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Appendix C: System Specifications
Appendix C
System Specifications
Processors
Dual Intel Xeon 81xx/61xx/51xx/41xx/31xx series processors [Socket P0-LGA 3647 processor with up to 28 cores and a
thermal design power (TDP) of up to 205W, FPGA/Fabric processors not supported]
Note: Refer to the motherboard specifications pages on our website for updates to supported processors.
Chipset
Intel C624 chipset
BIOS
256 Mb AMI® Flash ROM
Memory
Supports up to 512GB of RDIMM or 2TB of 3DS LRDIMM DDR4-2666 (288-pin) ECC memory in 16 DIMM slots.
Note: See the memory section in Chapter 3 for details and our website for updates to supported memory.
SATA Controller
On-chip (Intel C624) controller
Drive Bays
Sixteen 3.5" hard drives in hot-swap drive carriers (option for additional two 2.5" hard drives in the rear)
PCI Expansion Slots
Four PCI Express 3.0 x8 Slots
Three PCI Express 3.0 x16 Slots
(Slots 2 and 3 occupied by controller and JBOD expansion port)
Motherboard
X11DPH-T; ATX form factor (12 x 9.6 in. / 305 x 244 mm.)
Chassis
836BE1C-R1K23B; 3U Rackmount, (WxHxD) 17.2 x 5.2 x 25.5 in. (437 x 132 x 647 mm)
System Cooling
Two 8-cm rear exhaust fans, three 8-cm middle cooling fans
Power Supply
Model: PWS-1K23A-1R
AC Input Voltages: 100-240 VAC
Rated Input Current: 15-12A (100-127Vac) / 825-7A (200-240Vac)
Rated Input Frequency: 50-60 Hz
Rated Output Power: 1200W
Rated Output Voltages: +12V (83A at 100-127Vac, 100A at 200-240Vac), +5Vsb (4A)
Operating Environment
Operating Temperature: 10º to 35º C (50º to 95º F)
Non-operating Temperature: -40º to 60º C (-40º to 140º F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
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