Storage, Manufacturing And Packaging; Storage - Quectel BC66 Hardware Design

7
Storage, Manufacturing and
Packaging

7.1. Storage

BC66 module is stored in a vacuum-sealed bag. It is rated at MSL 3, and storage restrictions are shown
as below.
1. Shelf life in the vacuum-sealed bag: 12 months at <40º C/90%RH.
2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other
high temperature processes must be:
 Mounted within 168 hours at the factory environment of ≤30ºC/60%RH.

Stored at <10%RH.
3. Devices require baking before mounting, if any circumstance below occurs.

When the ambient temperature is 23º C± 5º C and the humidity indication card shows the humidity
is >10% before opening the vacuum-sealed bag.
 Device mounting cannot be finished within 168 hours at factory conditions of ≤30º C/60%.
4. If baking is required, devices may be baked for 8 hours at 120º C± 5º C.
NOTE
As the plastic package cannot be subjected to high temperature, it should be removed from devices
before high temperature (120º C) baking. If shorter baking time is desired, please refer to
IPC/JEDECJ-STD-033 for baking procedure.
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BC66 Hardware Design
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