HPE ProLiant DX190r Gen10 Maintenance And Service Manual
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HPE ProLiant DX190r Gen10 Maintenance And Service Manual

HPE ProLiant DX190r Gen10 Maintenance And Service Manual

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HPE ProLiant DX190r Gen10 Server
Maintenance and Service Guide
Abstract
This guide describes identification and maintenance procedures, diagnostic tools,
specifications, and requirements for hardware components and software. This guide is for an
experienced service technician. Hewlett Packard Enterprise assumes you are qualified in the
servicing of computer equipment, trained in recognizing hazards in products, and are familiar
with weight and stability precautions.
Part Number: P19002-001
Published: July 2019
Edition: 1

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Summary of Contents for HPE ProLiant DX190r Gen10

  • Page 1 HPE ProLiant DX190r Gen10 Server Maintenance and Service Guide Abstract This guide describes identification and maintenance procedures, diagnostic tools, specifications, and requirements for hardware components and software. This guide is for an experienced service technician. Hewlett Packard Enterprise assumes you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
  • Page 2 © Copyright 2019 Hewlett Packard Enterprise Development LP Notices The information contained herein is subject to change without notice. The only warranties for Hewlett Packard Enterprise products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. Hewlett Packard Enterprise shall not be liable for technical or editorial errors or omissions contained herein.

  • Page 3: Table Of Contents

    M.2 SSD riser board spare part..................13 Ethernet adapter spare part..................... 13 InfiniBand adapter spare parts..................13 HPE Trusted Platform Module 2.0 spare part..............13 SUV cable spare part....................... 13 OPA adapter cable spare kit.....................14 Accelerator auxiliary power cable spare parts..............14 Smart Array controller cable spare parts................14...
  • Page 4 Re-entering the server serial number and product ID and selecting an advanced fan cooling method.........................62 System battery replacement....................... 63 System battery information....................63 Removing and replacing the system battery..............63 HPE Trusted Platform Module 2.0 Gen10 Option............... 64 Troubleshooting..................66 NMI functionality..........................66 Troubleshooting resources......................66 Diagnostic tools..................67 Product QuickSpecs........................
  • Page 5 PCIe riser board components..................... 81 Primary riser board components..................81 Secondary riser board components................. 82 Accelerator numbering........................85 HPE Smart Array P824i-p MR Gen10 Controller................ 86 Cabling....................87 Cabling guidelines........................87 Smart Array cabling........................88 Onboard S100i SR Gen10 controller cabling (SATA only)..........88 Smart Array type-p controller cabling................89...

  • Page 6: Illustrated Parts Catalog

    Illustrated parts catalog System components Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts information, see the Hewlett Packard Enterprise PartSurfer website. Item Description Small bayonet board spare part Large bayonet board spare part First-generation Intel Xeon Scalable Processor spare parts on page 6 Second-generation Intel Xeon Scalable Processor spare parts on page 8 Heatsink spare parts on page 8...
  • Page 7 Description Spare part number Intel Xeon Bronze series processor — 1.70 GHz Intel Xeon Bronze 3106, 8C, 85 W 875710-001 Intel Xeon Silver series processor — 1.8 GHz Intel Xeon Silver 4108, 8C, 85 W 875712-001 2.0 GHz Intel Xeon Silver 4109T, 8C, 70 W 880185-001 2.1 GHz Intel Xeon Silver 4110, 8C, 85 W 875711-001...

  • Page 8: Second-Generation Intel Xeon Scalable Processor Spare Parts

    Second-generation Intel Xeon Scalable Processor spare parts Customer self repair on page 15: No Description Spare part number Intel Xeon Bronze series processor — 1.90 GHz Intel Xeon Bronze 3204, 6C, 85 W P11604-001 Intel Xeon Silver series processors — 2.10 GHz Intel Xeon Silver 4208, 8C, 85 W P11605-001 2.10 GHz Intel Xeon Silver 4216, 16C, 100 W...

  • Page 9: System Battery Spare Part

    System battery spare part Customer self repair on page 15: Mandatory Description Spare part number System battery 319603-001 System board assembly spare parts Customer self repair on page 15: Optional Description Spare part number 879847-001 System board assembly for the first-generation Intel Xeon Scalable processors P11391-001 System board assembly for the second-generation Intel Xeon Scalable...

  • Page 10: Server Options

    Description Spare part number 879833-001 Apollo DX2600 Gen10 Chassis/Apollo DX2800 Gen10 Chassis 2U server PCIe riser Slimline cable for processor 2 879838-001 Apollo DX2600 Gen10 Chassis/Apollo DX2800 Gen10 Chassis Gen10 for server PCIe riser Slimline cable kit includes: • 1U Slimline cable for processor 1 •...

  • Page 11: Secondary Riser Board Spare Parts

    Media Module adapter spare parts on page 13 M.2 SSD riser board spare part on page 13 HPE Trusted Platform Module 2.0 spare part on page 13* Ethernet adapter spare part on page 13* InfiniBand adapter spare parts on page 13*...

