R
Figure 5. Example Complementary Test Board Connections
3.2.2
TMTV Thermal Operation
The heater located within the TMTV die should be accessed by connecting two sets of eight (8)
solder balls to each side of a power supply in parallel. The heater consists of a resistor and the
polarity of the power supply connections is arbitrary. The package balls to access the heater are
identified in Table 4. Ball reference designations can be found in Figure 4 and Figure 5. A graphical
representation of the die heater and its connections are shown in Figure 6.
Table 4. TMTV Heater Connections
AK10, AM9, AL9, AM10, AL10, AG11, AK9, AN10
AG28, AF28, AF29, AG27, AH27, AG29, AH26, AH29
Figure 6. TMTV Die Heater Representation
®
Intel
848P Chipset Thermal Design Guide
DC Row
Isolation
Test
Points
Ball Designation
HEATER
END 1
Thermal Metrology
Board
Trace
Package
Trace
Via to
Board
Backside
Connection
Heater End 1
Heater End 2
HEATER
END 2
17