Toshiba MMY-MUP0721FT6P-UL Service Manual page 340

(7) Apply the Silicone Thermal Grease to the semiconductors (DB01, IC201) on the service P.C. board,
and align the positions of the heat sink holes to mount the Compressor P.C. board on the outdoor
control unit. And fix the Compressor P.C. board to the outdoor control unit by the spacers (②).
(8) Screw the Compressor P.C. board to the heat sink by the 6 screws (⑥, ⑦) that were removed in step (3).
If the screws are loose, the semiconductors will generate heat, and cause it to breakdown.
Do not use an electric driver or an air driver.
The semiconductor may receive a damage.
(9) Re-connect the connectors and screw terminals (⑤).
Be sure that all the connectors and the screw terminals
are connected correctly and securely inserted.
(10) If the components on the P.C. board were bent during board replacement, adjust it manually ensuring that
it is not short or contact other parts.
(11) Install the cover, then turn on the supply. Check the operation.
①P.C. board
Uniformly apply the Silicone Thermal Grease to the heat dissipating surfaces of the IPM
(IC201) and rectifier (DB01).
Note: Do this work carefully. Please do not soil or scratch the area which attaches the
semiconductor of a heat sink.
Silicone Thermal Grease use one of the following
･Momentive Performance Materiais ''TIG1000''
･Dow Cornig Toray ''SC102''
･Mizutani Electric Ind ''HSC1000''
･Shin-Etsu Chemical ''G-746'' or ''G-747''
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③ Bush
④Collar
The torque of the screws
⑤
Screw terminal
⑥
DB01, Q201
⑦
collar and bush
M5×10 1.48 ft•lbs (2.0 N•m)
M4×15 0.89 ft•lbs (1.2 N•m)
M3×25 0.44 ft•lbs (0.6 N•m )