  • Page 12: Omni-Path Adapter Spare Part

    Customer self repair on page 15: Optional Description Spare part number HPE 100Gb Intel Omni-Path Adapter 879850-001 HPE 100Gb 1P OP101 QSFP28 x16 OPA Adapter 841703-001 HPE 100Gb 1P OP101 QSFP28 x8 OPA Adapter 841702-001 Smart Array controller spare parts...

  • Page 13: Media Module Adapter Spare Parts

    877697-001 InfiniBand adapter spare parts Customer self repair on page 15: Optional Description Spare part number HPE IB FDR/EN 40Gb 2P 544+QSFP Adapter 764736-001 HPE IB FDR/EN 40Gb 2P 544+FLR-QSFP Adapter 779132-001 HPE IB EDR 100Gb 1P 841QSFP28 Adapter 878578-001...

  • Page 14: Opa Adapter Cable Spare Kit

    For more information on the removal and replacement procedures, see Disconnecting and replacing the SUV cable on page 41. OPA adapter cable spare kit Customer self repair on page 15: Optional Description Spare part number • OPA adapter sideband cable P01290-001 •...

  • Page 15: Customer Self Repair

    Customer self repair Hewlett Packard Enterprise products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period Hewlett Packard Enterprise (or Hewlett Packard Enterprise service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, Hewlett Packard Enterprise will ship that part directly to you for replacement.
  • Page 16 • Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à Hewlett Packard Enterprise de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. • Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
  • Page 17 un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti. In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costo solo in alcune zone.
  • Page 18 Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt Hewlett Packard Enterprise für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst. Weitere Informationen über das Hewlett Packard Enterprise Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort.
  • Page 19 Servicio de garantía exclusivo de componentes La garantía limitada de Hewlett Packard Enterprise puede que incluya un servicio de garantía exclusivo de componentes. Según las condiciones de este servicio exclusivo de componentes, Hewlett Packard Enterprise le facilitará los componentes de repuesto sin cargo adicional alguno. Para este servicio de garantía exclusivo de componentes, es obligatoria la sustitución de componentes por parte del usuario (CSR).
  • Page 20 Voor de Parts Only garantieservice is vervanging door CSR-onderdelen verplicht. Als u Hewlett Packard Enterprise verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht Reparo feito pelo cliente Os produtos da Hewlett Packard Enterprise são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito.
  • Page 21 Customer self repair...
  • Page 22 Customer self repair...
  • Page 23 Customer self repair...

  • Page 24: Removal And Replacement Procedures

    Removal and replacement procedures Required tools The following tools might be required to perform some procedures: • T-10 Torx screwdriver • T-15 Torx screwdriver • T-30 Torx screwdriver • Phillips No. 1 screwdriver Safety considerations Before performing service procedures, review all the safety information. Electrostatic discharge Be aware of the precautions you must follow when setting up the system or handling components.

  • Page 25: Server Warnings And Cautions

    This symbol indicates the presence of hazardous energy circuits or electric shock hazards. Refer all servicing to qualified personnel. WARNING: To reduce the risk of injury from electric shock hazards, do not open this enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel. This symbol indicates the presence of electric shock hazards.
  • Page 26 WARNING: To reduce the risk of electric shock or damage to the equipment: • Never reach inside the chassis while the system is powered up. • Perform service on system components only as instructed in the user documentation. WARNING: To reduce the risk of fire or burns after removing the energy pack: •...

  • Page 27: Preparation Procedures

    Preparation procedures To access some components and perform certain service procedures, you must perform one or more of the following procedures: • Power down the server on page 27. • Remove the server from the chassis on page 27. • Remove the bayonet board on page 28.

  • Page 28: Remove The Bayonet Board

    CAUTION: To avoid damage to the server or server blank: • Always support the bottom of the server or server blank when removing it from the chassis. • Do not use the release lever to carry the server or server blank. Procedure 1.
  • Page 29 b. Remove the screws securing the cover to the server tray, and then remove the cover. c. Disconnect the bayonet board cables, and then remove the bayonet board. Removal and replacement procedures...

  • Page 30: Remove The Secondary Riser Cage

    Remove the secondary riser cage Prerequisites Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available. Procedure 1. Power down the server on page 27. 2. Disconnect all peripheral cables from the server. 3. Remove the server from the chassis on page 27. 4.

  • Page 31: Remove The Secondary Riser Cage Thermal Brackets

    Remove the secondary riser cage thermal brackets CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless the correct thermal brackets are installed. Prerequisites Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available. Procedure 1.

  • Page 32: Remove The Primary Riser Cage

    4. Remove the side bracket. Remove the primary riser cage CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless either riser blank or the riser cage is installed. Prerequisites Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available. Procedure 1.

  • Page 33: Remove The Primary Riser Blank

    4. Remove the bayonet board on page 28. 5. Remove the secondary riser cage on page 30. 6. If an expansion board with internal cabling is installed on the riser cage, disconnect these internal cables from the expansion board. 7. Remove the primary riser cage. Remove the primary riser blank CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless either riser blank or the riser cage is installed.

  • Page 34: Install The Secondary Riser Cage

    Install the secondary riser cage Prerequisites Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available. Procedure 1. Install the secondary riser cage. Make sure that the riser board is firmly seated in its system board connectors.

