Manufacturing And Soldering - Quectel UG89 Hardware Design

7.2. Manufacturing and Soldering

Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil
openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to
produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of
stencil for the module is recommended to be 0.13mm~0.15mm. For more details, please refer to
document [4].
It is suggested that the peak reflow temperature is 238~245º C, and the absolute maximum reflow
temperature is 245º C. To avoid damage to the module caused by repeated heating, it is strongly
recommended that the module should be mounted after reflow soldering for the other side of PCB has
been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and
related parameters are shown below.
Temp. (° C)
245
238
220
200
Soak Zone
150
100
Table 31: Recommended Thermal Profile Parameters
Factor
Soak Zone
Max slope
UG89_Hardware_Design
A
Max slope: 1~3° C/sec
Figure 34: Reflow Soldering Thermal Profile
UMTS/HSPA+ Module Series
UG89 Hardware Design
Reflow Zone
Max slope:
C
2~3° C/sec
B
Recommendation
1 to 3° C/sec
Cooling down
slope: 1~4° C/sec
D
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