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Quectel EG915N Series Hardware Design

Quectel EG915N Series Hardware Design

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EG915N Series
Hardware Design
LTE Standard Module Series
Version: 1.1.0
Date: 2022-07-27
Status: Preliminary

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Summary of Contents for Quectel EG915N Series

  • Page 1 EG915N Series Hardware Design LTE Standard Module Series Version: 1.1.0 Date: 2022-07-27 Status: Preliminary...
  • Page 2 LTE Standard Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...
  • Page 3 Privacy Policy To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    LTE Standard Module Series About the Document Revision History Version Date Author Description Shihao HUANG/ 2021-11-19 Creation of the document Jeff SHEN Shihao HUANG/ 2022-02-25 First official release Jeff SHEN Preliminary: 1. Add information about EG915N-LA module. 2. Updated USB serial drivers from Linux 2.6–5.15 to Shihao HUANG/ 1.1.0 2022-07-27...

  • Page 6: Table Of Contents

    LTE Standard Module Series Contents Safety Information ............................ 3 About the Document ..........................4 Contents ..............................5 Table Index ............................... 8 Figure Index ............................10 Introduction ............................. 12 1.1. Special Mark ......................... 14 Product Overview ..........................15 2.1. Frequency Bands and Functions ..................15 2.2.
  • Page 7 LTE Standard Module Series 3.12.2. Microphone Interface Design ..................46 3.12.3. Earpiece and Loudspeaker Interface Design ............... 46 3.13. PCM and I2C Interfaces ......................47 3.14. Network Status Indication ...................... 49 3.15. USB_BOOT .......................... 50 3.16. STATUS ..........................52 3.17. ADC Interfaces ........................
  • Page 8 LTE Standard Module Series 8.3.1. Carrier Tape ......................... 84 8.3.2. Plastic Reel ........................85 8.3.3. Packaging Process ...................... 86 Appendix References ........................87 EG915N_Series_Hardware_Design 7 / 92...
  • Page 9 LTE Standard Module Series Table Index Table 1: Special Mark ..........................14 Table 2: Frequency Bands of EG915N-EU ....................15 Table 3: Frequency Bands of EG915N-LA ....................15 Table 4: Key Features ..........................16 Table 5: I/O Parameters Definition ......................21 Table 6: Pin Description ........................
  • Page 10 LTE Standard Module Series Table 42: Electrostatics Discharge Characteristics (25 º C, 45 % Relative Humidity) ....... 75 Table 43: EG915N-EU RF Output Power ....................79 Table 44: EG915N-LA RF Output Power ....................79 Table 45: Recommended Thermal Profile Parameters ................83 Table 46: Carrier Tape Dimension Table (Unit: mm) ................
  • Page 11 LTE Standard Module Series Figure Index Figure 2: Pin Assignment (Top View) ....................... 20 Figure 3: Sleep Mode Application via UART .................... 27 Figure 4: Sleep Mode Application with USB Remote Wakeup ..............28 Figure 5: Sleep Mode Application with MAIN_RI ..................29 Figure 6: Sleep Mode Application without Suspend Function ..............
  • Page 12 LTE Standard Module Series Figure 43: Bottom Dimensions (Bottom View) ..................77 Figure 44: Recommended Footprint (Top View) ..................78 Figure 45: Top View and Bottom View of the Module ................80 Figure 46: Recommended Reflow Soldering Thermal Profile ..............82 Figure 47: Carrier Tape Dimension Drawing ..................

  • Page 13: Introduction

    LTE Standard Module Series Introduction This document defines the EG915N series module and describes its air interface and hardware interfaces which are connected with your applications. This document can help you quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module.
  • Page 14 LTE Standard Module Series Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

  • Page 15: Special Mark

    LTE Standard Module Series 1.1. Special Mark Table 1: Special Mark Mark Definition Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported;...

  • Page 16: Product Overview

    GNSS (Optional) GPS/GLONASS/Galileo/BDS/QZSS/SBAS EG915N series module is an SMD type module with 126 LGA pins. With a compact profile of 23.6 mm × 19.9 mm × 2.4 mm, The module can meet most of the requirements for M2M applications such as automation, metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc.

