Advertisement
8
Storag
S
ge an
8.1. Stor
rage
EC25 is sto
red in avacu
uum-sealed
1. Shelf life
e in sealed b
bag is 12 mo
2.
After thi
is bag is op
ened, devic
process
ses must be:
:
Mo
ounted withi
n 72 hours a
Sto
ored at <10%
% RH.
3. Devices
s require bak
ke before m
Hu
umidity indic
ator card is
Mo
ounted for m
more than 72
4. If baking
g is required
d, devices m
NOTE
As plastic c
ontainer can
nnot be subj
container fo
orhigh tem
perature (1
IPC/JEDEC
CJ-STD-033
for bakingp
8.2. Man
nufacturi
ng and W
The squeeg
gee should
push the pa
openings an
nd penetrate
e to the PC
clean stenc
il surface on
n a single pa
the hole of t
the module
pads should
It is sugges
sted that the
e peak reflow
max reflow
temperatur
re is 260ºC
EC25-A_Us
E
All manuals and user guides at all-guides.com
nd Ma
anufa
bag. The re
estrictions of
onths at < 4
40ºC/90%RH
es that will
be subjecte
at factory co
onditions of ≤
ounting, if:
>10% when
n ambient te
2 hours at fa
actory condit
may be baked
d for 48 hou
jected to hig
gh temperatu
25ºC) baki
ng. If shor
rocedure.
Welding
aste on the
surface of
B. The force
e on the squ
ass. To ensu
ure the mod
d be 0.18mm
m. For detail
w temperatu
ure is 235 ~
. To avoid d
damage to
ser_ManualC
Confidentia
acturi
ng
f storage con
ndition ares
hown as be
H.
d to reflow s
soldering or
r other high
≤ 30ºC/60%
RH.
emperature i
s23ºC±5ºC.
tions of ≤ 30
0ºC/60% RH
urs at 125ºC
±5ºC.
ure, the mod
dule needs t
to be taken
rter baking
time is de
esired, plea
stencil,so a
as to make
the paste fi
ueegee sho
uld be adjus
sted so as t
dule solderin
ng quality, th
he thickness
s, please re
fer to docum
ment [4] .
245ºC (for
SnAg3.0Cu
0.5 alloy). T
the module
e when it is
repeatedly
al / Release
d
60 / 6
69
LTE Module
L
e
EC25-AU
ser Manua
al
low.
temperature
e
.
out from the
e
ase refer to
o
ll the stenci
il
to produce a
a
s of stencil a
at
The absolute
e
heated, it is
s
Advertisement