  • Page 35: Installing Drive Blanks And Thermal Bezel Blanks For Components With Thermal Limitations

    Installing drive blanks and thermal bezel blanks for components with thermal limitations Depending on the chassis model and the system fan mode, some components might be subject to thermal limitations. In these cases, it is necessary to remove some installed drives and replace them with thermal bezel blanks or drive blanks.
  • Page 36 • Install the SFF drive blanks. Locations of drive blanks and thermal bezel blanks for components with thermal limitations Apollo DX2200 Gen10 Chassis in nonredundant/redundant fan mode The illustration callouts: • outside the front panel image refer to the server numbering. •...
  • Page 37 Accelerator model Required drive bay action Tesla P100 12 GB Thermal bezel blanks in bays: Tesla P100 16 GB 1-9, 1-10, 1-11 Tesla V100 16 GB 3-9, 3-10, 3-11 Tesla V100 32 GB Tesla P40 24 GB LFF drive blanks in bays: Tesla M10 Quad 1-2, 1-10 3-2, 3-10...

  • Page 38: Install The Bayonet Board

    Accelerator model Required drive bay action Tesla V100 16 GB, nonredundant SFF drive blanks in bays: fan mode 2-1, 2-2, 2-3, 2-4 4-1, 4-2, 4-3, 4-4 Tesla V100 32 GB, nonredundant SFF thermal bezel blanks in bays: or redundant fan mode 2-1, 2-2, 2-3, 2-4, 1-3, 1-4 4-1, 4-2, 4-3, 4-4, 3-3, 3-4 Install the bayonet board...
  • Page 39 c. Install the bayonet board cover, and then and install the screws to secure it to the server tray. d. Install the screws to secure the cover to the bayonet board. Removal and replacement procedures...

  • Page 40: Install The Server Into The Chassis

    2. Install the server into the chassis on page 40. 3. Connect all peripheral cables to the server. 4. Power up the server on page 41. Install the server into the chassis CAUTION: To avoid damage to the server or server blank: •...

  • Page 41: Power Up The Server

    4. Connect all peripheral cables to the server. 5. Power up the server on page 41. Power up the server The DX chassis firmware initiates an automatic power-up sequence when the servers are installed. If the default setting is changed, use one of the following methods to power up each server: •...

  • Page 42: Removing And Replacing A Bayonet Board

    To replace the component, reverse the removal procedure. Removing and replacing a bayonet board CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a perceived hardware error, make sure first that the component is firmly seated in the slot. Do not bend or flex circuit boards when reseating components.

  • Page 43: Removing And Replacing An Expansion Board In The Primary Riser Cage

    Removing and replacing an expansion board in the primary riser cage CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a perceived hardware error, make sure first that the component is firmly seated in the slot. Do not bend or flex circuit boards when reseating components.

  • Page 44: Removing And Replacing An Expansion Board In The Secondary Riser Cage

    Removing and replacing an expansion board in the secondary riser cage CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a perceived hardware error, make sure first that the component is firmly seated in the slot. Do not bend or flex circuit boards when reseating components.
  • Page 45 Disconnect all cables from the expansion board. 10. Remove the expansion board. • Expansion board removal from the secondary riser slot 2 • Expansion board removal from the secondary riser slot 3 transfer board Removal and replacement procedures...
  • Page 46 • Expansion board removal from the secondary riser slot 4 • Adapter removal from the FlexibleLOM riser slot 2 Removal and replacement procedures...
  • Page 47 11. If you do not intend to replace the expansion board in the riser slot 2 or 3, install the riser slot blank. • Riser slot 2 blank installation • Riser slot 3 blank installation Removal and replacement procedures...
  • Page 48 • FlexibleLOM slot blank installation 12. If you do not intend to replace the expansion board in the riser slot 4, install the air blocker on the middle and rear thermal brackets. • Air blocker installation on the middle thermal bracket Removal and replacement procedures...

  • Page 49: Removing And Replacing The Secondary Riser Slot 3 Transfer Board

    • Air blocker installation on the rear thermal bracket To replace the component, reverse the removal procedure. Removing and replacing the secondary riser slot 3 transfer board CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a perceived hardware error, make sure first that the component is firmly seated in the slot.

  • Page 50: Removing And Replacing The Primary Riser Board

    a. Remove the side bracket. b. Disconnect all cables from the expansion board. c. Remove the expansion board. 7. Remove the secondary riser slot 3 transfer board. To replace the component, reverse the removal procedure. Removing and replacing the primary riser board CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a perceived hardware error, make sure first that the component is firmly seated in the slot.

  • Page 51: Removing And Replacing The Secondary Riser Board

    Prerequisites Before you perform this procedure, make sure that you have a T-15 Torx screwdriver available. Procedure 1. Power down the server on page 27. 2. Disconnect all peripheral cables from the server. 3. Remove the server from the chassis on page 27. 4.
  • Page 52 Remove the server from the chassis on page 27. Remove the bayonet board on page 28. Remove the secondary riser cage on page 30. Remove the following brackets: • Rear thermal bracket • Middle thermal bracket • Side bracket If installed, remove all expansion boards from the riser board. If present, disconnect the storage controller backup power cables from the riser board.

