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Summary of Contents for Intel 6 SERIES CHIPSET - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011
- Page 1 ® Intel 6 Series Chipset Thermal Mechanical Specifications and Design Guidelines (TMSDG) January 2011 324647-001...
- Page 2 Modules and an Intel TXT-compatible measured launched environment (MLE). The MLE could consist of a virtual machine monitor, an OS or an application. In addition, Intel TXT requires the system to contain a TPM v1.2, as defined by the Trusted Computing Group and specific software for some uses.
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Page 3: Table Of Contents
Contents Introduction ......................7 Related Documents ..................... 8 Terminology ....................... 8 Packaging Mechanical Specifications ................. 9 PCH Package for Single Processor Desktop.............. 9 Solder Balls ...................... 11 Package Mechanical Requirements ............... 12 Thermal Specifications .................... 13 Thermal Design Power (TDP) ................13 Thermal Specifications .................. - Page 4 Figures 2-1 Package Dimensions (Top View) .................. 9 2-2 Package Dimensions (Side View) ................10 2-3 Package (Land Side View)..................11 5-1 Thermal Solution Decision Flow Chart................19 5-2 Heatsink Modifications....................20 5-3 Top View of Package ....................20 5-4 Airflow & Temperature Measurement Locations.............21 6-1 Reference Thermal Solution ..................24 Tables 3-1 PCH Thermal Specifications..................13...
- Page 5 Revision History Revision Revision Description Number Date Initial release January 2011 § Thermal Mechanical Specifications and Design Guidelines...
- Page 6 Thermal Mechanical Specifications and Design Guidelines...
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Page 7: Introduction
® Intel 6 Series Chipset for use in single processor systems for the desktop. ® • Describe reference thermal solutions that meet the specifications of the Intel Series Chipset. ® The Intel 6 Series Chipset components supported in this document are: ®... -
Page 8: Related Documents
Intel 6 Series Chipset Datasheet www.intel.com/Assets/PDF/ specupdate/324645.pdf ® Intel 6 Series Chipset Specification Update www.intel.com/Assets/PDF/ specupdate/324646.pdf Generation Intel® Core™ Processor and LGA1155 Socket Thermal http://download.intel.com/ Mechanical Specifications and Design Guidelines design/processor/specupdt/ 324644.pdf Thermally Advantaged Chassis Design Guidelines http://www3.intel.com/cd/ channel/reseller/asmo-na/eng/ products/53211.htm Various system thermal design suggestions http://www.formfactors.org... -
Page 9: Packaging Mechanical Specifications
Packaging Mechanical Specifications Packaging Mechanical Specifications PCH Package for Single Processor Desktop The Platform Controller Hub uses a 27 mm square flip chip ball grid array (FC-BGA) package (see Figure 2-1 through Figure 2-3). The complete package drawing can be found in Appendix Figure 2-1. -
Page 10: Package Dimensions (Side View)
Packaging Mechanical Specifications Figure 2-2. Package Dimensions (Side View) Note: All dimensions in mm Thermal Mechanical Specifications and Design Guidelines... -
Page 11: Solder Balls
Packaging Mechanical Specifications Figure 2-3. Package (Land Side View) Note: All dimensions in mm Solder Balls A total of 942 solder balls corresponding to the lands are on the bottom of the PCH package for surface mounting with the motherboard. The package solder ball has the following characteristics: •... -
Page 12: Package Mechanical Requirements
Packaging Mechanical Specifications Package Mechanical Requirements The package has a bare die that is capable of sustaining a maximum static normal load of 15 lbf (67 N). Note: The heatsink attach solutions must not induce continuous stress to the package with the exception of a uniform load to maintain the heatsink-to-package thermal interface. -
Page 13: Thermal Specifications
3-1. Intel recommends designing the PCH thermal solution to the TDP for maximum flexibility and reuse. The PCH package has poor heat transfer capability into the board and has minimal thermal capability without thermal solutions. Intel requires that system designers plan for an attached heatsink when using the PCH. The... -
Page 14: Pch Tdp Workload Running Simultaneously
Thermal Specifications Table 3-1. PCH Thermal Specifications (Sheet 2 of 2) Parameter Value Notes 1. The value is based on system configuration, see Table 3-4 but disconnected Idle one Gen 2 SATA HDD and disabled integrated graphic and then installed an (configuration 2.41 W external graphic card. -
Page 15: Pch Idle Power Configuration
Thermal Specifications Table 3-3. PCH TDP Configuration (Sheet 2 of 2) PCH Interfaces Connected and Active Notes Display Link 2 VGA 1920 x 1200, 60 Hz, 24bpp Platform Audio Jacks Headphone/Microphone Combination FDI x 2 x2 for each 1920x1200, 60 Hz, 24bpp DMI x 4 Active LPC I/F... -
Page 16: Storage Specifications
Nominal temperature and humidity conditions and durations are given and tested within the constraints ® imposed by Tsustained and customer shelf life in applicable Intel box and bags. § § Thermal Mechanical Specifications and Design Guidelines... -
Page 17: Thermal Simulation
Thermal Simulation Thermal Simulation Intel provides thermal simulation models of the PCH and associated users’ guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated, system-level environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool FLOTHERM* (version 5.1 or higher) by Flomerics, Inc. - Page 18 Thermal Simulation Thermal Mechanical Specifications and Design Guidelines...
