Emerson Rosemount 3051 Series Quick Start Manual page 32

Quick Start Guide
Markings
Table 9-4: Process Temperature
Temperature class
Special Conditions for Safe Use (X):
1. This device contains a thin wall diaphragm less than 1
mm thick that forms a boundary between EPL Ga (process
connection) and EPL Gb (all other parts of the equipment). The
model code and datasheet are to be consulted for details of
the diaphragm material. During installation, maintenance, and
use, the environmental conditions to which the diaphragm will
be subjected shall be taken into account. The manufacturer's
instructions for installation and maintenance shall be followed
in detail to assure safety during its expected lifetime.
2. Flameproof joints are not intended for repair.
3. Non-standard paint options may cause risk from electrostatic
discharge. Avoid installations that could cause electrostatic
build-up on painted surfaces and only clean the painted
surfaces with a damp cloth. If paint is ordered through
a special option code, contact the manufacturer for more
information.
4. Some variants of the equipment have reduced markings on
the nameplate. Refer to the Certificate for full equipment
marking.
9.7.2 I7 IECEx Intrinsic Safety
Certificate
Standards
Markings
32
Ex db IIC T6...T4 Ga/Gb T6(–60 °C ≤ T
60 °C ≤ T ≤ +80 °C); Ex ta IIIC T95 °C T
a
°C ≤ T ≤ +85 °C)
a
T6
T5
T4
IECEx BAS 09.0076X
IEC60079-0:2011, IEC60079-11:2011
HART : Ex ia IIC T5/T4 Ga, T5(-60 °C ≤ T
®
°C ≤ T ≤ +70 °C)
a
Fieldbus/PROFIBUS: Ex ia IIC T4(–60 °C ≤ T
Process connection temperature
–60 °C to +70 °C
–60 °C to +80 °C
–60 °C to +80 °C
March 2023
≤ +70 °C), T4/T5(–
a
105 °C Da (-20
500
≤ +40 °C), T4 (-60
a
≤ +60 °C)
a
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