  • Page 53: Removing And Replacing The M.2 Ssd Riser Board

    13. Remove the secondary riser board. To replace the component, reverse the removal procedure. Removing and replacing the M.2 SSD riser board CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a perceived hardware error, make sure first that the component is firmly seated in the slot. Do not bend or flex circuit boards when reseating components.
  • Page 54 Procedure 1. Power down the server on page 27. 2. Disconnect all peripheral cables from the server. 3. Remove the server from the chassis on page 27. 4. Remove the bayonet board on page 28. 5. Remove the secondary riser cage on page 30. 6.

  • Page 55: Removing And Replacing A Media Module Adapter

    To replace the component, reverse the removal procedure. Removing and replacing a Media Module adapter CAUTION: Before replacing a DIMM, expansion board, or other similar PCA components due to a perceived hardware error, make sure first that the component is firmly seated in the slot. Do not bend or flex circuit boards when reseating components.
  • Page 56 8. Remove the Media Module adapter. 9. If you do not intend to replace the adapter, install the Media Module blank. Removal and replacement procedures...

  • Page 57: Dimm-Processor Compatibility

    To replace the component, reverse the removal procedure. DIMM-processor compatibility The installed processor determines the type of DIMM that is supported in the server: • First-generation Intel Xeon Scalable processors support DDR4-2666 DIMMs. • Second-generation Intel Xeon Scalable processors support DDR4-2666 DIMMs or DDR4-2933 DIMMs.

  • Page 58: Removing And Replacing The System Board

    To replace the component, reverse the removal procedure. For DIMM configuration information, see the Hewlett Packard Enterprise website (http://www.hpe.com/ docs/arm-population-rules). Removing and replacing the system board Removing the system board Prerequisites • Take note of the following: ◦ The slot locations in which each memory module is installed. These components must be installed in the same locations on the new system board.
  • Page 59 If installed, remove the M.2 SSD riser board. If present, disconnect the S100i SR Gen10 controller SATA X-cable. 10. Remove the DIMMs from the system board. 11. Remove the processor heatsink assembly: a. Allow the heatsink to cool. b. Loosen the heatsink nuts in the order specified by the label on the heatsink. c.

  • Page 60: Replacing The System Board

    Replacing the system board Prerequisites Before you perform this procedure, make sure that you have a T-15 and T-30 Torx screwdrivers available. Procedure Install the system board. Install the processor heatsink assembly: a. Locate and align the Pin 1 indicator on the processor frame and the socket. b.
  • Page 61 CAUTION: Be sure to tighten each heatsink nut fully in the order indicated. Otherwise, boot failure or intermittent shutdowns might occur. c. Using a T-30 Torx screwdriver, tighten the nuts until they stop. Install all components removed from the failed system board. Be sure to install the DIMMs in the same DIMM slots as the failed system board.

  • Page 62: Re-Entering The Server Serial Number And Product Id And Selecting An Advanced Fan Cooling Method

    a. Install the primary PCIe riser cage. b. Install the primary PCIe riser blank. Install the secondary PCIe riser cage Install the bayonet board Install the server from the chassis Connect all peripheral cables to the server. Power up the server on page 41. 10.

  • Page 63: System Battery Replacement

    a. Select System Configuration > BIOS/Platform Configuration (RBSU) > Advanced Options > Fan and Thermal Options > Thermal Configuration. b. Select one of the following advanced fan cooling method: • Enhanced CPU Cooling • Maximum Cooling 10. Save your setting. The procedure is complete.

  • Page 64: Hpe Trusted Platform Module 2.0 Gen10 Option

    15. Properly dispose of the old battery. For more information about proper battery disposal, contact an authorized reseller or an authorized service provider. HPE Trusted Platform Module 2.0 Gen10 Option The HPE Trusted Platform Module 2.0 Gen10 Option is not a customer-removable part. Removal and replacement procedures...
  • Page 65 CAUTION: If the TPM is removed from the original server and powered up on a different server, data stored in the TPM including keys will be erased. If you suspect a TPM board failure, leave the TPM installed and remove the system board. Contact a Hewlett Packard Enterprise authorized service provider for a replacement system board and TPM board.

  • Page 66: Troubleshooting

    • Error Message Guide for HPE ProLiant Gen10 servers and HPE Synergy provides a list of error messages and information to assist with interpreting and resolving error messages. •...

  • Page 67: Diagnostic Tools

    Product QuickSpecs For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/qs). UEFI System Utilities The UEFI System Utilities is embedded in the system ROM. Its features enable you to perform a wide range of configuration activities, including: •...

  • Page 68: Secure Boot

    Using the System Utilities options described in the following sections. • Using the iLO RESTful API to clear and restore certificates. For more information, see the Hewlett Packard Enterprise website (http://www.hpe.com/info/redfish). • Using the secboot command in the Embedded UEFI Shell to display Secure Boot databases, keys, and security reports.

  • Page 69: Intelligent Provisioning

    Synergy compute modules. Intelligent Provisioning simplifies server setup, providing a reliable and consistent way to deploy servers. Intelligent Provisioning 3.30 and later includes HPE Rapid Setup Software. When you launch F10 mode from the POST screen, you are prompted to select whether you want to enter the Intelligent Provisioning or HPE Rapid Setup Software mode.

