Install The Module Assembly On The Carrier Board - RadiSys PROCELERANT CE915GM Quick Start Manual

4
Assembling the Module and Carrier Board
9. RadiSys recommends you place the assembly in a temperature chamber at a temperature
This completes the assembly of the module and fansink.

Install the module assembly on the carrier board

1. Line up the board-to-board-carrier interconnectors on the module and the CR100 carrier
Board-to-board
interconnector
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of 60ºC for 10 minutes to allow the thermal interface material to phase change and
conform to an optimal shape between the chips and fansink.
The CPU may be damaged if this step is not performed prior to operating the system.
As an alternative to using a temperature chamber, you can perform this step immediately
after assembling the system by temporarily covering the fansink to trap heat and elevate the
temperature. To verify that the temperature reaches 60ºC, enter the BIOS Setup utility by
pressing F2 during system boot, and navigate to the Information > System Monitors
submenu. After 10 minutes of operation at 60ºC, be sure to uncover the fansink before
using the system further.
board as shown, then press the connectors firmly into place.
To avoid damaging any components, make sure the COM Express module is firmly seated in the
CR100 board's interconnectors before using screws to complete the assembly.
When the module is fully seated, its five standoffs should be touching the CR100 carrier board.
WARNING
WARNING