2. Schematic Checklist and PCB Layout Design
To avoid reboots caused by external interferences, the CHIP_PU trace should be as short as possible and routed
away from the clock lines. A pull-up resistor and a ground capacitor are highly recommended.
Notice:
CHIP_PU pin must not be left floating.
2.1.3 Flash
ESP32 can support up to four 16 MB external QSPI flash and SRAM chips. The demo flash used currently is an
SPI flash with 4 MB ROM, in an SOP8 (208 mil) package. The VDD_SDIO acts as the power supply pin. Make
sure to select the appropriate flash according to the power voltage on VDD_SDIO.
GPIO19
VDD3P3_CPU
GPIO23
GPIO18
GPIO5
SD_DATA_1
SD_DATA_0
SD_CLK
SD_CMD
SD_DATA_3
SD_DATA_2
GPIO17
VDD_SDIO
GPIO16
ESP32-D0WD
2.1.4 Crystal Oscillator
There are two clock sources for the ESP32, that is, an external crystal oscillator clock source and an RTC clock
source.
2.1.4.1 External Clock Source (Compulsory)
Currently, the ESP32 Wi-Fi/BT firmware only supports 40 MHz crystal oscillator. In circuit design, capacitors C1 and
C2 which connect to the ground are added to the input and output terminals of the crystal oscillator respectively.
The specific capacitive values depend on further testing of, and adjustment to, the overall performance of the
whole circuit. It is recommended that users reserve a series resistor of 0 Ω on the XTAL_P clock trace to reduce
the drive strength of the crystal, as well as to minimize the impact of crystal harmonics on RF performance. Note
that the accuracy of the selected crystal is ±10 ppm.
Espressif Systems
GND
C4
VDD33
0.1uF
38
GPIO19
37
36
GPIO23
35
GPIO18
34
GPIO5
33
SDI/SD1
SCS/CMD
32
SDO/SD0
31
SCK/CLK
SCK/CLK
30
SCS/CMD
29
SWP/SD3
SHD/SD2
28
SHD/SD2
27
GPIO17
26
25
GPIO16
C18
VDD_SDIO
1uF
GND
VDD33
Figure 4: ESP32 Flash
VDD_SDIO
1
/CS
DI
6
CLK
DO
7
/HOLD
/WP
U3
FLASH
GND
5
ESP32 Hardware Design Guidelines V2.7
5
SDI/SD1
2
SDO/SD0
3
SWP/SD3
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