Sony HCD-M10 Service Manual
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Sony HCD-M10 Service Manual

Micro hi-fi component system
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SERVICE MANUAL
Ver 1.0 2002. 02
HCD-M10 is the Amplifier, MD deck, CD
player, Tape player and Tuner section in
CMT-M100MD.
Amplifier section
European model:
DIN power output (Rated):10 +10 watts
(6 ohms at 1 kHz,DIN)
Continuous RMS power output (Reference):
15 +15 watts
(6 ohms at 1 kHz,10% THD)
Music power output (Reference):
25 +25 watts
Other models:
DIN power output (Rated):10 +10 watts
(6 ohms at 1 kHz,DIN)
Continuous RMS power output (Reference):
15 +15 watts
(6 ohms at 1 kHz,10% THD)
Inputs
ANALOG IN (phono jacks):
voltage 250 mV,
impedance 47 kilohms
Sony Corporation
9-873-570-01
Home Audio Company
2002B0200-1
Published by Sony Engineering Corporation
© 2002.02
HCD-M10
Model Name Using Similar Mechanism
CD
CD Mechanism Type
Section
Base Unit Type
Optical Pick-up Type
Model Name Using Similar Mechanism
MD
MD Mechanism Type
Section
Optical Pick-up Type
Tape deck
Model Name Using Similar Mechanism
Section
Tape Transport Mechanism Type
SPECIFICATIONS
DIGITAL OPTICAL IN (Supported sampling
frequencies:32 kHz,44.1 kHz and 48 kHz)
Outputs
PHONES (stereo minijack):
SPEAKER:
CD player section
System
Laser
Frequency response
MICRO HI-FI COMPONENT SYSTEM
AEP Model
UK Model
E Model
Australian Model
HCD-J300
CDM55A1-K4BD43
BU-K4BD43
KSM-213DHAP
HCD-C5
MDM-7B4M
KMS-260E
HCD-J300
Mech deck
accepts headphones of
16 ohms or more.
accepts impedance of 6 to
16 ohms.
Compact disc and digital
audio system
Semiconductor laser
(λ =780 nm)
Emission duration:
continuous
2 Hz – 20 kHz (±0.5 dB)
— Continued on next page —

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  • Page 1 HCD-M10 SERVICE MANUAL AEP Model UK Model Ver 1.0 2002. 02 E Model Australian Model HCD-M10 is the Amplifier, MD deck, CD player, Tape player and Tuner section in CMT-M100MD. Model Name Using Similar Mechanism HCD-J300 CD Mechanism Type CDM55A1-K4BD43...
  • Page 2 5 Hz – 20 kHz (±0.5 dB) Tape deck section Recording system 4-track 2-channel stereo Frequency response 50 – 13,000 Hz (±3 dB), using Sony TYPE I cassettes Tuner section FM stereo,FM/AM superheterodyne tuner FM tuner section Tuning range 87.5 – 108.0 MHz...
  • Page 3 The sound source is a copy of a commercially refer to the following list. If any problem available music software. persists, consult your nearest Sony dealer. The Serial Copy Management System prevents making a digital copy (see page 57). Messages One of the following messages may appear or flash in the display during operation.
  • Page 4 HCD-M10 Self-diagnosis display (continued) Step Full! You tried to programme 26 or more tracks (steps). Push STOP! Complete! You pressed PLAY MODE/DIRECTION (or The editing operation of MDs is completed. PLAY MODE on the remote) during play. Disc Full! —Rehearsal—...

  • Page 5: Table Of Contents

    COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

  • Page 6: Servicing Notes

    HCD-M10 SECTION 1 SERVICING NOTE NOTES ON HANDLING THE OPTICAL PICK-UP This caution BLOCK OR BASE UNIT label is located inside The laser diode in the optical pick-up block may suffer electrostatic the unit. break-down because of the potential difference generated by the charged electrostatic load, etc.
  • Page 7 HCD-M10 DRAWING OUT THE TRAY DURING POWER OUT • Perform after removing front panel. tray gear(B) cam block First turn the whole of cam block in the arrow A direction with fingers, then put out tray by turning gear (B) in the arrow B direction.
  • Page 8 HCD-M10 JIG FOR CHECKING BD (MD) BOARD WAVEFORM The special jig (J-2501-196-A) is useful for checking the waveform of the BD (MD) board. The names of terminals and the checking items to be performed are shown as follows. GND : Ground...
  • Page 9 HCD-M10 CLEANING THE OPTICAL PICK-UP (CD PLAYER) 2 CD mechanism deck 1 Floating screw 4 Rotate it in the direction of the arrow A . 5 Move it in the direction of the arrow B . 6 Clean the lens block...

