Manufacturing And Packaging; Soldering - Quectel BC68 Manual

6

Manufacturing and Packaging

6.1. Soldering

Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass.
It is suggested that the peak reflow temperature is 235º C~245º C (for SnAg3.0Cu0.5 alloy). The absolute
max reflow temperature is 260º C. To avoid damage to the module caused by repeated heating, it is
suggested that the module should be mounted after reflow soldering for the other side of PCB has been
completed. Recommended reflow soldering thermal profile is shown below.
ºC
250
217
200
150
100
50
0
BC68&M66_Compatible_Design
Preheat
Liquids Temperature
160ºC
70s~120s
Between 1~3ºC/s
50 150
100
Figure 20: Reflow Soldering Thermal Profile
GSM/GPRS/NB-IoT Module Series
BC68&M66 Compatible Design
Heating
200ºC
40s~60s
200 250
Time
Cooling
300 s
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