YASKAWA V1000 Installation Manual page 11

Table 2 Recommended Heatsink Plate Thermal Compounds
Manufacturer
Shin-Etsu Chemical Inc.
Dow Corning Toray Inc.
When applying the thermal compound, spread it over the surface of the heatsink plate. After
mounting the heatsink plate to the metal back panel, wipe away any excess compound from
around the heatsink plate.
Figure 3
Thermal compound
◆
Drive Heatsink Plate Installation Screw Size and Tightening
Torque
Screw size and torque specifications for heatsink plate installation screws that hold the drive
to a metal back panel are listed in
Voltage Class
Single-Phase 200 V class
Three-phase 200V class
YASKAWA ELECTRIC TOBP C710606 21D YASKAWA AC Drive - V1000 Finless Installation Guide
Type
Oil-based
compound
Silicone compound
for heat dissipation
Metal panel
Figure 4 Application of Thermal Compound
Table 3.
Table 3 Screw Size and Tightening Torque
Model
CIMR-V
BA0001 ~ BA0012
2A0001 ~ 2A0020
2A0030 ~ 2A0056
2A0069
3 Conditions of Acceptability
Model Recommended spread amount
G746
100 μm
Apply the coating evenly across the
surface
SC4471CV
Heatsink plate
V1000 Finless
Screw Size
M4 1.0 to 1.3 (0.74 to 0.96)
M4 1.0 to 1.3 (0.74 to 0.96)
M5 2.0 to 2.5 (1.48 to 1.84)
M6 4.0 to 5.0 (2.95 to 3.69)
Installation
screws
Tightening Torque
N m (ft-lbf)
11