Mechanical Design Envelope; Thermal Solution Assembly; Solder-Down Anchors; Figure 7 1U Gmch Heat Sink - Intel 945G Thermal Design Manual

Express chipset graphics and memory controller hub (gmch) for embedded applications

Hide thumbs Also See for 945G:

Table of Contents

Intel

945G Express Chipset GMCH Thermal Design Guide

Reference Thermal Solution

4.2

Mechanical Design Envelope

The motherboard component keep-out restrictions for the GMCH on a 1U platform are included

in Section 4.4, Figure 8 and Figure 9.

This heat sink extends 32.32 mm (1.272 in.) nominally above the board when mounted. System

integrators should ensure no board or chassis components would intrude into the volume occupied

by the GMCH thermal solution.

4.3

The reference thermal solution for the GMCH for the 1U server platform is shown in Figure 7 and

Appendix B and is a copper heat sink attached to the motherboard with a wire clip and two

motherboard anchors. The heat sink is attached to the motherboard by assembling the anchors into

the board, placing the heat sink over the GMCH and then fastening the clip to the anchors. A

thermal interface material (Honeywell* PCM45F) is pre-applied to the heat sink bottom over an

area which contacts the package die.

For information on the reference solution for the ATX and BTX form factors refer to the Intel

945G/945P Express Chipset Family Thermal and Mechanical Design Guidelines.

Figure 7

1U GMCH Heat Sink

4.3.1

For platforms that have very limited board space, a clip retention solder-down anchor has been

developed to minimize the impact of clip retention on the board. It is based on a standard three-

pin jumper and is soldered to the board like any common through-hole header. A new anchor

design is available with 45° bent leads to increase the anchor attach reliability over time. The part

number and vendor information are contained in Appendix A.

Order #308643

Table of Contents