Related Manuals for Texas Instruments TMS320C5545 BoosterPack
Summary of Contents for Texas Instruments TMS320C5545 BoosterPack
- Page 1 TMS320C5545 BoosterPack Hardware User's Guide Literature Number: SPRUI90 September 2016...
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Page 2: Table Of Contents
......................Push Buttons ....................... Test Points ......................System LEDs ....................System Power Requirements ................... Power Distribution Diagram ..................... Power Supply Calculation ....................Power-Up Sequence Table of Contents SPRUI90 – September 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... - Page 3 Connectors on C5545 BoosterPack - Bottom ............Position of LEDs, Test-Points and Push Buttons on the Board ....................Power Distribution Diagram ....................Power Supply Calculation ..................... Power-Up Sequencing SPRUI90 – September 2016 List of Figures Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated...
- Page 4 Micro SD Connector ....................OLED Display Connector ....................... LaunchPad Headers ..................C5545 BoosterPack Board LEDs ................. C5545 BoosterPack Board Test Points ..................C5545 BoosterPack Board LEDs List of Tables SPRUI90 – September 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated...
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Page 5: Overview
Powered by USB or LaunchPad • On-board, XDS100 JTAG emulator for C5545 BoosterPack, LaunchPad, MSP430, SimpleLink, Code Composer Studio are trademarks of Texas Instruments. ARM, Cortex are registered trademarks of ARM Limited. Bluetooth is a trademark of Bluetooth SIG, Inc. - Page 6 12-bit, 8-channel ADC (200 ksps) and ultra-low power comparator comes in 7x7 mm (31 GPIO), 5x5 mm (15 GPIO, used here), and 4x4 mm (10 GPIO) packages TMS320C5545 BoosterPack Hardware SPRUI90 – September 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated...
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Page 7: Functional Block Diagram
Bluetooth Low Energy interface provided by the CC2650. For more details on the out of box demo, see the TMS320C5545 DSP BoosterPack Software User’s Guide (SPRUI92) . SPRUI90 – September 2016 TMS320C5545 BoosterPack Hardware Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... - Page 8 13. Resume playback by pressing SW2 or by speaking 'play' near the C5545 BoosterPack on-board MIC. 14. Stop playback by pressing SW3 or by speaking 'stop' near the C5545 BoosterPack on-board MIC. TMS320C5545 BoosterPack Hardware SPRUI90 – September 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated...
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Page 9: C5545 Boosterpack Top View
HEAD PHONE JACK (J5) POWER LED XDS100 POWER LED (LD5) (LD4) CLIENT USB DEBUG USB CONN (J1) CONN (J9) Figure 2. C5545 BoosterPack Top View SPRUI90 – September 2016 TMS320C5545 BoosterPack Hardware Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 10: C5545 Boosterpack Bottom View
BOARD TO BOARD CONN for /DXQFK3DGŒ (J7) ZIF CONN for OLED DISPLAY (J11) MICRO SD CARD CONN (J3) Figure 3. C5545 BoosterPack Bottom View TMS320C5545 BoosterPack Hardware SPRUI90 – September 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 11: Power Supply
CC2650 BLE Interface • OLED Display Interface • Audio CODEC Interface • USB Interface • UART Interface • Connection Between C5545 and LaunchPad • I2C Interface SPRUI90 – September 2016 TMS320C5545 BoosterPack Hardware Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 12: Xds100 On Board Emulator Interface
The EEPROM (1Kb) is interfaced to the FT2232 to store configuration data. The XDS100 does not interface with or support the CC2650. Figure 4. JTAG Interface TMS320C5545 BoosterPack Hardware SPRUI90 – September 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 13: Clock Distribution
Two crystals (32.768 kHz and 24 MHz) are connected to the CC2650. One 12 MHz crystal is connected to the USB peripheral of the C5545 DSP. Figure 5. Clock Distribution and DSP Clock Selection SPRUI90 – September 2016 TMS320C5545 BoosterPack Hardware Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 14: Reset Circuit And Distribution
