Packaging - Quectel BG95 Series Hardware Design

Reflow Zone
Max slope
Reflow time (D: over 220°C)
Max temperature
Cooling down slope
Reflow Cycle
Max reflow cycle

8.3. Packaging

BG95 is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until
the devices are ready to be soldered onto the application.
The reel is 330mm in diameter and each reel contains 250 modules. The following figures show the
packaging details, measured in mm.
BG95_Hardware_Design
2 to 3°C/sec
40 to 60 sec
238°C ~ 245°C
1 to 4°C/sec
1
Figure 37: Tape Dimensions
LPWA Module Series
BG95 Hardware Design
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