Thermal Design - Seco SM-C12 User Manual

4.1 Thermal Design

Highly integrated modules like SM-C12 offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating
frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed temperature range.
The operating temperature specified in the Technical Features of SM-C12 indicates the temperature range in which any and all parts of the heat spreader / heat sink
must remain, in order for SECO to guarantee functionality. Hence, these numbers do not necessarily indicate the suitable environmental temperature.
The heat spreader is not intended to be a guaranteed standalone cooling system, but should be used only as a supplemental means of transferring heat to another
dissipation system (i.e. heat sinks, fans, heat pipes etc).
It is the customer's responsibility to design and apply an application-dependent cooling system, capable of ensuring that the heat spreader / heat sink temperature
remain within the indicated range of the module.
It is an absolute requirement that the customer, after thorough evaluation of the processor's workload in the actual system application, the system enclosure and
consequent air flow/Thermal analysis, accurately study and develop a suitable cooling solution for the assembled system.
SECO can provide SM C12 specific heatspreaders and heatsinks, but please remember that their use must be evaluated accurately inside the final system, and that
they should be used only as a part of a more comprehensive ad-hoc cooling solutions.
Ordering Code Description
RC12-DISS-1-PK SMARC HEAT SPREADER: SM-C12 Heat Spreader (PASSIVE) - Packaged
RC12-DISS-2-PK SMARC HEAT SINK: SM-C12 Heat Sink (PASSIVE) - Packaged
SM-C12
SM-C12 User Manual - Rev. First Edition: 1.0 - Last Edition: 1.0 - Authors: S.B. and L.G - Reviewed by N.P. - Copyright © 2019 SECO S.p.A.
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