Intel 82541PI Design Manual page 6

Dual footprint lom
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82541PI(ER) and 82562GZ(GX) Dual Footprint LOM Design Guide
3.5
Flash Interface ....................................................................................................... 15
3.6
Designing with 82541PI(ER) Gigabit Controllers ................................................... 15
3.6.3 82541PI(ER) Controller Power Supply Filtering .......................................... 17
3.6.5 82541PI(ER) Controller Test Capability ...................................................... 18
3.6.7 EEPROM Map Information.......................................................................... 19
3.6.9 Oscillators for 82541PI Controllers.............................................................. 21
3.6.10 82541PI(ER) Oscillator Solution.................................................................. 22
4.0
4.1
Guidelines for Component Placement ................................................................... 25
4.1.1 Crystals ....................................................................................................... 26
4.1.2 Board Stackup Recommendations.............................................................. 26
4.2
4.2.1 Distance A: Magnetics to RJ45 (Priority 1).................................................. 27
4.2.2 Distance B: PHY to Magnetics (Priority 2)................................................... 28
4.2.3 Distance C: LAN Controller to Chipset (Priority 3) ...................................... 28
4.2.5 Distance E: Ethernet Controller to PCB Edge ............................................. 28
4.3
Critical Dimensions for an Integrated Magnetics Module....................................... 29
4.3.2 Distance B: Ethernet Controller to Chipset.................................................. 29
4.3.3 Distance C: LAN Controller to PCB Edge ................................................... 29
4.4
Differential Pair Trace Routing ............................................................................... 29
4.4.1 Signal Trace Geometry ............................................................................... 31
4.4.2 Impedance Discontinuities .......................................................................... 32
4.4.3 Reducing Circuit Inductance ....................................................................... 32
4.4.4 Signal Isolation ............................................................................................ 32
4.4.5 Power and Ground Planes .......................................................................... 33
4.4.6 Traces for Decoupling Capacitors ............................................................... 33
4.4.7 Ground Planes Under a Discrete Magnetics Module .................................. 34
4.5
82562GZ(GX) Signal Terminations........................................................................ 38
4.5.1 Termination Plane ....................................................................................... 39
4.5.2 Termination Plane Capacitance .................................................................. 39
4.6
4.7
82541PI(ER) Signal Terminations.......................................................................... 40
vi
Application Note (AP-468)

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