  • Page 10: General

    HCD-M10 SECTION 2 This section is extracted GENERAL from instruction manual. Main unit qj qh qg CD disc tray qs (9) PHONES jack qk BUTTON DESCRIPTIONS CD NX 3 (9, 11) PLAY MODE/DIRECTION qh Cover qj (9, 11, 13, 15, 17, 24, 30, ?/1 (power) 1 (8, 20, 30, 43, 46–48)
  • Page 11 HCD-M10 This section is extracted from instruction manual. Remote Control BASS/TRE 8 (49) GROUP SKIP qk (18, 22, 32, 34) BUTTON DESCRIPTIONS CD NX wd (9, 11) MD z 0 (21, 25, 28) CLEAR wa (11, 13, 17, 31, 45)

  • Page 12: Disassembly

    HCD-M10 SECTION 3 DISASSEMBLY • The equipment can be removed using the following procedure. Case (R), Case (L) Chassis section Back panel Top cover section Front panel section PANEL board, BL board, JACK board TC board, mechanism deck MAIN board, tuner...
  • Page 13 HCD-M10 Note: Follow the disassembly procedure in the numerical order given. 3-1. CASE (R), CASE (L), TOP COVER SECTION qs Top cover section qa Wire (flat type) (CN203) 7 Screw (+BVTP 3X10) 8 Case (L) 9 Ground terminal 6 Two screws (case 3 TP2)
  • Page 14 HCD-M10 3-3. PANEL BOARD, BL BOARD, JACK BOARD 1 Two screws (+BVTP2.6X8) 4 Wire (flat type) (CN501) 5 Connector (CN502) 6 PANEL board 9 BL board 2 Five screws (+BVTP2.6X8) 7 Lid (LCD) 8 Two solderings qa Ground plate (HP)
  • Page 15 HCD-M10 3-5. MAIN BOARD, TUNER 1 Wire (flat type) (CN903) 0 Wire (flat type) (15 core) qs Tuner 6 Wire (flat type) (CN105) qa Screw (+BVTP3X8) 9 Connector (CN101) qd MAIN board 4 Screw (+BVTT3X6) 2 Connector (CN202) 3 Screw (+BVTT3X6)
  • Page 16 HCD-M10 3-7. MD MECHANISM DECK 2 Screw (+BVTT3X6) 1 Screw (+BVTT3X6) Ground lug 3 Shield (MDM) 4 Screw (+BTN1.7X3) 7 Four step screws (+BVTTWH M3) Ground lug 6 Wire (flat type) (CN703) 8 MD mechanism deck 5 Wire (flat type) (CN702) 3-8.
  • Page 17 HCD-M10 3-9. CD MECHANISM DECK 4 CD mechanism deck 1 Screw (+BVTT3X6) 2 Two hooks 3-10. HOLDER SECTION 5 Holder section 1 Tension spring (holder) 2 Hook...
  • Page 18 HCD-M10 3-11. BD BOARD 1 Remove two solderings 2 Remove two solderings (sled motor) (spindle motor) M702 6 Flexible board (CN101) M701 3 Remove two M703 solderings (loading motor) S102 4 Remove three solderings (switch) 5 Two screws (+BP TRI 2X6 CZN)
  • Page 19 HCD-M10 3-13. OP SUB SECTION 9 OP sub section 6 Main shaft 3 Screw (+BP TRI 2X6 CZN) 4 Base (BU-A) 8 Flexible board 5 Base (BU-A) 1 Screw (+BP TRI 2X6 CZN) 2 Base (BU-D) 3-14. LOADING MOTOR ASSEMBLY, SPINDLE MOTOR ASSEMBLY, SLED MOTOR ASSEMBLY...
  • Page 20 HCD-M10 3-15. CAM (CDM55), LOADING BOARD 4 Belt (CDM55) 5 Spacer (55) 6 Pulley (LDG) 8 Gear (B) 9 Gear (A) 7 Roller q; Cam (CDM55) 2 Push the claw in the direction of the arrow C . 1 Pull out the tray in the direction of the arrow A .
  • Page 21 HCD-M10 3-17. CD BOARD, CD OPTICAL PICK-UP (KSM-213DHAP) 2 Two floating screws (+PTPWHM2.6) qs Optical pick-up (KSM-213DHAP) 8 Two insulators 3 Two floating screws (+PTPWHM2.6) q; Remove the four solderings from the bottom. 1 Wire (flat type) (CN102) 7 Two insulators qa CD board 9 Screw (+BTP2.6X6)

