Diagrams; Circuit Boards Location - Sony HCD-M333 Service Manual

Q Q
3 7 6 3 1 5 1 5 0

6-1. Circuit Boards Location

REG BOARD POWER BOARD
AMP BOARD
LED BOARD
TRANS BOARD
MAIN BOARD
H/P BOARD
PANEL BOARD
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
T E
L 1 3 9 4 2 2 9 6 5 1 3
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1 / W or less unless otherwise
4
specified.
• : internal component.
f
• 5 : fusible resistor.
• C : panel designation.
The components identified by Les composants identifiés par
mark 0 or dotted line with mark une marque 0 sont critiques
0 are critical for safety.
pour la sécurité.
Replace only with part number Ne les remplacer que par une
specified. pièce portant le numéro spécifié.
• A : B+ Line.
• B : B– Line.
• H : adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
BD (CD) board
no mark : CD stop
BD (MD) board
no mark : MD stop
( ) : MD playback
TC board
no mark : FM
( ) : TAPE record
w w w
Other boards
no mark : FM
< > : CD stop
• Waveforms are taken with a oscilloscope.
.
Voltage variations may be noted due to normal produc-
tion tolerances.
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SECTION 6

DIAGRAMS

T/C BOARD MD DIGITAL BOARD
BD(MD) BOARD
BD(CD) BOARD
LOADING BOARD
• Circled numbers refer to waveforms.
• Abbreviation
AUS : Australian model
CH : Chinese model
CND : Canadian model
HK
: Hong Kong model
• Signal path.
F
: FM
J : CD
I : CD DIGITAL IN
E : PB (TAPE)
a : REC (TAPE)
p : PB (MD)
l : REC (MD)
J : USB
For printed wiring boards.
Note:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
a : Through hole.
• : Pattern from the side which enables seeing.
Caution:
Pattern face side: Parts on the pattern face side seen from
(SIDE B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(SIDE A) the parts face are indicated.
• Indication of transistor
B C E
These are omitted.
B C E
These are omitted.
x a o u 1 6 3
y
C
i
Q These are omitted.
B E
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8 9
• Waveforms
BD (CD) Board
1
IC103 qg (RFAC)
(PLAY mode)
1.2 Vp-p
200mV/DIV, 400ns/DIV
2
IC101 us (XTAO)
29.5 ns
4.4 Vp-p
1V/DIV, 10ns/DIV
MAIN Board
8
IC101 qa (XCOUT)
3.6 Vp-p
Q Q
30.5 µ s
3 7 6 3 1 5 1
1 V/DIV, 10 µ s/DIV
9
IC101 qd (XOUT)
2.8 Vp-p
62.6 ns
1 V/DIV, 20 ns/DIV
TC Board
qg
Q642 collector (TAPE REC)
12.5 Vp-p
12 µ s
5 V/DIV, 4 µ s/DIV
c o
.
47 47
2 4 2
9 8
BD (MD) Board
3 5
IC101 ek (RF) IC101 wh (TE)
(PLAY mode) (PLAY mode)
approx.
620 mVp-p
1.4 Vp-p
500 mV/DIV, 200 ns 200 mV/DIV, 20 ms/DIV
4 6
IC101 ef (FE) IC803 8 (XOUT)
(PLAY mode)
approx.
88.6 ns 4.3 Vp-p
460 mVp-p
200 mV/DIV, 20 ms/DIV 1 V/DIV, 40 ns/DIV
MD DIGITAL Board
q; qs
IC702 9 (XCOUT) IC752 5
3.7 Vp-p
83ns 4.5 Vp-p
30.5 µ s
5 0 8 9 2 4 9 8
1V/DIV, 10 µ s/DIV 1V/DIV, 40ns/DIV
qa qd
IC702 qa (XOUT) IC703 wd (XI)
3.7 Vp-p
100 ns
167 ns 4.8 Vp-p
1 V/DIV, 40 ns/DIV 1V/DIV, 100ns/DIV
m
HCD-M333
Ver 1.1 2003.05
9 9
7
IC801 5 (CLKA)
3.3 Vp-p
5.5 ns
1V/DIV, 4 ns/DIV
qf
IC704 ws (XO)
100ns 3.5 Vp-p
2 9 9
1V/DIV, 40ns/DIV