  • Page 70: Intelligent Provisioning Operation

    • Press F10 from the POST screen and enter either Intelligent Provisioning or HPE Rapid Setup Software. • From the iLO web interface using Always On. Always On allows you to access Intelligent Provisioning without rebooting your server. Intelligent Provisioning operation Intelligent Provisioning includes the following components: •...

  • Page 71: Usb Support

    HPE Smart Storage Administrator HPE SSA is the main tool for configuring arrays on HPE Smart Array SR controllers. It exists in three interface formats: the HPE SSA GUI, the HPE SSA CLI, and HPE SSA Scripting. All formats provide support for configuration tasks.

  • Page 72: Hpe Infosight For Servers

    The Storage Command Line Interface (StorCLI) tool is the command line management software designed for the HPE Smart Array MR controller. StorCLI is a command line interface that is designed to be easy to use, consistent, and easy to script.

  • Page 73: Component Identification

    Use a mobile device to scan the QR code label to display the server mobile product page (http:// www.hpe.com/qref/dx190rgen10). This page contains links to server setup information, spare part numbers, QuickSpecs, troubleshooting resources, and other useful product links. Component identification...

  • Page 74: Rear Panel Leds And Buttons

    Rear panel LEDs and buttons Item Status Definition NIC link LED Green Linked to network No network link NIC status LED Flashing green Network active No network activity Power On/Standby button Solid green System on and normal operation and system power LED Flashing green Performing power-on sequence Solid amber...

  • Page 75: Server Uid Led

    UID button functionality The UID button can be used to display the Server Health Summary when the server will not power on. For more information, see the latest HPE iLO 5 User Guide on the Hewlett Packard Enterprise website. Component identification...

  • Page 76: Front Panel Led Power Fault Codes

    2 flashes Memory 3 flashes Riser board PCIe slots 4 flashes FlexibleLOM 5 flashes Removable HPE Smart Array SR Gen10 controller 6 flashes System board PCIe slots 7 flashes Power backplane or storage backplane 8 flashes Power supply 9 flashes...

  • Page 77: System Maintenance Switch Descriptions

    Item Description Processor 2 DIMM slots for processor 2 Bayonet board connector Secondary PCIe x24 riser connector 4 Secondary PCIe x24 riser connector 3 x4 SATA port System maintenance switch x8 SATA port Secondary PCIe x24 riser connector 2 TPM connector microSD slot System maintenance switch descriptions Position...

  • Page 78: Dimm Label Identification

    When the system maintenance switch position 6 is set to the On position and Secure Boot is enabled, some configurations cannot be restored. For more information, see Secure Boot on page 68. DIMM label identification To determine DIMM characteristics, see the label attached to the DIMM. The information in this section helps you to use the label to locate specific information about the DIMM.

  • Page 79: Hpe Persistent Memory Module Label Identification

    L = LRDIMM (load reduced) E = Unbuffered ECC (UDIMM) For more information about product features, specifications, options, configurations, and compatibility, see the HPE DDR4 SmartMemory QuickSpecs on the Hewlett Packard Enterprise website (http:// www.hpe.com/support/DDR4SmartMemoryQS). HPE Persistent Memory module label identification...

  • Page 80: Processor, Heatsink, And Socket Components

    512 GB QR code Includes part number and serial number For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/support/ persistentmemoryQS). Processor, heatsink, and socket components Item Description...

  • Page 81: Bayonet Board Components

    Bayonet board components Item Description Bayonet port 1 Bayonet port 2 Bayonet port 3 Bayonet port 4 GPU auxiliary power cable connector PCIe riser board components This section identifies the riser slots compatible with specific types of expansion options supported by the server.

  • Page 82: Secondary Riser Board Components

    Item Slot number Description Supported options PCIe3 x16 (16, 8, 4, 1) • Smart Array type-p controller • Network adapter • OPA adapter — Storage controller backup power — connector Intel Omni-Path Architecture Secondary riser board components The server supports multiple riser options in the secondary position. Processor 2 is required to support these secondary riser options.
  • Page 83 Item Slot number Description Supported options PCIe3 x16 (16, 8, 4, 1) — — Secondary riser slot 3 transfer board • Smart Array type-p controller • PCIe workload accelerator • Computation and graphics accelerator • Network adapter The transfer board is, by default, installed on the secondary riser slot 3. Three-slot secondary riser port numbering FlexibleLOM riser board components FlexibleLOM riser slots...
  • Page 84 Item Slot number Description Supported options PCIe3 x16 (16, 8, 4, 1) • PCIe workload accelerator • Computation and graphics accelerator PCIe3 x16 (16, 8, 4, 1) — FlexibleLOM slot PCIe3 x16 (16, 8, 4, 1) FlexibleLOM adapter — Secondary riser slot 3 transfer •...

  • Page 85: Accelerator Numbering

    M.2 SSD riser bay numbering The arrow points toward the server release lever. Item Description Bay 7 Bay 8 Accelerator numbering Component identification...

  • Page 86: Hpe Smart Array P824I-P Mr Gen10 Controller

    HPE Smart Array P824i-p MR Gen10 Controller Components Item Description Internal SAS port 1i Internal SAS port 2i Internal SAS port 3i Internal SAS port 4i Controller backup power cable connector Internal SAS port 5i Internal SAS port 6i Component identification...