  • Page 17: Key Features

    LTE Standard Module Series 2.2. Key Features The following table describes the detailed features of the module. Table 4: Key Features Features Details  Supply voltage: 3.4–4.5 V Power Supply  Typical supply voltage: 3.8 V  Class 4 (33 dBm ± 2 dB) for GSM850 ...
  • Page 18 Storage temperature range: -40 ° C to +90 ° C Firmware Upgrade Via USB interface or DFOTA GNSS function is optional for EG915N series module. Only the module with built-in GNSS function can support GNSS positioning technology. Within operating temperature range, the module is 3GPP compliant.

  • Page 19: Evb Kit

    All hardware components are fully compliant with EU RoHS directive 2.3. EVB Kit To help you develop applications with the module, Quectel provides an evaluation board (UMTS & LTE EVB), USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module.

  • Page 20: Application Interfaces

    LTE Standard Module Series Application Interfaces 3.1. General Description The module is equipped with 126 LGA pins that can be connected to cellular application platform. The subsequent chapters will provide detailed descriptions of the following interfaces.  Power supply  (U)SIM interfaces ...

  • Page 21: Pin Assignment

    LTE Standard Module Series 3.2. Pin Assignment The following figure shows the pin assignment of the module. SLEEP_IND ANT_GNSS ADC1 RESERVED RESERVED RESERVED RESERVED USIM1_GND PCM_CLK USIM1_CLK RESERVED RESERVED RESERVED RESERVED RESERVED PCM_SYNC USIM1_DATA USIM2_DET RESERVED RESERVED PCM_DIN RESERVED USIM1_RST PCM_DOUT USIM1_VDD RESERVED...

  • Page 22: Pin Description

    LTE Standard Module Series 3.3. Pin Description The following tables show the pin definition and description of the module. Table 5: I/O Parameters Definition Type Description Analog Input Analog Input/Output Analog Output Digital Input Digital Input/Output Digital Output Open Drain Power Input Power Output Table 6: Pin Description...
  • Page 23 LTE Standard Module Series Power supply for external GPIO’s Provide 1.8 V for Vnom = 1.8 V VDD_EXT pull-up circuits. external circuit max = 50 mA If unused, keep it open. Turn On/Off Pin Name Description DC Characteristics Comment PWRKEY Turn on/off the module VBAT power domain.
  • Page 24 LTE Standard Module Series supply 1.8/3.0 V (U)SIM card is supported and can be identified automatically by the module. USIM1_RST (U)SIM1 card reset USIM1_VDD USIM1_DATA (U)SIM1 card data 1.8/3.0 V USIM1_CLK (U)SIM1 card clock Specified ground for Connect to main USIM1_GND (U)SIM1 GND of PCB.
  • Page 25 LTE Standard Module Series Main UART data MAIN_DCD carrier detect If unused, keep them open. Main UART ring MAIN_RI indication Auxiliary UART Interface* Pin Name Description DC Characteristics Comment Connect to DTE’s DTE request to send RTS. AUX_RTS signal to DCE If unused, keep it open.
  • Page 26 LTE Standard Module Series PCM_DIN PCM data input PCM_DOUT PCM data output An external 1.8 V I2C_SCL I2C serial clock pull-up resistor is required. I2C_SDA I2C serial data If unused, keep them open. Analog Audio Interfaces Pin Name Description DC Characteristics Comment Bias voltage output for MICBIAS...

  • Page 27: Operating Modes

    LTE Standard Module Series Application processor open. AP_READY ready Pull-up by default. In low voltage level, module can enter W_DISABLE# Airplane mode control airplane mode. If unused, keep it open. Force the module into Active high. USB_BOOT emergency download It is recommended to mode reserve test points.

  • Page 28: Power Saving

    LTE Standard Module Series AT+CFUN=4 or W_DISABLE# pin can set the module to airplane mode. In this case, Airplane Mode RF function will be invalid. In this mode, the current consumption of the module is reduced to the minimal level. Sleep Mode During this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally.

  • Page 29: Usb Application With Usb Remote Wakeup Function

    LTE Standard Module Series  Drive MAIN_DTR low by host will wake up the module.  When the module have a URC to report, the URC will trigger the behavior of MAIN_RI pin. See Chapter 3.18 for details about MAIN_RI behaviors. 3.5.1.2.

