Table Of Contents - Intel 82541PI Design Manual

Contents
1.0 Introduction .............................................................................................. 1
1.1 Scope .......................................................................................................................1
1.2 Terms .......................................................................................................................1
1.3 Reference Documents ............................................................................................. 2
1.4 Product Codes ......................................................................................................... 2
1.5 82541PI(ER) Gigabit Ethernet Controllers ............................................................... 2
1.6 82562GZ(GX) Platform LAN Connect (PLC) Devices..............................................3
1.6.1 Usage Modes ................................................................................................ 3
2.0 Frequency Control Device Design Considerations .............................. 5
2.1 Frequency Control Component Types ..................................................................... 5
2.2 Quartz Crystal .......................................................................................................... 5
2.3 Fixed Crystal Oscillator ............................................................................................ 6
2.4 Programmable Crystal Oscillators............................................................................ 6
2.5 Ceramic Resonator .................................................................................................. 6
3.0 Ethernet Component Design Guidelines ............................................... 7
3.1 General Design Considerations for Ethernet Controllers ......................................... 7
3.1.1 Crystal Selection Parameters........................................................................ 7
3.1.2 Reference Crystal........................................................................................11
3.1.3 Reference Crystal Selection........................................................................11
3.1.4 Circuit Board................................................................................................11
3.1.5 Temperature Changes ................................................................................12
3.2 Analog References for 82562GZ(GX) Designs......................................................12
3.3 Integrated Magnetics Module.................................................................................13
3.4 Designing with the 82562GZ(GX) Platform LAN Connect Device .........................13
3.4.1 Power Supplies for 82562GZ(GX) PLC Implementations ...........................13
3.4.2 82562GZ(GX) Device Test Capability .........................................................13
3.4.3 82562GZ/GX PLC Device LAN Disable Guidelines ....................................13
3.4.4 Serial EEPROM for 82562GZ(GX) Implementations ..................................14
3.4.5 Magnetics Modules for 82562GZ(GX) PLC Devices ...................................15
Application Note (AP-468)
82541PI(ER) and 82562GZ(GX) Dual Footprint LOM Design Guide
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