  • Page 87: Cabling

    Cabling Cabling guidelines The cable colors in the cabling diagrams used in this chapter are for illustration purposes only. Most of the server cables are black. Observe the following guidelines when working with server cables. Before connecting cables • Note the port labels on the PCA components. Not all of these components are used by all servers: ◦...

  • Page 88: Smart Array Cabling

    • Remove cables that are no longer being used. Retaining them inside the server can restrict airflow. If you intend to use the removed cables later, label and store them for future use. Smart Array cabling Onboard S100i SR Gen10 controller cabling (SATA only) Cable color Description Blue...

  • Page 89: Smart Array Type-P Controller Cabling

    Smart Array type-p controller cabling Smart Array type-p controller cabling in the primary riser slot 1 Cable color Description Blue Controller port 2 to bayonet port 2 Orange Controller port 1 to bayonet port 1 Smart Array type-p controller cabling in the secondary riser slot 2 Cable color Description Blue...

  • Page 90: Storage Controller Backup Power Cabling

    Cable color Description Blue Controller ports 1 and 2 to bayonet port 1 Orange Controller ports 3 and 4 to bayonet port 2 Storage controller backup power cabling Storage controller backup power cabling in the primary riser slot 1 Storage controller backup power cabling in the secondary riser slot 2 Cabling...

  • Page 91: Three-Slot Secondary Riser Cabling

    Storage controller backup power cabling in the secondary riser slot 3 Three-slot secondary riser cabling Cable color Description Blue Secondary PCIe riser port 1 to bayonet port 3 Orange Secondary PCIe riser port 2 to bayonet port 4 Cabling...

  • Page 92: Flexiblelom Riser Cabling

    FlexibleLOM riser cabling Cable color Description Blue FlexibleLOM riser port 3 to bayonet port 3 Orange FlexibleLOM riser port 4 to bayonet port 4 Yellow FlexibleLOM riser port 2 to bayonet port 2 FlexibleLOM riser port 1 to bayonet port 1 OPA adapter cabling Cabling...

  • Page 93: Accelerator Auxiliary Power Cabling

    Cable color Description Blue OPA adapter sideband cable Orange OPA adapter IFP cable Accelerator auxiliary power cabling GPU accelerator 1 GPU accelerator 2 Cable color Description Orange Accelerator 1 auxiliary power cable Blue Accelerator 2 auxiliary power cable Cabling...

  • Page 94: Specifications

    Specifications Environmental specifications Specification Value Temperature range — Operating 10°C to 35°C (50°F to 95°F) Non-operating -30°C to 60°C (-22°F to 140°F) Relative humidity (noncondensing) — Operating 8% to 90% 28°C (82.4°F), maximum wet bulb temperature Non-operating 5% to 95% 38.7°C (101.7°F), maximum wet bulb temperature All temperature ratings shown are for sea level.