  • Page 30: Usb Application Without Usb Suspend Function

    LTE Standard Module Series Figure 4: Sleep Mode Application with MAIN_RI  Sending data to the module through USB will wake up the module.  When the module has a URC to report, the URC will trigger the behavior of MAIN_RI pin. See Chapter 3.18 for details about MAIN_RI behavior.

  • Page 31: Airplane Mode

    LTE Standard Module Series You can wake up the module by turning on the power switch to supply power to USB_VBUS. NOTE 1. Pay attention to the level match shown in dotted line between the module and the host in the circuit diagrams of Chapter 3.5.1.

  • Page 32: Power Supply

    LTE Standard Module Series 3.6. Power Supply 3.6.1. Power Supply Pins The module provides four VBAT pins dedicated to connecting with the external power supply. There are two separate voltage domains for VBAT.  Two VBAT_RF pins for module’s RF part ...

  • Page 33: Reference Design For Power Supply

    LTE Standard Module Series expanded to two sub paths with star configuration. The width of VBAT_BB trace should be no less than 1 mm; and the width of VBAT_RF trace should be no less than 2 mm. In principle, the longer the VBAT trace is, the wider it will be.

  • Page 34: Turn On And Turn Off

    LTE Standard Module Series MIC29302WU DC_IN VBAT 100K 330 Ω 4.7K 470 µF 100 nF 470 µF 100 nF VBAT_EN Figure 8: Reference Circuit of Power Supply 3.7. Turn On and Turn Off 3.7.1. Turn On with PWRKEY Table 9: Pin Description of PWRKEY Pin Name Pin No.
  • Page 35 LTE Standard Module Series Another way to control the PWRKEY is using a button directly. a TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the following figure. Figure 10: Reference Circuit of Turning on the Module with a Button The timing of turning on the module is illustrated in the following figure.

  • Page 36: Turn Off

    LTE Standard Module Series NOTE Make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time difference between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. PWRKEY can be pulled down directly to GND with a recommended 4.7 kΩ resistor if the module needs to be turned on automatically and shutdown is not needed.

  • Page 37: Reset

    LTE Standard Module Series NOTE To avoid corrupting the data in the internal flash, do not switch off the power supply when the module works normally. Only after the module is shut down with PWRKEY or AT command, the power supply can be cut off.
  • Page 38 LTE Standard Module Series RESET_N Close to S2 Figure 14: Reference Circuit of RESET_N with a Button The reset scenario is illustrated in the following figure. VBAT ≥ 300 ms ≥ 1.3 V RESET_N ≤ 0.5 V Module Running Baseband restart Baseband resetting Status Figure 15: Reset Timing...

  • Page 39: U)Sim Interfaces

    LTE Standard Module Series 3.9. (U)SIM Interfaces The module provides two (U)SIM interfaces, which meet ETSI and IMT-2000 requirements. Either 1.8 V or 3.0 V (U)SIM card is supported. The module supports Dual SIM Single Standby. Table 11: Pin Definition of (U)SIM Interfaces Pin Name Pin No.
  • Page 40 LTE Standard Module Series VDD_EXT USIM_VDD MAIN GND Connect to main GND of PCB 100 nF (U)SIM Card Connector USIM_GND USIM_VDD USIM_RST Module USIM_CLK Switch USIM_DET USIM_DATA 33 pF 33 pF 33 pF TVS array Figure 16: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If the function of (U)SIM card hot-plug is not needed, please keep USIM_DET disconnected.

  • Page 41: Usb Interface

    LTE Standard Module Series  Keep (U)SIM card signals away from RF and VBAT traces.  Make sure the ground between the module and the (U)SIM card connector is short and wide. Keep the trace width of ground and USIM_VDD not less than 0.5 mm to maintain the same electric potential.

  • Page 42: Uart Interfaces

    LTE Standard Module Series Test Points Minimize these stubs Module NM_0R NM_0R USB_VBUS ESD Array USB_DM USB_DM USB_DP USB_DP Close to Module Figure 18: Reference Circuit of USB Application A common mode choke L1 is recommended to be added in series between the module and MCU to suppress EMI spurious transmission.
  • Page 43 LTE Standard Module Series RTS and CTS hardware flow control.  Auxiliary UART* interface supports RTS and CTS hardware flow control.  Debug UART interface supports 115200 bps baud rate. It is used for partial log output. Table 13: Pin Definition of Main UART Interface Pin Name Pin No.
  • Page 44 LTE Standard Module Series Table 15: Pin Definition of Debug UART Interface Pin Name Pin No. Description Comment 1.8 V power domain. DBG_RXD Debug UART receive If unused, keep them DBG_TXD Debug UART transmit open. The module provides a 1.8 V UART interface. Use a voltage-level translator if the application is equipped with a 3.3 V UART interface.

