Thermal Interface Material (Tim); Board-Level Component Keep-Outs; Figure 8 Gmch Torsional Clip Heat Sink Motherboard Component Keep-Out - Intel 945G Thermal Design Manual

Express chipset graphics and memory controller hub (gmch) for embedded applications

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4.3.2

Thermal Interface Material (TIM)

A thermal interface material provides improved conductivity between the die and heat sink. It is

important to understand and consider the impact of the interface between the die and heat sink

base on the overall thermal solution. Specifically, the bond line thickness, interface material area,

and interface material thermal conductivity must be selected to optimize the thermal solution.

It is important to minimize the thickness of the TIM, commonly referred to as the bond line

thickness. A large gap between the heat sink base and the die yields a greater thermal resistance.

The thickness of the gap is determined by the flatness of both the heat sink base and the die, plus

the thickness of the TIM, and the clamping force applied by the heat sink attachment method. To

ensure proper and consistent thermal performance, the TIM and application process must be

properly designed.

The 945G GMCH reference thermal solution uses Honeywell* PCM45F. Alternative materials

can be used at the user's discretion. Regardless, the entire heat sink assembly, including the heat

sink, TIM, attach method must be validated for specific applications.

4.4

The locations of the hole patterns and motherboard component keep-outs for the GMCH can be

seen in Figure 8 and Figure 9. Dimensions are in inches.

Figure 8

GMCH Torsional Clip Heat Sink Motherboard Component Keep-out

2.398

Order #308643

Intel

945G Express Chipset GMCH Thermal Design Guide

2.218

MCH

2x 1.109

Reference Thermal Solution

2x 1.199

Parallel Mean

Airflow Direction

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