UP3D TECH CO.,LTD
1.1 Hardware Configuration........................................................................................................... 5
1.2.2 Scanner Connection.................................................................................................................9
1.4 Device Diagnostics................................................................................................................. 10
1.5 Calibration.............................................................................................................................. 12
1.5.1 Step of calibration................................................................................................................ 12
UPDentalManager.......................................................................................................................................16
Ⅱ.
2.1 Main interface......................................................................................................................... 16
2.2 Order Management................................................................................................................. 18
2.3.1 General setting...................................................................................................................... 23
2.3.2 UPCAD Configuration........................................................................................................ 24
2.3.3 UPSCAN Configuration..................................................................................................... 26
2.3.4 Manage Users.......................................................................................................................28
.Authorization Management.........................................................................................................................30
Ⅲ
Model Scanning.......................................................................................................................................... 31
Ⅳ.
4.2 Use of accessories...................................................................................................................32
4.2.1 Die scan...............................................................................................................................32
4.2.2 Gypsum scan........................................................................................................................ 32
Side-lay articulator scan.................................................................................................................32
4.2.3 Impression scan....................................................................................................................33
4.2.5 Wax-up scanning................................................................................................................. 34
4.3 Main interface.........................................................................................................................35
4.3.1 Application panel................................................................................................................. 35
4.3.2 Tools.................................................................................................................................... 37
4.3.3 Camera panel.......................................................................................................................45
4.4 Scanning step...........................................................................................................................46
4.4.1 Multi-dies scanning.............................................................................................................46
4.4.2 Model scanning................................................................................................................... 47
4.4.3 Impression scan...................................................................................................................54
Contents
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