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Quectel EG800K-LA Hardware Design

Quectel EG800K-LA Hardware Design

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EG800K-LA
Hardware Design
LTE Standard Module Series
Version: 1.0.0
Date: 2024-05-23
Status: Preliminary

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  • Page 1 EG800K-LA Hardware Design LTE Standard Module Series Version: 1.0.0 Date: 2024-05-23 Status: Preliminary...

  • Page 2: Legal Notices

    LTE Standard Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233,...

  • Page 3: Third-Party Rights

    Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

  • Page 4: Safety Information

    Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions. Full attention must be paid to driving at all times in order to reduce the risk of an accident.

  • Page 5: About The Document

    LTE Standard Module Series About the Document Revision History Version Date Author Description Reuben WANG/ 2024-05-23 Kevin SU/ Creation of the document Yule DENG Reuben WANG/ 1.0.0 2024-05-23 Kevin SU/ Preliminary Yule DENG 4 / 69 EG800K-LA_Hardware_Design...

  • Page 6: Table Of Contents

    LTE Standard Module Series Contents Safety Information ................................ 3 About the Document ..............................4 Contents ..................................5 Table Index ..................................7 Figure Index ...................................8 Introduction ................................. 10 1.1. Special Mark ............................10 Product Overview ............................... 11 2.1. Frequency Bands and Functions ......................11 2.2.
  • Page 7 LTE Standard Module Series 4.7.3. MAIN_RI ............................40 RF Specifications ..............................42 5.1. LTE/Wi-Fi Scan Antenna Interface ......................42 5.1.1. Antenna Interface & Frequency Bands ..................42 5.1.2. Tx Power ............................43 5.1.3. Rx Sensitivity ..........................43 5.1.4. Reference Design .......................... 44 5.2.
  • Page 8 LTE Standard Module Series Table Index Table 1: Special Mark ..............................10 Table 2: Basic Information ............................11 Table 3: Frequency Bands and Functions ........................11 Table 4: Key Features ..............................12 Table 5: Parameter Definition ............................15 Table 6: Pin Description ...............................15 Table 7: Overview of Operating Modes ........................19...
  • Page 9 LTE Standard Module Series Figure Index Figure 1: Functional Diagram ......................错误！未定义书签。 Figure 2: Pin Assignment (Top View) ..........................14 Figure 3: Module Power Consumption in Sleep Mode ....................20 Figure 4: Block Diagram of UART Application in Sleep Mode ................. 21 Figure 5: Block Diagram of Application with USB Remote Wakeup Function in Sleep Mode .........22 Figure 6: Block Diagram of Application with MAIN_RI Function in Sleep Mode...
  • Page 10 LTE Standard Module Series Figure 42: Packaging Process ............................62 9 / 69 EG800K-LA_Hardware_Design...

  • Page 11: Introduction

    LTE Standard Module Series Introduction This document defines the EG800K-LA module and describes its air interface and hardware interfaces which are connected with your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module.

  • Page 12: Product Overview

    Product Overview The module is an SMD type module with compact packaging, which is engineered to meet the demands in M2M applications. Table 2: Basic Information EG800K-LA Packaging type Pin counts Dimensions (17.7 ±0.15) mm × (15.8 ±0.15) mm × (2.4 ±0.2) mm Weight Approx.

  • Page 13: Key Features

    Complies with I2C-bus specification  Interfaces* Supports two ADC interfaces Network Indication NET_STATUS: indicates network registration status Compliant with 3GPP TS 27.007, 3GPP TS 27.005 and Quectel enhanced AT AT Commands commands Main antenna/Wi-Fi Scan antenna interface (ANT_MAIN)  Antenna Interface 50 Ω...
  • Page 14 SMTPS* protocols are optional. PAP and CHAP for PPP connections are optional. For more details, please contact Quectel Technical Support. Within this range, the module’s indicators comply with 3GPP specification requirements. Within this range, the module retains the ability to establish and maintain functions such as SMS*, data transmission, without any unrecoverable malfunction.

  • Page 15: Pin Assignment

    LTE Standard Module Series 2.3. Pin Assignment Figure 1: Pin Assignment (Top View) NOTE Keep all RESERVED pins and unused pins open. Connect all GND pins to the ground. Do not pull USB_BOOT to low level before the module starts up successfully. Ensure that there is a complete reference ground plane under the module, and the plane shall be placed as close to the module layer as possible.