  • Page 95: List Of Components With Temperature Requirements

    The operating temperature inside the rack is always higher than the room temperature and is dependent on the configuration of equipment in the rack. Check the TMRA for each piece of equipment before installation. CAUTION: To reduce the risk of damage to the equipment when installing third-party options: •...
  • Page 96 Processors The following limitations are for the Intel Xeon Gold 6244 (G6244) processor: • The processor does not support enhanced processor performance • LFF drives with drive capacities greater than or equal to 10 TB are not supported for the Apollo DX2200 Gen10 Chassis series with three drives per node.
  • Page 97 Description Chassis Fan configuration Number of drives Maximum inlet supported by the ambient server temperature Apollo DX2800 Redundant and 0 to 24 drives Not supported Gen10 Chassis nonredundant (24 SFF backplane with SAS expander) Apollo DX2800 Redundant and 0 to 8 drives Not supported Gen10 Chassis nonredundant...
  • Page 98 Apollo DX2200 Gen10 Chassis, drive blanks must be installed in drive bays 3-2 and 4-2. For more information, see Installing drive blanks and thermal bezel blanks for components with thermal limitations on page 35. HPE Smart Array controllers Description Chassis...
  • Page 99 Description Chassis Fan configuration Number of drives Maximum inlet supported by the server ambient temperature P408i-p Apollo DX2200 Redundant and 5 to 6 drives Not supported controller Gen10 Chassis nonredundant 5 to 6 drives Not supported (12 LFF 0 to 4 drives 30°C (86°F) backplane) Apollo DX2600...
  • Page 100 Description Chassis Fan configuration Number of drives Maximum inlet supported by the server ambient temperature 5 to 6 drives Not supported (12 LFF backplane) 0 to 4 drives 35°C (95°F) Apollo DX2600 Redundant and 0 to 10 drives 30°C (86°F) Gen10 Chassis nonredundant (24 SFF or 16...
  • Page 101 The drive capacity must be greater than or equal to 10 TB. If the component is installed in server 1, and the server is installed in the Apollo DX2200 Gen10 Chassis, drive blanks must be installed in drive bays 1-2 and 2-2. Similarly, if the component is installed in server 3, and the server is installed in the Apollo DX2200 Gen10 Chassis, drive blanks must be installed in drive bays 3-2 and 4-2.
  • Page 102 Description Chassis Fan configuration Number of drives Maximum inlet supported by the server ambient temperature Apollo DX2600 Redundant and 0 to 10 drives Optical cable: Not Gen10 Chassis nonredundant supported (24 SFF or 16 Copper cable: 30°C SFF + 8 NVMe (86°F) backplane) Apollo DX2800...
  • Page 103 Description Chassis Fan configuration Number of drives Maximum inlet supported by the ambient server temperature Apollo DX2600 Redundant and 0 to 10 drives Optical cable: Not Gen10 Chassis nonredundant supported (24 SFF or 16 Copper cable: 30°C SFF + 8 NVMe (86°F) backplane) Apollo DX2800...
  • Page 104 If the component is installed in server 1, and the server is installed in the Apollo DX2200 Gen10 Chassis, drive blanks must be installed in drive bays 1-2 and 2-2. Similarly, if the component is installed in server 3, and the server is installed in the Apollo DX2200 Gen10 Chassis, drive blanks must be installed in drive bays 3-2 and 4-2.
  • Page 105 Media Module adapters Description Chassis Fan configuration Number of drives Maximum inlet supported by the ambient server temperature Media Module Apollo DX2200 Redundant and 5 to 6 drives 30°C (86°F) 10Gb 2P Gen10 Chassis nonredundant 5 to 6 drives Not supported 568FLR-MMSFP (12 LFF 0 to 4 drives...
  • Page 106 If the component is installed in server 1, and the server is installed in the Apollo DX2200 Gen10 Chassis, drive blanks must be installed in drive bays 1-2 and 2-2. Similarly, if the component is installed in server 3, and the server is installed in the Apollo DX2200 Gen10 Chassis, drive blanks must be installed in drive bays 3-2 and 4-2.
  • Page 107 Description Chassis Number of drives Maximum inlet configuration supported by the ambient temperature server Apollo DX2600 Redundant and 0 to 10 drives 35°C (95°F) Gen10 Chassis nonredundant (24 SFF or 16 SFF + 8 NVMe backplane) Apollo DX2800 Redundant and 0 to 24 drives 35°C (95°F) Gen10 Chassis...
  • Page 108 Description Chassis Number of drives Maximum inlet configuration supported by the ambient temperature server Apollo DX2600 Redundant and 0 to 10 drives 25°C (77°F) Gen10 Chassis nonredundant (24 SFF or 16 SFF + 8 NVMe backplane) Apollo DX2800 Redundant and 0 to 24 drives 25°C (77°F) Gen10 Chassis...
  • Page 109 Description Chassis Number of drives Maximum inlet configuration supported by the ambient temperature server Apollo DX2600 Redundant and 0 to 10 drives Not supported Gen10 Chassis nonredundant 0 to 6 drives With mix of SFF and (24 SFF or 16 SFF NVMe drives: + 8 NVMe backplane)
  • Page 110 Description Chassis Number of drives Maximum inlet configuration supported by the ambient temperature server NVIDIA Tesla Apollo DX2200 Redundant and 5 to 6 drives Not supported V100 32GB Gen10 Chassis nonredundant Redundant and 5 to 6 drives Not supported (12 LFF nonredundant backplane) Redundant and...

  • Page 111: Thermal Limitations For Components In Systems With The Enhanced Processor Performance Feature Disabled