  • Page 45: Analog Audio Interfaces

    LTE Standard Module Series 4.7K VDD_EXT VDD_EXT 1 nF Module MCU/ARM MAIN_RXD MAIN_TXD 1 nF VDD_EXT VDD_MCU 4.7K MAIN_RTS MAIN_CTS GPIO MAIN_DTR EINT MAIN_RI GPIO MAIN_DCD Figure 20: Reference Circuit with Transistor Circuit NOTE Transistor circuit solution is not suitable for applications with baud rates exceeding 460 kbps. Note that the module CTS is connected to the host CTS, and the module RTS is connected to the host RTS.

  • Page 46: Audio Interfaces Design Considerations

    LTE Standard Module Series drive external power amplifier devices if the output power rate cannot meet the demand. If unused, keep them open.  AI channels are differential input channels, which can be applied for input of microphone (usually an electret microphone is used).

  • Page 47: Microphone Interface Design

    LTE Standard Module Series 3.12.2. Microphone Interface Design The microphone channel reference circuit is shown in the following figure. Close to Close to Module Microphone MICBIAS 510R Module E SD P rotecti on Differential Component layout 10 pF 33 pF 2.2 µF 1.5K 100 nF...

  • Page 48: Pcm And I2C Interfaces

    LTE Standard Module Series Close to Loudspeaker Differential 10 pF 33 pF layout ESD Protection Component Amplifier circuit SPK_P 10 pF Module 33 pF SPK_N 10 pF 33 pF Protection Component Figure 23: Reference Circuit of External Audio Amplifier Output For differential input and output audio power amplifiers, please visit http://www.ti.com to obtain the required devices.
  • Page 49 LTE Standard Module Series  Long frame mode*: Module can only be used as the master device The module supports 16-bit linear encoding format. The following two figures are the short frame mode timing diagram (PCM_SYNC = 8 kHz, PCM_CLK = 2048 kHz) and the long frame mode timing diagram (PCM_SYNC = 8 kHz, PCM_CLK = 256 kHz).

  • Page 50: Network Status Indication

    LTE Standard Module Series In long frame mode, data is sampled on the falling edge of PCM_CLK，and sent on the rising edge. The rising edge of PCM_SYNC represents the high effective bit. In this mode, the PCM interface supports 256 kHz, 512 kHz, 1024 kHz and 2048 kHz PCM_CLK at 8 kHz, 50% duty cycle PCM_SYNC.

  • Page 51: Usb_Boot

    LTE Standard Module Series Table 18: Pin Definition of Network Connection Status/Activity Indication Pin Name Pin No. Description Comment 1.8 V power domain. Indicate the module’s network activity NET_STATUS If unused, keep it status open. Table 19: Working State of Network Activity Indicator Pin Name Logic Level Changes Network Status...
  • Page 52 LTE Standard Module Series Table 20: Pin Definition of USB_BOOT Interface Pin Name Pin No. Description Comment 1.8 V power domain. Force the module into Active high. USB_BOOT emergency download mode It is recommended to reserve test points. The following figure shows a reference circuit and timing sequence for entering emergency download mode of USB_BOOT interface.

  • Page 53: Status

    LTE Standard Module Series NOTE Make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. When using MCU to control module to enter the emergency download mode, please follow the above timing sequence.

  • Page 54: Adc Interfaces

    LTE Standard Module Series 3.17. ADC Interfaces EG915N-EU provides two Analog-to-digital conversion interfaces. AT+QADC=0 can be used to read the voltage value on ADC0. AT+QADC=1 can be used to read the voltage value on ADC1. For more details about these AT commands, see document [2]. EG915N-LA does not support ADC function.

