Source K# Delayed K Delayed K# R = 50ohms Truth Table The truth table for CY7C1511JV18, CY7C1526JV18, CY7C1513JV18, and CY7C1515JV18 follows. Operation RPS WPS Write Cycle: Load address on the rising edge of K; input write data on two consecutive K and K rising edges.
  • Page 11 Write Cycle Descriptions The write cycle description table for CY7C1511JV18 and CY7C1513JV18 follows. L–H – During the data portion of a write sequence: CY7C1511JV18 − both nibbles (D CY7C1513JV18 − both bytes (D – L-H During the data portion of a write sequence: CY7C1511JV18 −...
  • Page 12 L–H – L–H – L–H – Document Number: 001-12560 Rev. *C CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 [2, 10] Comments – During the Data portion of a write sequence, all four bytes (D the device. L–H During the Data portion of a write sequence, all four bytes (D the device.
  • Page 13 TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK. Document Number: 001-12560 Rev. *C CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 Instruction Register Three-bit instructions can be serially loaded into the instruction register.
  • Page 14 TAP into the Shift-DR state. This places the boundary scan register between the TDI and TDO pins. Document Number: 001-12560 Rev. *C CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 PRELOAD places an initial data pattern at the latched parallel outputs of the boundary scan register cells before the selection of another boundary scan test operation.
  • Page 15: Tap Controller State Diagram

    The state diagram for the TAP controller follows. TEST-LOGIC RESET TEST-LOGIC/ IDLE Note 11. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document Number: 001-12560 Rev. *C CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 [11] SELECT DR-SCAN CAPTURE-DR SHIFT-DR EXIT1-DR...
  • Page 16 12. These characteristics pertain to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in the 13. Overshoot: V (AC) < V + 0.85V (Pulse width less than t 14. All Voltage referenced to Ground. Document Number: 001-12560 Rev. *C CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 Bypass Register Instruction Register Identification Register Boundary Scan Register...
  • Page 17 16. Test conditions are specified using the load in TAP AC Test Conditions. t Document Number: 001-12560 Rev. *C CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 Description [16] Figure 2.
  • Page 18: Instruction Codes

    RESERVED Do Not Use: This instruction is reserved for future use. BYPASS Places the bypass register between TDI and TDO. This operation does not affect SRAM operation. Document Number: 001-12560 Rev. *C CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 Value CY7C1526JV18 CY7C1513JV18 00000110100...
  • Page 19 Boundary Scan Order Bit # Bump ID Bit # Document Number: 001-12560 Rev. *C CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 Bump ID Bit # Bump ID Bit # Bump ID Internal Page 19 of 27 [+] Feedback...
  • Page 20 Power Up Waveforms Unstable Clock Clock Start (Clock Starts after DOFF Document Number: 001-12560 Rev. *C CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 DLL Constraints ■ DLL uses K clock as its synchronizing input. The input must have low phase jitter, which is specified as t ■...
  • Page 21: Maximum Ratings

    20. V (min) = 0.68V or 0.46V , whichever is larger, V Document Number: 001-12560 Rev. *C CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 Current into Outputs (LOW) ... 20 mA Static Discharge Voltage (MIL-STD-883, M. 3015).. > 2001V Latch-up Current ... > 200 mA...
  • Page 22: Thermal Resistance

    21. Unless otherwise noted, test conditions are based on signal transition time of 2V/ns, timing reference levels of 0.75V, Vref = 0.75V, RQ = 250Ω, V pulse levels of 0.25V to 1.25V, and output loading of the specified I Document Number: 001-12560 Rev. *C CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 Test Conditions = 25°C, f = 1 MHz, V...
  • Page 23: Switching Characteristics

    24. t , are specified with a load capacitance of 5 pF as in (b) of 25. At any voltage and temperature t is less than t Document Number: 001-12560 Rev. *C CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 Description [22] [23] [24, 25]...
  • Page 24: Switching Waveforms

    28. In this example, if address A2 = A1, then data Q20 = D10 and Q21 = D11. Write data is forwarded immediately as read results. This note applies to the whole diagram. Document Number: 001-12560 Rev. *C CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18...
  • Page 25: Ordering Information

    CY7C1515JV18-300BZI CY7C1511JV18-300BZXI CY7C1526JV18-300BZXI CY7C1513JV18-300BZXI CY7C1515JV18-300BZXI Document Number: 001-12560 Rev. *C CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 Package Diagram Package Type 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
  • Page 26: Package Diagram

    CY7C1511JV18, CY7C1526JV18 CY7C1513JV18, CY7C1515JV18 Package Diagram Figure 4. 165-ball FBGA (15 x 17 x 1.40 mm), 51-85195 51-85195-*A Document Number: 001-12560 Rev. *C Page 26 of 27 [+] Feedback...
  • Page 27 Document History Page Document Title: CY7C1511JV18/CY7C1526JV18/CY7C1513JV18/CY7C1515JV18, 72-Mbit QDR™-II SRAM 4-Word Burst Architecture Document Number: 001-12560 ISSUE ORIG. OF REV. ECN NO. DATE CHANGE 808457 See ECN 1273951 See ECN 1462588 See ECN VKN/AESA Converted from preliminary to final 2189567 See ECN VKN/AESA Minor Change-Moved to the external web ©...

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Cy7c1515jv18Cy7c1513jv18Cy7c1526jv18

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