V IO voltage on the C5545 is incompatible with the 3.3 V IO voltage on the MSP432 LaunchPad. All signals from MSP432 LaunchPad are connected to C5545 through level translators because the MSP432 LaunchPad operates at 3.3 V IO. TMS320C5545 BoosterPack Hardware SPRUI90 – September 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 15: Spi Flash Interface
Pull up/pull down options are provided for the write protect signal, which is disabled in the default configuration. Figure 7. SPI FLASH Interface SPRUI90 – September 2016 TMS320C5545 BoosterPack Hardware Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 16: Led And Switch Interface
Figure 8. Switch and LED Connection For more information on how to configure the GPIOs for Switch and LED functionality, see the GPIO Mapping table (Table 3 Section 2.15). TMS320C5545 BoosterPack Hardware SPRUI90 – September 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 17: Cc2650 Spi And Gpio Interface
Figure 9. CC2650 SPI and GPIO Interface For more information on how to configure the GPIOs for power management functionality, see the GPIO Mapping table (Table 3 Section 2.15). SPRUI90 – September 2016 TMS320C5545 BoosterPack Hardware Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 18: Micro Sd Card Interface
The OLED display is controlled by C5545 through the I2C interface. It supports an internal regulator to generate the backlight supply. For OLED reset details, see Section 2.3. Figure 11. OLED Display Interface TMS320C5545 BoosterPack Hardware SPRUI90 – September 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 19: Audio Codec Interface
Line In and Stereo Out exists, resulting in distorted audio from Line In to Stereo Out when a high amplitude signal present on Line in. SPRUI90 – September 2016 TMS320C5545 BoosterPack Hardware Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 20: 2.10 Usb Interface
XDS100 signals because the IO voltages of the LaunchPad and XDS100 are 3.3 V while the C5545 DSP IO voltage is 1.8 V. Figure 14. UART Interface Figure 15. UART Interface - Schematics TMS320C5545 BoosterPack Hardware SPRUI90 – September 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 21: Ft2232 And Cc2650
FT2232_BUFF_UART_RX DSP_UART_TX CC2650_UART_T LP_BUFF_UART_RX CC2650_UART_T LP_BUFF_UART_RX FT2232_BUFF_UART_TX FT2232_BUFF_UART_TX DSP_UART_RX DSP_UART_RX LP_BUFF_UART_TX CC2650_UART_R LP_BUFF_UART_TX CC2650_UART_R Figure 18. FT2232 and CC2650 Figure 19. LaunchPad and C5545 SPRUI90 – September 2016 TMS320C5545 BoosterPack Hardware Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 22: 2.12 Connection Between C5545 And Launchpad
IO voltage of LaunchPad is 3.3 V while the C5545 DSP IO voltage is 1.8 V. The I2S interface from CC3200 LaunchPad (always supports the I2S master) can be connected to C5545 BoosterPack (slave). Figure 20. Connection Between C5545 and LaunchPad TMS320C5545 BoosterPack Hardware SPRUI90 – September 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 23: Level Shifter Direction For I2S And Uart Interfaces
To work-around this issue (whenever no LaunchPad is connected), VCC3V3 can be wired from TP3 on the C5545 BoosterPack to J7 pin 1 (LaunchPad J1 pin 1). SPRUI90 – September 2016 TMS320C5545 BoosterPack Hardware Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 24: C5545 Boosterpack Powering Options
The LaunchPad MCU can also initiate a software reset through pin 5 that affects only the C5545 BoosterPack. The reset button (SW1) on the BoosterPack will only affect devices on the BoosterPack and leave the LaunchPad undisturbed. TMS320C5545 BoosterPack Hardware SPRUI90 – September 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 25: C5545 Boosterpack Connected With Msp432P401R Launchpad
Insert the C5545 BoosterPack headers (J7 and J8) to the LaunchPad headers (J1-J4). Press gently to avoid the PCB warping issues. Figure 23. C5545 BoosterPack Connected With MSP432P401R LaunchPad SPRUI90 – September 2016 TMS320C5545 BoosterPack Hardware Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 26: C5545 Boosterpack Pin Map
Introduction to C5545 BoosterPack Board www.ti.com Figure 24. C5545 BoosterPack Pin Map TMS320C5545 BoosterPack Hardware SPRUI90 – September 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 27: 2.13 I2C Interface
LaunchPad (0x41) is same as I2C address of INA Device (U30 – 0x41) on C5545 BoosterPack. Care should be taken in software while accessing this I2C slave device when BoosterPack is connected with CC3200 LaunchPad. SPRUI90 – September 2016 TMS320C5545 BoosterPack Hardware Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 28: 2.14 I2C Address Mapping
