Mechanical Specifications - Seco SM-C12 User Manual

Smarc rel. 2.0 compliant module with nxp i.mx 8m applications processors
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2.4 Mechanical Specifications

®
According to SMARC
specifications, the board dimensions are: 50 x 82 mm (1.97" x 3.23")
including the pin numbering and edge finger pattern.
Printed circuit of the board is made of ten layers, some of them are ground planes, for disturbance
rejection.
The MXM connector accommodates various connector heights for different carrier board
applications needs.
When using different connector heights, please consider that, according to SMARC
specifications, components placed on bottom side of SM-C12 will have a maximum height of
1.3mm. Keep this value in mind when choosing the MXM connector's height, if there is the need
to place components on the carrier board in the zone below the SMARC module.
2.5 Supported Operating Systems
SM-C12 module supports the following operating systems:
Linux
Android
SECO will offer the BSP (Board Support Package) for these O.Ss, to reduce at minimum SW development of the board, supplying all the drivers and libraries needed
for use both with the SMARC board and the Carrier Board, assuming that the Carrier Board is designed following SECO SMARC Design Guide, with the same IC's.
For further details, please visit https://www.seco.com.
SM-C12
SM-C12 User Manual - Rev. First Edition: 1.0 - Last Edition: 1.0 - Authors: S.B. and L.G - Reviewed by N.P. - Copyright © 2019 SECO S.p.A.
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