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9.
Deactivate the Hot Air Gun Activation button first in order to activate the auto-cooling process.
The system will start to blow air (at room temperature) at a fast rate to reduce heat from the
hot air gun and bring down the temperature to a reasonable safe level of 90°C. During this
time, the prefix of the display for hot air gun temperature will also change from "H" to "C" while
temperature is gradually decreasing. Likewise, the air pressure level is at its highest reading
as indicated from the display panel. Once the temperature drops to approximately 90°C the
system will halt and display "OFF" on the panel. It is now safe to switch off the main power
switch.
10.
Turn OFF the main power switch.
11.
Unplug the device from the main power source.
D.
SOLDERING IRON
1.
Connect the Soldering Iron connection assembly to the 6-pin receptacle located at the front of
the control panel ("8" from the CONTROL PANEL GUIDE).
Follow the initial procedures ("A. INITIAL PROCEDURES").
2.
Activate the "SOLDER IRON" Activation switch ("11" from control panel). This will automatical-
3.
ly start to increase the temperature of the soldering iron to 350°C (default).
4.
Adjust the soldering iron temperature using the SOLDERING IRON ADJUSTMENT buttons
("6" from the control panel).
5.
Start using the soldering iron as soon as desired temperature is reached.
6.
Deactivate the SOLDER IRON activation switch.
7.
Allow sufficient time for the soldering iron to cool down before keeping in a safe storage.
E.
PRE-HEATER
Follow the initial procedures ("A. INITIAL PROCEDURES").
1.
2.
Place PCB to be pre-heated on top of the pre-heater.
Activate the Pre-Heater Activation switch ("10" from control panel). This will automatically start
3.
to increase the temperature of the soldering iron to 100°C (default).
4.
Adjust the Pre-heating temperature using the PREHEATING TEMPERATURE ADJUSTMENT
buttons ("5" from the control panel).
5.
The top heater may be activated for reworking multilayered boards once the PCB has been
pre-heated to desired temperature.
6.
The actual board temperature may be determined by placing the external sensor on the target
board.
7.
After reworking deactivate the PREHEATING activation switch.
F.
EXTERNAL SENSOR
Follow the initial procedures ("A. INITIAL PROCEDURES").
1.
2.
Place PCB to be pre-heated or reworked on top of the pre-heater.
Attach the external sensor probe to the external sensor probe receptacle. ("8" from the control
3.
panel).
4.
With the soldering iron function switch deactivated press the down button of the solder iron
temperature adjustment button to activate the external sensor function.
5.
The actual board temperature may be determined by placing the external sensor on the target
board.
6.
To turn off external sensor probe function press the solder iron up switch.
© by WilTec Wildanger Technik GmbH
http://www.aoyue.eu
http://www.wiltec.de
http://www.teich-tip.de
Seite 32
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