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3-1. Top Panel Section ······················································· 17
3-2. Cassette Mechanism Deck ········································· 18
3-3. Front Panel Section ···················································· 18
3-4. PANEL Board, H/P Board, LED Board ····················· 19
3-5. Back Panel Section ····················································· 20
3-6. MAIN Board ······························································ 20
3-7. MD Mechanism Deck (MDM-7S2D) ························ 21
3-8. MD DIGITAL Board ·················································· 21
3-9. Holder Assy ································································ 22
3-10. BD (MD) Board ························································· 22
3-11. Motor Section ····························································· 23
3-12. Over Write Head (HR901) ········································· 23
3-13. Mini Disc Device (KMS-262E) ································· 24
3-14. POWER Board, Tuner (FM/AM) ······························· 24
3-15. REG Board, AMP Board ············································ 25
3-16. TRANS Board ···························································· 25
3-17. CD Mechanism Deck (CDM55A-30BBD61B) ········· 26
3-18. Cam (CDM55) ··························································· 26
3-19. Base Unit (BU-30BBD61B) ······································ 27
3-20. Optical Pick Up (BU-30B Assy) ································ 27
TAPE SECTION ·································································· 33
CD SECTION ······································································ 35
MD SECTION ····································································· 36
······································································ 44
6-1. Circuit Boards Location ············································· 47
- CD Section - ··························································· 48
- MD Section - ·························································· 49
- USB Section - ························································· 50
- MAIN Section - ······················································ 51
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
www
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
.
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
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TABLE OF CONTENTS
6-3. Printed Wiring Board - BD (CD) Board - ················· 52
6-4. Schematic Diagram - BD (CD) Board - ··················· 53
6-5. Printed Wiring Board - BD (MD) Board - ················ 54
6-6. Schematic Diagram - BD (MD) Board (1/2) - ·········· 55
6-7. Schematic Diagram - BD (MD) Board (2/2) - ·········· 56
6-8. Printed Wiring Board - MD DIGITAL Board - ········ 57
6-11. Printed Wiring Board - TC Board - ·························· 60
6-12. Schematic Diagram - TC Board - ····························· 61
6-13. Printed Wiring Board - MAIN Section - ··················· 62
6-14. Schematic Diagram - MAIN Section (1/2) - ············· 63
6-15. Schematic Diagram - MAIN Section (2/2) - ············· 64
6-16. Printed Wiring Board - H/P Board - ························· 65
6-17. Schematic Diagram - H/P Board - ···························· 66
6-18. Printed Wiring Board - PANEL Section - ················· 67
6-19. Schematic Diagram - PANEL Section - ···················· 68
6-20. Printed Wiring Board
- REG Board / TRANS Board - ································ 69
6-22. Printed Wiring Board - AMP Board - ······················· 71
6-23. Schematic Diagram - AMP Board - ·························· 72
6-24. Printed Wiring Board - POWER Board - ·················· 73
6-25. Schematic Diagram - POWER Board - ···················· 74
6-26. IC Block Diagrams ····················································· 75
6-27. IC Pin Function Description ······································ 84
7-1. Overall Section ··························································· 90
7-2. Front Panel Section ···················································· 91
7-3. Back Panel Section ····················································· 92
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7-4. MD Mechanism Deck Section-1 (MDM-7S2D) ········ 93
7-5. MD Mechanism Deck Section-2 (MDM-7S2D) ········ 94
(CDM55A-30BBD61B) ············································· 95
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
u163
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
.
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
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À LA SÉCURITÉ!
co
HCD-M333
Ver 1.1 2003.05
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