Table of Contents
Advertisement
5
Design Considerations
5.1
Board Drill-Hole Dimensions
The MSM-LP board follows the PCIe/104
specifications.
5.2
Thermal Management
The heat spreader plate assembly is delivered by Kontron Compact Computers AG for the MSM-LP. The heat spreader
plate on top of this assembly is not a heat sink. It works as a standard thermal interface to be used with a heat sink or
other cooling device.
External cooling must be provided to maintain the heat spreader plate at proper operating temperatures. Under worst
case conditions, the cooling mechanism must maintain an ambient air and heat spreader plate temperature of 85°C or
less.
The aluminum blocks and thermal pads on the underside of the heat spreader assembly serve to provide thermal
interfaces between the heat spreader plate and the major heat-generating components on the MSM-LP.
31
TM
specification. For more information see the PCI/104-Express
MSM-LP / Design Considerations
TM
& PCIe/104
www.kontron.com
TM
Advertisement
Table of Contents