  • Page 16: Pin Description

    LTE Standard Module Series The 6.0 and above version QFlash tool must be used for firmware upgrading. 2.4. Pin Description Table 5: Parameter Definition Parameters Descriptions Analog Input Analog Input/Output Analog Output Digital Input Digital Input/Output Digital Output Open Drain Power Input Power Output DC characteristics include power domain and rated current.
  • Page 17 LTE Standard Module Series 1, 10, 27, 34, 36, 37, 40, 41, 45–48, 70–73, 88–95 Power Supply Output Pin Name Pin No. Description Comment Characteristics Power supply for external GPIO’s pull- Provide 1.8 V for Vnom = 1.8 V up circuits. VDD_EXT external circuit max = 50 mA...
  • Page 18 LTE Standard Module Series Vmax = 5.25 V USB connection A test point must be USB_VBUS Vmin = 3.0 V detect reserved. Vnom = 5.0 V USIM Interface Pin Name Pin No. Description Comment Characteristics USIM_DATA USIM card data USIM_RST USIM card reset USIM_CLK USIM card clock...
  • Page 19 LTE Standard Module Series Connect to the MCU’s Request to send MAIN_RTS RTS. signal to the module If unused, keep it open. Debug UART Pin Name Pin No. Description Comment Characteristics Debug UART DBG_RXD receive Test points must be 1.8 V reserved.

  • Page 20: Operating Characteristics

    LTE Standard Module Series RESERVED Pins Pin Name Pin No. Comment 2–6, 8, 26, 30–33, 44, 49–58, 62–65, 68, 69, 74–78, 80, 81, 83–87, RESERVED Keep them open. 97–109 NOTE 1. Keep all RESERVED pins and unused pins open. Connect all GND pins to the ground. 2.

  • Page 21: Sleep Mode

    LTE Standard Module Series For more details about AT+CFUN, see document [2]. 3.2. Sleep Mode In sleep mode, power consumption of the module can be reduced to an ultra-low level. The following sub-chapters describe how to let the module enter sleep mode. Figure 2: Module Power Consumption in Sleep Mode NOTE DRX cycle values are transmitted over the wireless network.

  • Page 22: Usb Application Scenario

    LTE Standard Module Series Figure 3: Block Diagram of UART Application in Sleep Mode You can wake up the module by driving MAIN_DTR low by the MCU.  When the module has a URC to report, MAIN_RI signal will wake up the MCU. See Chapter 4.7.3 for details ...

  • Page 23: Usb Application With Usb Suspend/Resume And Ri Function

    LTE Standard Module Series Figure 4: Block Diagram of Application with USB Remote Wakeup Function in Sleep Mode Sending data to the module through USB will wake up the module.  When the module has a URC to report, the module will send remote wake-up signals through USB bus to ...

  • Page 24: Usb Application Without Usb Suspend Function

    LTE Standard Module Series 3.2.2.3. USB Application without USB Suspend Function If the host does not support USB Suspend function, the following three preconditions must be met to let the module enter sleep mode: Execute AT+QSCLK=1.  Drive MAIN_DTR to high level or keep it open. ...

  • Page 25: Power Supply

    LTE Standard Module Series AT+CFUN=<fun> provides choices of the functionality level through setting <fun> into 0, 1 or 4.  AT+CFUN=0: Minimum functionality (disable RF function and USIM function).  AT+CFUN=1: Full functionality (default).  AT+CFUN=4: Airplane mode (disable RF function). NOTE For more details about AT commands, see document [2].

  • Page 26: Power Supply Voltage Detection

    LTE Standard Module Series Figure 7: Reference Design of Power Input  NOTE To avoid corrupting internal flash, do not cut off the power supply when the module works normally. Only after shutting down the module with PWRKEY or AT command can you cut off the power supply. 3.4.3.

  • Page 27: Turn-On

    LTE Standard Module Series Figure 8: Reference Design of Power Supply 3.5. Turn-on 3.5.1. Turn-on with PWRKEY Table 9: Pin Description of PWRKEY Pin Name Pin No. Description Comment Pull down PWRKEY for at least 700 ms to PWRKEY Turn on/off the module turn on/off the module.
  • Page 28 LTE Standard Module Series strike may be generated from finger. Therefore, a TVS should be placed near the push button for ESD protection. Figure 10: Reference Design of Turn-on with a Button Figure 11: Timing of Turn-on with PWRKEY NOTE 27 / 69 EG800K-LA_Hardware_Design...

