Storage, Manufacturing And Packaging; Storage - Quectel UC200T-EM Hardware Design

Umts/hspa(+) module series
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7
Storage, Manufacturing and
Packaging

7.1. Storage

UC200T-EM is stored in a vacuum-sealed bag. The storage restrictions are shown as below.
1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH.
2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other
high temperature processes must be:
Mounted within 168 hours at the factory environment of ≤30ºC/60%RH.
Stored at <10% RH.
3. Devices require bake before mounting, if any circumstances below occurs:
When the ambient temperature is 23ºC±5ºC and the humidity indicator card shows the humidity
is >10% before opening the vacuum-sealed bag.
Device mounting cannot be finished within 168 hours at factory conditions of ≤30ºC/60%RH.
Stored at >10% RH after the vacuum-sealed bag is opened.
4. If baking is required, devices may be baked for 8 hours at 120ºC±5ºC.
NOTE
As the plastic package cannot be subjected to high temperature, it should be removed from devices
before high temperature (120ºC) baking. If shorter baking time is desired, please refer to
IPC/JEDECJ-STD-033 for baking procedure.
UC200T-EM_Hardware_Design
UMTS/HSPA(+) Module Series
UC200T-EM Hardware Design
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