This section describes the physical layout of the C5545 BoosterPack board and its connectors, switches and test points. It contains: • Board Layout • Connector Index • Push Buttons • Test Points • LEDs TMS320C5545 BoosterPack Hardware SPRUI90 – September 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 29: Board Layout
The C5545 BoosterPack board dimension is 4.567’’x1.49’’ (116 mm x 37.94 mm). It is a 6-layer board fabricated with epoxy fiberglass FR4 grade material. Figure 26. C5545 BoosterPack Board Assembly Layout - Top View SPRUI90 – September 2016 TMS320C5545 BoosterPack Hardware Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 30: C5545 Boosterpack Board Assembly Layout - Bottom View
C5545 BoosterPack Board Physical Specifications www.ti.com Figure 27. C5545 BoosterPack Board Assembly Layout - Bottom View TMS320C5545 BoosterPack Hardware SPRUI90 – September 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 31: Connector Index
Micro SD connector 10051922-1410ELF OLED display header J7, J8 SSQ-110-23-L-D LaunchPad headers 20021121-00010C4LF CC2650 JTAG header Figure 28. Connectors on C5545 BoosterPack - Top SPRUI90 – September 2016 TMS320C5545 BoosterPack Hardware Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 32: Connectors On C5545 Boosterpack - Bottom
Pin Description Remarks VBUS USB power Data - Data + Device configuration Ground SHLD1 Shield ground SHLD2 Shield ground SHLD3 Shield ground SHLD4 Shield ground TMS320C5545 BoosterPack Hardware SPRUI90 – September 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 33: Jtag-Header (Cc2650)
Left output Right out Right output Ground NOTE: The Headphone jack supports headsets with microphone. However, the Apple headsets are not supported at this time. SPRUI90 – September 2016 TMS320C5545 BoosterPack Hardware Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 34: Micro Sd Connector
C5545 BoosterPack Pin Map +3.3 V LP_3V3 Analog In UART RX (---> MCU) LP_UART_RX (input to LP) UART TX (<--- MCU) LP_UART_TX (output from TMS320C5545 BoosterPack Hardware SPRUI90 – September 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... - Page 35 GPIO / PWM out GPIO / Timer Capture GPIO / Timer Capture GPIO GPIO GPIO GPIO 1. Signifies that pin aligns with BoosterPack standard (per ti.com/byob). SPRUI90 – September 2016 TMS320C5545 BoosterPack Hardware Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated...
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Page 36: Push Buttons
Table 14. C5545 BoosterPack Board LEDs LED Number Color Description Green LED1 Green LED2 Green LED3 Green Board Power LED Green FT2232 Power Enable LED TMS320C5545 BoosterPack Hardware SPRUI90 – September 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 37: Position Of Leds, Test-Points And Push Buttons On The Board
C5545 BoosterPack Board Physical Specifications www.ti.com Figure 30. Position of LEDs, Test-Points and Push Buttons on the Board SPRUI90 – September 2016 TMS320C5545 BoosterPack Hardware Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 38: System Power Requirements
AT93C46D Wireless MCU CC2650F128RHB USB to JTAG/UART FT2232HL Level Translators TMS320C5545A 5v from Micro USB Conn USB_VDDOSC RTC Supply Figure 31. Power Distribution Diagram TMS320C5545 BoosterPack Hardware SPRUI90 – September 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 39: Power Supply Calculation
System Power Requirements www.ti.com Power Supply Calculation Figure 32. Power Supply Calculation SPRUI90 – September 2016 TMS320C5545 BoosterPack Hardware Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... -
Page 40: Power-Up Sequence
System Power Requirements www.ti.com Power-Up Sequence Figure 33 shows the power-up sequence required for the processor. Figure 33. Power-Up Sequencing TMS320C5545 BoosterPack Hardware SPRUI90 – September 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated... - Page 41 USB peripheral, the 3.3 V DC-DC and two load switches can be eliminated. For more information, see the TMS320C5545 Fixed-Point Digital Signal Processor Data Sheet (SPRS853). SPRUI90 – September 2016 TMS320C5545 BoosterPack Hardware Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated...
- Page 42 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue.
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