  • Page 29: Turn-Off

    LTE Standard Module Series 1. Ensure that VBAT is stable for at least 30 ms before driving the PWRKEY low. 2. If the module needs to turn on automatically but does not need power-off function, PWRKEY can be driven low directly to ground with a recommended 1 kΩ resistor. 3.6.

  • Page 30: Reset

    LTE Standard Module Series 3.7. Reset Drive RESET_N low for at least 300 ms and then release it can reset the module. RESET_N signal is sensitive to interference, so it is recommended to route the trace as short as possible and surround it with ground. Table 10: Pin Description of RESET_N Pin Name Pin No.
  • Page 31 LTE Standard Module Series Figure 14: Reference Design of Reset with a Button Figure 15: Timing of Reset NOTE 1. Use RESET_N only when you fail to turn off the module with the AT+QPOWD and PWRKEY. 2. Ensure the capacitance on PWRKEY and RESET_N does not exceed 10 nF. 30 / 69 EG800K-LA_Hardware_Design...

  • Page 32: Application Interfaces

    LTE Standard Module Series Application Interfaces 4.1. USB Interface The module provides one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specifications and supports High-Speed (480 Mbps) and Full-Speed (12 Mbps) on USB 2.0. The USB interface can be used for AT command communication, data transmission, software debugging and firmware upgrade.

  • Page 33: Usb_Boot Interface

    LTE Standard Module Series These resistors are not mounted by default. To ensure the signal integrity of USB 2.0 data transmission, L1, R1 and R2 should be placed close to the module, and resistors should be placed close to each other. Extra stubs of trace should be kept as short as possible.
  • Page 34 LTE Standard Module Series Figure 17: Reference Design of USB_BOOT Figure 18: Timing of Entering Forced Download Mode NOTE 1. Ensure that VBAT is stable before driving PWRKEY low. The time period between powering VBAT up and driving PWRKEY low should be not less than 30 ms. 2.

  • Page 35: Usim Interface

    LTE Standard Module Series 4. The 6.0 and above version QFlash tool must be used for firmware upgrading. 4.3. USIM Interface The USIM interface meet ETSI and IMT-2000 requirements. Either 1.8 V or 3.0 V USIM card is supported. Table 13: Pin Description of USIM Interface Pin Name Pin No.

  • Page 36: Uart

    LTE Standard Module Series Figure 20: Reference Design of USIM Interface with a 6-pin USIM Card Connector To enhance the reliability and availability of the USIM card in applications, you should follow the principles below in the USIM circuit design: Place USIM card connector close to the module.
  • Page 37 LTE Standard Module Series The module provides three UARTs. Table 14: Information of UARTs UART Types Supported Baud Rates (bps) Default Baud Rates (bps) Functions Data transmission and 4800, 9600, 19200, 38400, 57600, Main UART 115200 AT command 115200, 230400, 460800, 921600 communication Debug UART 115200...
  • Page 38 LTE Standard Module Series Figure 21: Reference Design of UART with a Voltage-level Translator Another example of level-shifting circuit is shown as below. Refer to the solid line for input/output circuit design in the dotted line below, but remember to follow the input/output sequence from or towards the module. Figure 22: Reference Design of UART Interface with Transistor Circuit NOTE 1.

  • Page 39: I2C Interface

    LTE Standard Module Series 3. To increase the stability of UART communication, it is recommended to add UART hardware flow control design. 4.5. I2C Interface* The module provides one I2C interface: Table 16: Pin Description of I2C Interface Pin Name Pin No.

  • Page 40: Indication Signal

    LTE Standard Module Series ADC0 voltage range ADC1 voltage range ADC resolution bits NOTE A voltage divider with resistance of more than 100 kΩ must be used for ADC interface application. The accuracy of the two resistors in each voltage divider affects the sampling error of the ADC. It is recommended to use resistors with an accuracy of 1 %;...

