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7
Storage, Manufacturing and
Packaging
7.1. Storage
UG89 is stored in the vacuum-sealed bag. It is rated at MSL 3 and its storage restrictions are shown as
below.
1.
Shelf life in the vacuum-sealed bag: 12 months at <40º C/<90%RH.
2.
After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other
high temperature processes must be:
Mounted within 168 hours at the factory conditions of ≤30ºC/<60%RH.
Stored at <10%RH.
3.
Devices require baking before mounting, if any circumstance below occurs.
When the ambient temperature is 23º C± 5º C and the humidity indication card shows the
humidity is >10% before opening the vacuum-sealed bag.
Device mounting cannot be finished within 168 hours at factory conditions of ≤30ºC/60%RH.
4.
If baking is required, devices may be baked for 8 hours at 120º C± 5º C.
NOTE
As the plastic package cannot be subjected to high temperature, it should be removed from devices
before high temperature (120º C) baking. If shorter bake times are desired, please refer to IPC/JEDECJ-
STD-033 for bake procedure.
UG89_Hardware_Design
UMTS/HSPA+ Module Series
UG89 Hardware Design
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