Quectel EC200U Series Hardware Design page 12

LTE Standard Module Series
Figure 42: Reflow Soldering Thermal Profile ............................................................................................. 88
Figure 43: Carrier Tape Dimension Drawing .............................................................................................. 90
Figure 44: Plastic Reel Dimension Drawing .............................................................................................. 90
Figure 45: Packaging Process ................................................................................................................... 91
EC200U_Series_Hardware_Design 7 / 94