  • Page 22: Test Mode

    HCD-M10 SECTION 4 TEST MODE Note 1: About “R” As this unit has only a few buttons, some operations require the use of remote commander (RM-SM100E/provided with unit) buttons. These operations are indicated as “R” in this manual. [MENU/NO] Example: ...Press the...
  • Page 23 HCD-M10 4. CD Ship Mode (Setting the Position for Transportation) Press ?/1 button to turn the power on. Press FUNCTION to change the function to “CD”. Press three buttons x , ENTER/START and CD u simultaneously. The CD mechanism goes to the transportation mode.
  • Page 24 HCD-M10 5. SELECTING THE TEST MODE There are 26 types of test modes as shown below. The groups can be switched by pressing the “R” or “R” button. After selecting > the group to be used, press the ENTER/YES “R” button. After setting a certain group, pressing the “R”...
  • Page 25 HCD-M10 5-1. Operating the Continuous Playback Mode Entering the continuous playback mode (1) Set the disc in the unit. (Whichever recordable discs or discs for playback only are available) (2) Press the “R” or “R” button to display “CPLAY 1MODE” (C34).
  • Page 26 HCD-M10 7. AUTOMATIC SELF-DIAGNOSIS FUNCTION This test mode performs CREC and CPLAY automatically for mainly checking the characteristics of the optical pick-up. To perform this test mode, the laser power must first be checked. Perform AUTO CHECK after the laser power check and Iop Compare.