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Page 19: Thermal Metrology
Thermal Metrology Thermal Metrology The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure the PCH case and junction temperatures. The flowchart in Figure 5-1 offers useful guidelines for thermal performance and evaluation. -
Page 20: Heatsink Modifications
Thermal Metrology 4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts should match the slot and hole milled into the heatsink base. 5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of the top surface of the die using a high thermal conductivity cement. -
Page 21: Ambient Temperature And Airflow Measurement
For a more accurate measurement of the average approach air temperature, Intel recommends averaging temperatures recorded from two thermocouples spaced about 25 mm [1.0 in] apart. Locations for both a single thermocouple and a pair of thermocouples are presented. - Page 22 Thermal Metrology Thermal Mechanical Specifications and Design Guidelines...
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Page 23: Atx Reference Thermal Solution
The design strategy for the PCH thermal solution is to reuse the z-clip heatsink originally designed for the I/O Controller Hub 6 (ICH6) Family and used on subsequent ® ICH designs through ICH10 and also for Intel 5 Series Chipset design. This section describes the overall requirements for the ATX heatsink reference thermal solution including critical-to-function dimensions, operating environment, and validation criteria. -
Page 24: Environmental Reliability Requirements
ATX Reference Thermal Solution Figure 6-1. Reference Thermal Solution Environmental Reliability Requirements The reference solution heatsink will be evaluated to the reliability requirements in Table 6-1. The mechanical loading of the component may vary depending on the heatsink, and attach method used. The customer should define a validation test suite based on the anticipated use conditions and resulting reliability requirements. -
Page 25: A Thermal Solution Component Vendors
Thermal Solution Component Vendors Note: These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice. - Page 26 Thermal Solution Component Vendors Thermal Mechanical Specifications and Design Guidelines...
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Page 27: B Mechanical Drawings For Package And Reference Thermal Solution
Mechanical Drawings for Package and Reference Thermal Solution Mechanical Drawings for Package and Reference Thermal Solution The following mechanical drawings are included in this appendix: Figure B-1, “Desktop Platform Controller Hub Package Drawing” on page 28 Figure B-2, “Motherboard Keep-Out for ATX Reference Heatsink” on page 29 Figure B-3, “ATX Reference Heatsink Assembly”... - Page 28 Mechanical Drawings for Package and Reference Thermal Solution Figure B-1. Desktop Platform Controller Hub Package Drawing Thermal Mechanical Specifications and Design Guidelines...
- Page 29 Mechanical Drawings for Package and Reference Thermal Solution Figure B-2. Motherboard Keep-Out for ATX Reference Heatsink Thermal Mechanical Specifications and Design Guidelines...
- Page 30 Mechanical Drawings for Package and Reference Thermal Solution Figure B-3. ATX Reference Heatsink Assembly Thermal Mechanical Specifications and Design Guidelines...
- Page 31 Mechanical Drawings for Package and Reference Thermal Solution Figure B-4. ATX Reference Heatsink Extrusion Thermal Mechanical Specifications and Design Guidelines...
- Page 32 Mechanical Drawings for Package and Reference Thermal Solution Figure B-5. ATX Reference Heatsink Clip § § Thermal Mechanical Specifications and Design Guidelines...
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