  • Page 55: Main_Ri

    LTE Standard Module Series 3.18. MAIN_RI Send AT+QCFG="risignaltype","physical" so that no matter on which port a URC is presented, the URC will trigger the behaviors of MAIN_RI pin. NOTE AT+QURCCFG allows you to set the main UART, USB AT port or USB modem port as the URC output port.

  • Page 56: Gnss

    LTE Standard Module Series GNSS 4.1. General Description GNSS function is optional for the module. Only the module with built-in GNSS function integrates a multi-constellation GNSS receiver and supports GPS, GLONASS, Galileo, BDS, QZSS and SBAS positioning system. It also supports standard NMEA 0183 protocol and outputs NMEA sentences at 1 Hz data update rate via USB interface by default.

  • Page 57: Gnss Antenna Routing Guidelines

    LTE Standard Module Series Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock within 3 minutes after loss of lock. Acquisition sensitivity: the minimum GNSS signal power at which the module can fix position successfully within 3 minutes after executing cold start command. 4.3.

  • Page 58: Antenna Interfaces

    LTE Standard Module Series Antenna Interfaces The module includes one main antenna interface. The module with built-in GNSS function also has one GNSS antenna interface. The impedance of antenna port is 50 Ω. 5.1. Main Antenna Interface & Frequency Bands 5.1.1.

  • Page 59: Reference Design Of Cellular Antenna Interface

    LTE Standard Module Series Table 28: EG915N-LA Operating Frequency 3GPP Band Transmit Receive Unit GSM850 824-849 869-894 EGSM900 880–915 925–960 DCS1800 1710–1785 1805–1880 PCS1900 1850-1910 1930-1990 LTE-FDD B2 1850-1910 1930-1990 LTE-FDD B3 1710–1785 1805–1880 LTE-FDD B4 1710-1755 2110-2155 LTE-FDD B5 824–849 869–894 LTE-FDD B7...

  • Page 60: Rf Routing Guidelines

    LTE Standard Module Series NOTE Place the π-type matching components (R1, C1 and C2) as close to the antenna as possible. 5.1.4. RF Routing Guidelines For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’...
  • Page 61 LTE Standard Module Series Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design: ...

  • Page 62: Gnss Antenna Interface & Frequency Bands

    LTE Standard Module Series For more details about RF layout, see document [4]. 5.2. GNSS Antenna Interface & Frequency Bands The following tables list the pin definition and frequency characteristics of the GNSS antenna interface. Table 29: GNSS Antenna Pin Definition Pin Name Pin No.

  • Page 63: Gnss Antenna Reference Design

    LTE Standard Module Series 5.2.1. GNSS Antenna Reference Design 5.2.1.1. Reference Circuit Design for GNSS Active Antenna GNSS active antenna connection reference circuit is shown in the figure below. ESD Protection Component Figure 36: GNSS Active Antenna Reference Circuit – The power supply voltage range of the external active antenna is 2.8 4.3 V, and the typical value is 3.3 V.

  • Page 64: Reference Circuit Design For Gnss Passive Antenna

    LTE Standard Module Series 5.2.1.2. Reference Circuit Design for GNSS Passive Antenna GNSS passive antenna connection reference circuit is shown in the figure below. GNSS Module Antenna 0 Ω ANT_GNSS ESD Protection Component Figure 37: GNSS Passive Antenna Reference Circuit C1, R1 and C2 form the matching circuit, which is recommended to be reserved for adjusting the antenna impedance.

  • Page 65: Rf Connector Recommendation

    LTE Standard Module Series Cable insertion loss:  < 1 dB: LB (< 1 GHz)  < 1.5 dB: MB (1–2.3 GHz)  < 2 dB: HB (> 2.3 GHz)  Frequency range: L1:1559–1609 MHz  Polarization: RHCP or linear ...
  • Page 66 LTE Standard Module Series U.FL-LP series connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 39: Specifications of Mated Plugs The following figure describes the space factor of mated connector. Figure 40: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://hirose.com.

  • Page 67: Reliability, Radio And Electrical Characteristics

    LTE Standard Module Series Reliability, Radio and Electrical Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 32: Absolute Maximum Ratings Parameter Min.

  • Page 68: Digital I/O Characteristics

    LTE Standard Module Series values. Voltage drop during Maximum power control burst transmission level on EGSM900. Peak supply current Maximum power control (during transmission VBAT level on EGSM900. slot) USB connection USB_VBUS 5.25 detect 6.3. Digital I/O Characteristics Table 34: 1.8 V Digital I/O Requirements Parameter Description Min.

