Quectel UC200T-EM Hardware Design page 7

Umts/hspa(+) module series
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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 12
FIGURE 2: PIN ASSIGNMENT (TOP VIEW)..................................................................................................... 15
FIGURE 3: POWER SUPPLY LIMITS DURING BURST TRANSMISSION ...................................................... 24
FIGURE 4: STAR STRUCTURE OF THE POWER SUPPLY............................................................................ 24
FIGURE 5: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 25
FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................... 26
FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ........................................................................... 26
FIGURE 8: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ........................................ 27
FIGURE 9: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ........................................................ 28
FIGURE 10: REFERENCE CIRCUIT OF (U)SIM CARD INTERFACE WITH AN 8-PIN (U)SIM CARD
CONNECTOR ............................................................................................................................................ 29
FIGURE 11: REFERENCE CIRCUIT OF (U)SIM CARD INTERFACE WITH A 6-PIN (U)SIM CARD
CONNECTOR ............................................................................................................................................ 29
FIGURE 12: REFERENCE CIRCUIT OF USB APPLICATION ......................................................................... 31
FIGURE 13: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 33
FIGURE 14: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 34
FIGURE 15: REFERENCE CIRCUIT OF SD CARD INTERFACE .................................................................... 35
FIGURE 16: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 37
FIGURE 17: REFERENCE CIRCUIT OF THE NETWORK INDICATOR .......................................................... 39
FIGURE 18: REFERENCE CIRCUITS OF STATUS ......................................................................................... 40
FIGURE 19: REFERENCE CIRCUITS OF SLEEP_IND ................................................................................... 41
FIGURE 20: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 42
FIGURE 21: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................. 44
FIGURE 22: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ...................................................................... 44
FIGURE 23: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB .................................................. 45
FIGURE 24: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE
GROUND) .................................................................................................................................................. 45
FIGURE 25: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE
GROUND) .................................................................................................................................................. 45
FIGURE 26: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ................................................ 47
FIGURE 27: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 47
FIGURE 28: SPACE FACTOR OF MATING PLUG (UNIT: MM) ....................................................................... 48
FIGURE 29: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 52
FIGURE 30: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ................................................................. 53
FIGURE 31: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 54
FIGURE 32: TOP VIEW OF THE MODULE ...................................................................................................... 55
FIGURE 33: BOTTOM VIEW OF THE MODULE .............................................................................................. 55
FIGURE 34: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 57
FIGURE 35: TAPE AND REEL SPECIFICATIONS ........................................................................................... 59
FIGURE 36: TAPE AND REEL DIRECTIONS ................................................................................................... 60
UC200T-EM_Hardware_Design
UMTS/HSPA(+) Module Series
UC200T-EM Hardware Design
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