Quectel BG96-NA Hardware Design page 20

Lte module series
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Turn on/off
Pin Name
Pin No.
PWRKEY
15
RESET_N
17
Status Indication
Pin Name
Pin No.
STATUS
20
NETLIGHT
21
USB Interface
Pin Name
Pin No.
USB_VBUS
8
USB_DP
9
USB_DM
10
(U)SIM Interface
Pin Name
Pin No.
USIM_GND
47
USIM_VDD
43
BG96-NA_Hardware_Design
I/O
Description
Turnon/off the
DI
module
Reset the
DI
module
I/O
Description
Indicate the
module's
OD
operating
status.
Indicate the
DO
module'snetwor
k activity status.
I/O
Description
PI
USB detection
USB differential
IO
data bus (+)
USB differential
IO
data bus (-)
I/O
Description
Specified
ground for
(U)SIM card
Power supply
PO
for (U)SIM card
Confidential / Released 19 / 64
BG96-NA Hardware Design
DC
Comment
Characteristics
V
max=2.1V
The output voltage is0.8V
IH
V
min=1.3V
because of thediode drop
IH
V
max=0.5V
in theQualcomm chipset.
IL
V
max=2.1V
IH
If unused, keep this pin
V
min=1.3V
IH
open.
V
max=0.5V
IL
DC
Comment
Characteristics
1.8V power domain.
V
min=1.35V
OH
If unused, keep this pin
V
max=0.45V
OL
open.
V
min=1.35V
1.8V power domain.
OH
V
max=0.45V
If unused, keep it open.
OL
DC
Comment
Characteristics
Vmax=5.25V
Vmin=3.0V
Vnorm=5.0V
Compliant with
Require differential
USB 2.0 standard
impedance of 90ohm.
specification.
Compliant with
Require differential
USB 2.0 standard
impedance of 90ohm.
specification.
DC
Comment
Characteristics
Either 1.8V or 3.0V is
For 1.8V(U)SIM:
Vmax=1.9V
supported by the module
Vmin=1.7V
automatically.
LTE Module Series

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