  • Page 41: Status

    LTE Standard Module Series Figure 23: Reference Design of Network Status Indication 4.7.2. STATUS STATUS indicates the module’s operation status. It will output high level when module is turned on successfully. Figure 24: Reference Design of STATUS 4.7.3. MAIN_RI AT+QCFG="risignaltype", "physical" can be used to configure the indication behavior for MAIN_RI. No matter on which port (main UART, USB AT port or USB modem port) a URC is presented, the URC will trigger the behavior of MAIN_RI.
  • Page 42 LTE Standard Module Series MAIN_RI behaviors can be configured flexibly, and default behaviors are shown as below: Table 21: MAIN_RI Level Status and Module Status Module Status MAIN_RI Level Status Idle High level MAIN_RI outputs at least 120 ms low level. After the module outputs the When a new URC return data, the level status will then become high.

  • Page 43: Rf Specifications

    LTE Standard Module Series RF Specifications Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products.

  • Page 44: Tx Power

    LTE Standard Module Series LTE-FDD B28 703–748 758–803 LTE-FDD B66 1710-1779.9 2110-2179.9 5.1.2. Tx Power Table 24: RF Transmitting Power Frequency Max. Min. LTE-FDD 23 dBm ±2 dB < -39 dBm B2/B3/B4/B5/B7/B8/B28/B66 5.1.3. Rx Sensitivity Table 25: Conducted RF Receiving Sensitivity (Unit: dBm) 3GPP Receiving Sensitivity (Typ.) Frequency...

  • Page 45: Reference Design

    LTE Standard Module Series 5.1.4. Reference Design Use a π-type matching circuit for all the antenna interfaces for better cellular performance. Capacitors are not mounted by default. Figure 25: Reference Design of LTE/Wi-Fi Scan Antenna NOTE To reduce the coexistence problems and avoid the interference of receiving sensitivity, make sure that the isolation between antennas is not less than 20 dB.
  • Page 46 LTE Standard Module Series Figure 27: Coplanar Waveguide Design on a 2-layer PCB Figure 28: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 29: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design: Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω.

  • Page 47: Requirements For Antenna Design

    LTE Standard Module Series The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces  and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be at least twice the width of RF signal traces (2 × W). Keep RF traces away from interference sources (such as DC-DC, (U)SIM/USB/SDIO high frequency digital ...
  • Page 48 LTE Standard Module Series Figure 30: Dimensions of the Receptacle (Unit: mm) U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector. Figure 31: Specifications of Mated Plugs (Unit: mm) The following figure describes the space factor of the mated connectors. 47 / 69 EG800K-LA_Hardware_Design...
  • Page 49 LTE Standard Module Series Figure 32: Space Factor of the Mated Connectors (Unit: mm) For more details, visit http://www.hirose.com. 48 / 69 EG800K-LA_Hardware_Design...

  • Page 50: Electrical Characteristics & Reliability

    LTE Standard Module Series Electrical Characteristics & Reliability 6.1. Absolute Maximum Ratings Table 27: Absolute Maximum Ratings Parameters Min. Max. Unit Voltage at VBAT -0.3 Voltage at USB_VBUS -0.3 Voltage at digital pins -0.3 Voltage at ADC0 Voltage at ADC1 Current at VBAT 6.2.

  • Page 51: Power Consumption

    LTE Standard Module Series 6.3. Power Consumption Table 29: Power Consumption Modes Conditions Typ. Units OFF state Power down 6.61 μA AT+CFUN=0 (USB disconnected) 0.52 AT+CFUN=4 (USB disconnected) 0.59 LTE-FDD @ PF = 32 (USB disconnected) 1.06 Sleep state LTE-FDD @ PF = 64 (USB disconnected) 0.76 LTE-FDD @ PF = 64 (USB Suspend) 0.95...

  • Page 52: Digital I/O Characteristics

    LTE Standard Module Series 6.4. Digital I/O Characteristics Table 30: 1.8 V I/O Characteristics (Unit: V) Parameters Descriptions Min. Max. High-level input voltage 0.7 × VDDIO VDDIO + 0.2 Low-level input voltage -0.3 0.3 × VDDIO High-level output voltage VDDIO - 0.2 Low-level output voltage Table 31: USIM Low-voltage I/O Characteristics (Unit: V) Parameters...

  • Page 53: Esd Protection

    LTE Standard Module Series 6.5. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design.

  • Page 54: Mechanical Information

    LTE Standard Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 33: Module Top and Side Dimensions 53 / 69 EG800K-LA_Hardware_Design...
  • Page 55 LTE Standard Module Series Figure 34: Module Bottom Dimensions (Bottom View) NOTE The package warpage level of the module refers to the JEITA ED-7306 standard. 54 / 69 EG800K-LA_Hardware_Design...

