Advantech MIO-2270 User Manual page 29

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2.3.2.3

Another Thermal Solution - Heat Spreader

MIO-2270 can accommodate an optional heat spreader for a more comprehensive

compact system. Conducting heat to the chassis using a heat spreader is extremely

beneficial when systems are extra compact or have limited space for heat convec-

tion. Guidelines for heat spreaders are provided below:

For optimal heat conduction, minimize the gap between the chassis and heat

spreader; the smaller the gap, the better.

The default heat spreader height is 11.2 mm (Advantech P/N:

1960065075N001). However, if a different height is required to better fit the

chassis, Advantech can customize the heat spreader according to your needs.

Please contact our sales center for further information.

The heat spreader kit contains thermal grease and screws. If the chassis is

positioned near the heat spreader, thermal grease can be applied to enhance

conduction. Alternatively, if the chassis is positioned far from the heat spreader,

a thermal pad should be employed. A gap of less than 3 mm is recommended

for superior heat conduction.

MIO-2270 User Manual

Figure 2.11 Heat spreader assembly

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