This chapter describes the package components, the system configuration and the preparation for using this product for the
first time.
2.1 Package Components.................................................................................................................. 16
2.3 Name of Each Part ...................................................................................................................... 17
(1) System Configuration ........................................................................................................... 17
(1) Making the MCU File ........................................................................................................... 18
(2) Setting the Work Area .......................................................................................................... 18
(3) Downloading Firmware ........................................................................................................ 19
(4) Self-check ............................................................................................................................. 19
Chapter 2. Preparation
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