Diagrams; Circuit Boards Locations -Escs:ccrrerteeeeeeseeeeeeeeeeeeeaeecsnesenaeees - Sony HCD-CP11 Service Manual

Micro hi-fi component system
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SECTION
6
DIAGRAMS
NOTE
FOR
PRINTED
WIRING
BOARDS
AND
SCHEMATIC
DIAGARAMS
Note on Printed Wiring Board:
Note on Schematic Diagram:
* o———
: parts extracted from the component side.
* Allcapacitors are in pF unless otherwise noted. pF: uF
°
: parts extracted from the conductor side.
50 WV or less are not indicated except for electrolytics
: Pattern from the side which enables seeing.
and tantalums.
¢ All resistors are in Q and '/4 W or less unless otherwise
specified.
*
A
internal component.
¢ (~~ : panel designation.
* Waveforms
Note:
ee
fer
Ss
".
The components identi-
es composants
identifiés par
MAN
Board
fied by mark A\ or dotted | une marque A\ sont critiques:
SSS
ee
ee
line with mark A\ are criti- | pour la sécurité.
cal for safety.
Ne les remplacer que par une
®
IC801
Replace only with part | piéce
portant
le numéro
number specified.
spécifié.
°
: B+ Line.
e
: B- Line.
4.6Vp-p
¢ [=] : adjustment for repair.
238ns
* Voltages are taken with a VOM (Input impedance 10 MQ).
Voltage variations may be noted due to normal produc-
tion tolerances.
Q) IC801
@
* Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
* Circled numbers refer to waveforms.
¢ Signal path.
"30.5us
5.0Vp-p
>
:TUNER
) _ : TAPE PLAY
))
: TAPE RECORD
>
-:CD PLAY (ANALOG OUT)
@) ics04 @
>
:CD PLAY (OPTICAL OUT)
e
Abbreviation
EA _ : Saudi Arabia model.
AUS
: Australian model.
SP
—_: Singapore model.
MY _ : Malaysia model.
peer
4.3Vp-p
TW __: Taiwan model.
HK — : Hong Kong model.
AR _ : Argentine model.
CND_
: Canadian model.
AED: North European model.
MX — : Mexican model.
KR _— : Korean model.
6-1. CIRCUIT BOARDS LOCATION
SPEAKER board
POWER board
LCD board
MAIN board
HEADPHONE board
CONTROL board
LOADING board
14

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