  • Page 69: Operating And Storage Temperatures

    LTE Standard Module Series Table 36: (U)SIM 3.0 V I/O Requirements Parameter Description Min. Max. Unit USIM_VDD Power supply 3.05 Input high voltage 1.95 Input low voltage Output high voltage 2.55 Output low voltage 0.45 6.4. Operating and Storage Temperatures Table 37: Operating and Storage Temperatures Parameter Min.
  • Page 70 LTE Standard Module Series AT+CFUN=0 (USB disconnected) 1.33 EGSM900 @ DRX = 2 (USB disconnected) 2.35 EGSM900 @ DRX = 5 (USB disconnected) 1.53 EGSM900 @ DRX = 5 (USB suspend) 2.00 EGSM900 @ DRX = 9 (USB disconnected) 1.71 DCS1800 @ DRX = 2 (USB disconnected) 2.38 DCS1800 @ DRX = 5 (USB disconnected)
  • Page 71 LTE Standard Module Series DCS1800 1DL/4UL @ 25.76 dBm EGSM900 4DL/1UL @ 26.83 dBm EGSM900 3DL/2UL @ 26.00 dBm EGSM900 2DL/3UL @ 24.96 dBm EGSM900 1DL/4UL @ 23.26 dBm EDGE data transmission DCS1800 4DL/1UL @ 24.65 dBm DCS1800 3DL/2UL @ 24.52 dBm DCS1800 2DL/3UL @ 23.26 dBm DCS1800 1DL/4UL @ 20.98 dBm LTE-FDD B1...
  • Page 72 LTE Standard Module Series EGSM900 @ DRX = 2 (USB disconnected) 1.80 EGSM900 @ DRX = 5 (USB disconnected) 1.38 EGSM900 @ DRX = 5 (USB suspend) 1.46 EGSM900 @ DRX = 9 (USB disconnected) 1.17 DCS1800 @ DRX = 2 (USB disconnected) 1.82 DCS1800 @ DRX = 5 (USB disconnected) 1.33...
  • Page 73 LTE Standard Module Series DCS1800 4DL/1UL @ 29.94 dBm DCS1800 3DL/2UL @ 29.83 dBm DCS1800 2DL/3UL @ 28.35 dBm DCS1800 1DL/4UL @ 26.37 dBm PCS1900 4DL/1UL @ 29.89 dBm PCS1900 3DL/2UL @ 29.78 dBm PCS1900 2DL/3UL @ 28.44 dBm PCS1900 1DL/4UL @ 26.45 dBm GSM850 4DL/1UL @ 26.50 dBm GSM850 3DL/2UL @ 26.33 dBm GSM850 2DL/3UL @ 25.04 dBm...
  • Page 74 LTE Standard Module Series transmission LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B28 LTE-FDD B66 GSM850 PCL = 5 @ 32.48 dBm GSM850 PCL = 12 @ 19.36 dBm GSM850 PCL = 19 @ 5.06 dBm EGSM900 PCL = 5 @ 32.03 dBm EGSM900 PCL = 12 @ 19.34 dBm EGSM900 PCL = 19 @ 4.33 dBm...

  • Page 75: Rx Sensitivity

    LTE Standard Module Series 6.6. Rx Sensitivity The following tables show conducted RF receiving sensitivity of the module. Table 40: EG915N-EU Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.) Frequency Bands 3GPP (SIMO) Primary Diversity SIMO EGSM900 -109 dBm -102 dBm DCS1800 -104 dBm -102 dBm...

  • Page 76: Esd Protection

    LTE Standard Module Series LTE-FDD B7 (10 MHz) -97 dBm -94.3 dBm LTE-FDD B8 (10 MHz) -99 dBm -93.3 dBm LTE-FDD B28 (10 MHz) -99 dBm -94.8 dBm LTE-FDD B66 (10 MHz) -99 dBm -96.5 dBm 6.7. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative.

  • Page 77: Mechanical Information

    LTE Standard Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ± 0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 41: Top and Side Dimensions EG915N_Series_Hardware_Design 76 / 92...
  • Page 78 LTE Standard Module Series Figure 42: Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. EG915N_Series_Hardware_Design 77 / 92...

