Figure 19: Reference Circuit Of Usb Application - Quectel EC25-V User Manual

Lte module
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Module
USB_VBUS
USB_DM
USB_DP
GND
In order to meet USB data line signal integrity, components R1, R2, R3 and R4 must be placed close to
the module, and then these resistors should be placed close to each other. The extra stubs of trace must
be as short as possible.
In order to ensure the USB interface design corresponding with the USB 2.0 specification, please comply
with the following principles.
It is important to route the USB signal traces as differential pairs with total grounding. The impedance
of USB differential trace is 90ohm.
Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is
important to route the USB differential traces in inner-layer with ground shielding on not only upper
and lower layers but also right and left sides.
Pay attention to the influence of junction capacitance of ESD component on USB data lines. Typically,
the capacitance value should be less than 2pF.
Keep the ESD components as close as possible to the USB connector.
NOTE
EC25 module can only be used as a slave device.
EC25-V_User_Manual
69
Minimize this stub
R3
R4
VDD
R1
R2
Close to Module

Figure 19: Reference Circuit of USB Application

Confidential / Released
Test Points
NM_0R
NM_0R
ESD Array
0R
0R
LTE Module Series
EC25-V User Manual
MCU
USB_DM
USB_DP
GND
35 /

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