  • Page 56: Recommended Footprint

    LTE Standard Module Series 7.2. Recommended Footprint Figure 35: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. 55 / 69 EG800K-LA_Hardware_Design...

  • Page 57: Top And Bottom Views

    Figure 36: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. 56 / 69 EG800K-LA_Hardware_Design...

  • Page 58: Storage, Manufacturing And Packaging

    LTE Standard Module Series Storage, Manufacturing and Packaging 8.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity should be 35– 60 %.

  • Page 59: Manufacturing And Soldering

    LTE Standard Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
  • Page 60 RoHS compliant and their mercury content is below 1000 ppm (0.1 %). 7. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [6].

  • Page 61: Packaging Specification

    LTE Standard Module Series 8.3. Packaging Specification This chapter outlines the key packaging parameters and processes. All figures below are for reference purposes only, as the actual appearance and structure of packaging materials may vary in delivery. The modules are packed in a tape and reel packaging as specified in the sub-chapters below. 8.3.1.

  • Page 62: Plastic Reel

    LTE Standard Module Series 8.3.2. Plastic Reel Plastic reel dimensions are illustrated in the following figure and table: Figure 39: Plastic Reel Dimension Drawing Table 37: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 32.5 8.3.3. Mounting Direction Figure 40: Mounting Direction 61 / 69 EG800K-LA_Hardware_Design...

  • Page 63: Packaging Process

    LTE Standard Module Series 8.3.4. Packaging Process Place the modules onto the carrier tape cavity and cover them securely with cover tape. Wind the heat-sealed carrier tape onto a plastic reel and apply a protective tape for additional protection. 1 plastic reel can pack 500 modules. Place the packaged plastic reel, humidity indicator card and desiccant bag into a vacuum bag, and vacuumize it.

  • Page 64: Appendix References

    LTE Standard Module Series Appendix References Table 38: Related Documents Document Name [1] Quectel_UMTS&LTE_EVB_User_Guide [2] Quectel_LTE_Standard(A)_Series_AT_Commands_Manual [3] Quectel_EC800K&EG800K_Series_Reference_Design [4] Quectel_RF_Layout_Application_Note [5] Quectel_Module_Stencil_Design_Requirements [6] Quectel_Module_SMT_Application_Note Table 39: Terms and Abbreviations Abbreviation Description 3GPP 3rd Generation Partnership Project Adaptive Multi-Rate Bits per second CHAP Challenge Handshake Authentication Protocol CMUX...
  • Page 65 LTE Standard Module Series Evaluation Board Frequency Division Duplexing FILE File Protocol File Transfer Protocol FTPS FTP over SSL Ground HTTP Hypertext Transfer Protocol HTTPS Hypertext Transfer Protocol Secure IP Multimedia Subsystem Inertial Measurement Unit Leadless Chip Carrier (package) Low-dropout Regulator Light Emitting Diode Land Grid Array Long Term Evolution...
  • Page 66 LTE Standard Module Series Printed Circuit Board Pulse Code Modulation Protocol Data Unit Paging Frame PING Packet Internet Groper Power Management Unit Point-to-Point Protocol Random Access Memory Radio Frequency RoHS Restriction of Hazardous Substances Request To Send Surface Mount Device Short Message Service SMTP Simple Mail Transfer Protocol...
  • Page 67 Notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID XMR2024EG800KLA procedure followed by a Class II permissive change application.

  • Page 68: Antenna Installation

    LTE Standard Module Series Antenna Installation (1) The antenna must be installed such that 20 cm is maintained between the antenna and users, (2) The transmitter module may not be co-located with any other transmitter or antenna. (3) Only antennas of the same type and with equal or less gains as shown below may be used with this module.
  • Page 69 LTE Standard Module Series Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules FCC part 22, part 24, part 27 2.3 Specific operational use conditions The module can be used for mobile applications with a maximum 3.0dBi antenna. The host manufacturer installing this module into their product must ensure that the final compos it product complies with the FCC requirements by a technical assessment or evaluation to the FCC rules, including the transmitter operation.
  • Page 70 LTE Standard Module Series multiple simultaneously transmitting modules or other transmitters in a host product. Only when all the test results of test modes comply with FCC requirements, then the end product can be sold legally. 2.10 Additional testing, Part 15 Subpart B disclaimer The modular transmitter is only FCC authorized for FCC Part 22, Part24, Part27 and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification.

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