  • Page 79: Recommended Footprint

    LTE Standard Module Series 7.2. Recommended Footprint Figure 43: Recommended Footprint (Top View) NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. EG915N_Series_Hardware_Design 78 / 92...

  • Page 80: Tx Power

    LTE Standard Module Series 7.3. Tx Power The following tables show the RF output power of the module. Table 43: EG915N-EU RF Output Power Frequency Bands Max. RF Output Power Min. RF Output Power EGSM900 33 dBm ±2 dB 5 dBm ± 5 dB DCS1800 30 dBm ±2 dB 0 dBm ±...

  • Page 81: Top And Bottom Views

    Figure 44: Top View and Bottom View of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. EG915N_Series_Hardware_Design 80 / 92...

  • Page 82: Storage, Manufacturing And Packaging

    LTE Standard Module Series Storage, Manufacturing and Packaging 8.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 ± 5 ° C and the relative humidity should be 35–60 %.

  • Page 83: Manufacturing And Soldering

    LTE Standard Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
  • Page 84 4. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 5. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [5].

  • Page 85: Packaging Specifications

    LTE Standard Module Series 8.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow: 8.3.1.
  • Page 86 LTE Standard Module Series 8.3.2. Plastic Reel Figure 47: Plastic Reel Dimension Drawing Table 47: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 44.5 EG915N_Series_Hardware_Design 85 / 92...
  • Page 87 LTE Standard Module Series 8.3.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover them; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. One plastic reel can load 250 modules.
  • Page 88 LTE Standard Module Series Appendix References Table 48: Related Documents Document Name [1] Quectel_UMTS&LTE_EVB_User_Guide [2] Quectel_EC200x&EG912Y&EG915N_Series_AT_Commands_Manual [3] Quectel_EC200x&EG912Y&EG915N_Series_Audio_Application_Note [4] Quectel_RF_Layout_Application_Note [5] Quectel_Module_Secondary_SMT_Application_Note Table 49: Terms and Abbreviations Abbreviation Description 3GPP 3rd Generation Partnership Project Analog-to-Digital Converter Adaptive Multi-rate EG915N_Series_Hardware_Design 87 / 92...
  • Page 89 LTE Standard Module Series Baseband BeiDou Navigation Satellite System Bits Per Second Circular Error Probable CHAP Challenge Handshake Authentication Protocol CMUX Connection MUX Coding Scheme Clear To Send Data Communications Equipment Data Coding Scheme DFOTA Delta Firmware Upgrade Over-The-Air Downlink Data Terminal Equipment Data Terminal Ready EDGE...
  • Page 90 LTE Standard Module Series File Transfer Protocol FTPS FTP over SSL Galileo Galileo Satellite Navigation System (EU) GLONASS Global Navigation Satellite System (Russia) GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellite System GPIO General-Purpose Input/Output GPRS General Packet Radio Service Global Positioning System Global System for Mobile Communications Half Rate...
  • Page 91 LTE Standard Module Series Microphone MLCC Multi-layer Ceramic Capacitor Multimedia Messaging Service Mobile Origination MQTT Message Queuing Telemetry Transport Moisture Sensitivity Level Mobile Terminating NITZ Network Identity and Time Zone NMEA (National Marine Electronics Association)0183 Interface Standard Network Time Protocol Power Amplifier Power Amplifier Module Password Authentication Protocol...
  • Page 92 LTE Standard Module Series QZSS Quasi-Zenith Satellite System Random Access Memory RHCP Right Hand Circular Polarization Radio Frequency RoHS Restriction of Hazardous Substances Request to Send Surface Acoustic Wave SBAS Satellite-Based Augmentation System Subscriber Identity Module SIMO Single Input Multiple Output Surface Mount Device Short Message Service Surface Mount Technology...
  • Page 93 LTE Standard Module Series Universal Serial Bus (U)SIM (Universal) Subscriber Identity Module VBAT Voltage at Battery (Pin) High-level Input Voltage Low-level Input Voltage Vmax Maximum Voltage Vmin Minimum Voltage Vnom Nominal Voltage High-level Output Voltage Low-level Output Voltage VSWR Voltage Standing Wave Ratio EG915N_Series_Hardware_Design 92 / 92...

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