    To ensure proper thermal cooling with NVIDIA Tesla P100 GPUs or NVIDIA Tesla V100 GPUs installed in the server. The server must be installed in the Apollo DX2200 Gen10 Chassis or the Apollo DX2600 Gen10 Chassis. The thermal bezel blanks must also be installed in specific drive bays. For more information, see Installing drive blanks and thermal bezel blanks for components with thermal limitations on page 35.
  • Page 112 Description Chassis Fan configuration Number of drives Maximum inlet supported by the ambient server temperature 0 to 4 drives (12 LFF 28°C (82.4°F) backplane) Apollo DX2600 Redundant and 0 to 10 drives 25°C (77°F) Gen10 Chassis nonredundant (24 SFF or 16 SFF + 8 NVMe backplane) Apollo DX2800...
  • Page 113 Apollo DX2200 Gen10 Chassis, drive blanks must be installed in drive bays 3-2 and 4-2. For more information, see Installing drive blanks and thermal bezel blanks for components with thermal limitations on page 35. HPE Smart Array controllers Description Chassis...
  • Page 114 Description Chassis Number of drives Maximum inlet configuration supported by the server ambient temperature Apollo DX2800 Redundant and 0 to 8 drives Not supported Gen10 Chassis nonredundant (16 NVMe backplane) P408e-p Apollo DX2200 Redundant and 5 to 6 drives 25°C (77°F) controller Gen10 Chassis nonredundant...
  • Page 115 (16 NVMe backplane) The energy pack is supported only with Smart Array P-class controllers. Due to thermal concerns, HPE recommends to remove the energy pack if these controller types are not installed in the chassis. The drive capacity must be less than 10 TB.
  • Page 116 Description Chassis Number of drives Maximum inlet configuration supported by the server ambient temperature 0 to 4 drives 28°C (82.4°F) (12 LFF backplane) Apollo DX2600 Redundant and 0 to 10 drives 28°C (82.4°F) Gen10 Chassis nonredundant (24 SFF or 16 SFF + 8 NVMe backplane) Apollo DX2800...
  • Page 117 Description Chassis Number of drives Maximum inlet configuration supported by the server ambient temperature Apollo DX2800 Redundant and 0 to 24 drives Optical cable: Gen10 Chassis nonredundant 25°C (77°F) (24 SFF Copper cable: 35°C backplane with (95°F) SAS expander) Apollo DX2800 Redundant and 0 to 8 drives Optical cable:...
  • Page 118 Description Chassis Fan configuration Number of drives Maximum inlet supported by the ambient server temperature Apollo DX2800 Redundant and 0 to 24 drives Optical cable: 25°C Gen10 Chassis nonredundant (77°F) (24 SFF Copper cable: 35°C backplane with (95°F) SAS expander) Apollo DX2800 Redundant and 0 to 8 drives...
  • Page 119 If the component is installed in server 1, and the server is installed in the Apollo DX2200 Gen10 Chassis, drive blanks must be installed in drive bays 1-2 and 2-2. Similarly, if the component is installed in server 3, and the server is installed in the A Apollo DX2200 Gen10 Chassis, drive blanks must be installed in drive bays 3-2 and 4-2.
  • Page 120 Media Module adapters Description Chassis Fan configuration Number of drives Maximum inlet supported by the ambient server temperature Media Module Apollo DX2200 Redundant and 5 to 6 drives 30°C (86°F) 10Gb 2P Gen10 Chassis nonredundant 5 to 6 drives 30°C (86°F) 568FLR-MMSFP (12 LFF 0 to 4 drives...
  • Page 121 If the component is installed in server 1, and the server is installed in the Apollo DX2200 Gen10 Chassis, drive blanks must be installed in drive bays 1-2 and 2-2. Similarly, if the component is installed in server 3, and the server is installed in the Apollo DX2200 Gen10 Chassis, drive blanks must be installed in drive bays 3-2 and 4-2.
  • Page 122 Description Chassis Fan configuration Number of drives Maximum inlet supported by the server ambient temperature Apollo DX2600 Redundant and 0 to 10 drives 35°C (95°F) Gen10 Chassis nonredundant (24 SFF or 16 SFF + 8 NVMe backplane) Apollo DX2800 Redundant and 0 to 24 drives 35°C (95°F) Gen10 Chassis...
  • Page 123 Description Chassis Fan configuration Number of drives Maximum inlet supported by the server ambient temperature Apollo DX2600 Redundant and 0 to 10 drives 28°C (82.4°F) Gen10 Chassis nonredundant (24 SFF or 16 SFF + 8 NVMe backplane) Apollo DX2800 Redundant and 0 to 24 drives 28°C (82.4°F) Gen10 Chassis...
  • Page 124 Description Chassis Fan configuration Number of drives Maximum inlet supported by the server ambient temperature 0 to 6 drives (24 SFF or 16 SFF With mix of SFF + 8 NVMe and NVMe backplane) drives: 22°C (71°F) With SFF drives only: 25°C (77°F) Apollo DX2800...
  • Page 125 Description Chassis Fan configuration Number of drives Maximum inlet supported by the server ambient temperature NVIDIA Tesla Apollo DX2200 Redundant and 5 to 6 drives Not supported V100 32GB Gen10 Chassis nonredundant Redundant and 5 to 6 drives Not supported (12 LFF backplane) nonredundant Redundant and...
  • Page 126 To ensure proper thermal cooling with NVIDIA Tesla P100 GPUs or NVIDIA Tesla V100 GPUs installed in the server, the server must be installed in the Apollo DX2200 Gen10 Chassis or the Apollo DX2600 Gen10 Chassis. The thermal bezel blanks must also be installed in specific drive bays. For more information, see Installing drive blanks and thermal bezel blanks for components with thermal limitations on page 35.

  • Page 127: Websites

    Storage white papers and analyst reports www.hpe.com/storage/whitepapers For additional general support websites, see Support and other resources. Product websites HPE ProLiant DX190r Gen10 Server support page http://www.hpe.com/support/DX190rGen10 HPE ProLiant DX190r Gen10 Server user documents http://www.hpe.com/info/DX190rGen10-docs Nutanix support portal http://www.nutanix.com/docs/dx...

  • Page 128: Support And Other Resources

    Support and other resources Accessing Hewlett Packard Enterprise Support • For live assistance, go to the Contact Hewlett Packard Enterprise Worldwide website: http://www.hpe.com/info/assistance • To access documentation and support services, go to the Hewlett Packard Enterprise Support Center website: http://www.hpe.com/support/hpesc Information to collect •...

  • Page 129: Remote Support

    IMPORTANT: Access to some updates might require product entitlement when accessed through the Hewlett Packard Enterprise Support Center. You must have an HPE Passport set up with relevant entitlements. Remote support Remote support is available with supported devices as part of your warranty or contractual support agreement.

  • Page 130: Documentation Feedback

    Documentation Feedback (docsfeedback@hpe.com). When submitting your feedback, include the document title, part number, edition, and publication date located on the front cover of the document. For online help content, include the product name, product version, help edition, and publication date located on the legal notices page.

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