  • Page 27: Electrical Adjustments

    HCD-M10 SECTION 5 ELECTRICAL ADJUSTMENTS 3. Mode: Playback DECK SECTION 0 dB=0.775V 1. Demagnetize the record/playback head with a head demagne- test tape tizer. P-4-A100 J301 2. Do not use a magnetized screwdriver for the adjustments. (10kHz, –10dB) PHONES 3. After the adjustments, apply suitable locking compound to the...
  • Page 28 HCD-M10 Record Level Check CD SECTION Procedure: Note : 1. CD Block is basically designed to operate without adjustment. 1. Press FUNCTION button to select ANALOG IN. Therefore, check each item in order given. 2. Insert a tape into deck, press the z TAPE button, and then press 2.
  • Page 29 HCD-M10 RF PLL Free-run Frequency Procedure : 1. Connect frequency counter to TP (XPCK) with lead wire. frequency counter CD BOARD TP (XPCK) – 2. Turn the power on. 3. Put the disc (YEDS-18) in to play the number five track.
  • Page 30 HCD-M10 MD SECTION Note 1:About “R” As this unit has only a few buttons, some operations require the use of remote commander (RM-SM100E/provided with unit) buttons. These operations are indicated as “R” in this manual. [MENU/NO] Example: ...Press the button of the remote commander.
  • Page 31 HCD-M10 Flow Chart for Adjustment Start After turning the power off and on, initialises the non-volatile IC195 replacement memory (EEPROM). 7. Initial setting of adjustment value (See page 36) OP or IC195 replacement IC101, IC195 or D101 9. Temperature compensation offset adjustment (See page 36)
  • Page 32 HCD-M10 2. PRECAUTIONS FOR CHECKING LASER DIODE 5. When observing several signals on the oscilloscope, etc., make sure that VC and ground do not connect inside the EMISSION oscilloscope. To check the emission of the laser diode during adjustments, never (VC and ground will become short-circuited.)
  • Page 33 HCD-M10 5. USING THE CONTINUOUSLY RECORDED DISC Procedure: 1. Set the laser power meter on the objective lens of the optical * This disc is used in focus bias adjustment and error rate check. pick-up. (When it cannot be set properly, press the m button The following describes how to create a continuous recording or M button to move the optical pick-up.)
  • Page 34 HCD-M10 6-4. Auto Check 6-6. Traverse Check This test mode performs CREC and CPLAY automatically for mainly checking the characteristics of the optical pick-up. To Note 1:Data will be erased during MO reading if a recorded disc is used in this adjustment.
  • Page 35 HCD-M10 6-7. Focus Bias Check 9. Press the ENTER/YES “R” button to display “EFB = Change the focus bias and check the focus tolerance amount. P”. Procedure: Then, the optical pick-up moves to the pit area automatically 1. Load the test disc (MDW-74/GA-1).
  • Page 36 HCD-M10 7. INITIAL SETTING OF ADJUSTMENT VALUE Procedure: 1. Press the “R” or “R” button to display “TEMP > ADJUST” (C03). Note: Mode which sets the adjustment results recorded in the non-volatile 2. Press the ENTER/YES “R” button to select the “TEMP memory to the initial setting value.
  • Page 37 HCD-M10 6. Press the “R” or “R” button so that the reading 11. Iop NV SAVE > of the laser power meter becomes the specified value, press Write the reference values in the nonvolatile memory to perform the ENTER/YES “R” button to save it.
  • Page 38 HCD-M10 8. Press the “R” or “R” button so that the waveform > 18. Press the ENTER/YES “R” button, display “EFB = SAVE” of the oscilloscope becomes the specified value. for a moment and save the adjustment results in the non-volatile (When the “R”...
  • Page 39 HCD-M10 14. ERROR RATE CHECK 16. AUTO GAIN CONTROL OUTPUT LEVEL ADJUSTMENT 14-1. CD Error Rate Check Be sure to perform this adjustment when the optical pick-up is Procedure: replaced. 1. Load the check disc (TDYS-1). If the adjustment results becomes “Adjust NG!”, the optical pick- 2.
  • Page 40 HCD-M10 Adjustment and checking Loacation: – BD BOARD (Side A) – – BD BOARD (Side B) – CN101 D101 IC101 CN105 IC102 * NOTE IC151 IC190 IC195 CN103 CN102 Note: It is useful to use the jig for checking the waveform. (Refer to Ser-...

  • Page 41: Diagrams

    HCD-M10 SECTION 6 DIAGRAMS WAVEFORMS – CD BOARD – THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. – BD BOARD – (In addition to this, the necessary note is printed in each block.) Note on Schematic Diagram:...

  • Page 42: Block Diagram - Cd Board

    HCD-M10 6-2. BLOCK DIAGRAM – CD SECTION – IC601 IC602 SELECTOR DIGITAL OPTICAL SECTION Q102 SWITCH IC101 OPTICAL PICK-UP IC103 DIGITAL SERVO, BLOCK DIGITAL SIGNAL PROCESSOR RF AMP D OUT RFAC RFAC RFDCO RFDC IC306(1/3) MASTER CONTROL CTRL1(1-2) Q101 XTSL...

  • Page 43: Block Diagram - Md Board

    HCD-M10 BLOCK DIAGRAM – MD SECTION – IC151 (1/2) IC181, Q181 182 EFMO ADDT OVER WRITE HEAD DRIVE DADTI FILI SAMPLING DADTI HR901 SCTX RATE OVER WRITE HEAD XBCKI XBCKI CONVERTER IC151 (1/2) CLTV LRCKI LRCKI DIGITAL SIGNAL PROCESSOR, EFM/ACIRC ENCODER/DECODER,...

  • Page 44: Block Diagram - Main Board

    HCD-M10 BLOCK DIAGRAM – MAIN SECTION – MD-L • R-CH is omitted due to same as L-CH. IC101 SECTION • Signal Path SOUND PROCESSOR : FM LINEOUT1 REC-L : CD(ANALOG) IC901 POWER AMP VOL1 29 : PB(TAPE) TM880 OUT1 : REC(TAPE)

  • Page 45: Block Diagram - Panel Board

    HCD-M10 BLOCK DIAGRAM – PANEL SECTION – IC306(2/3) FL801 MASTER CONTROL IC801 LIQUID CRYSTAL DISPLAY UNIT REMOTE BACK UP SIRCS SENSOR XC-IN PC POWER J302 LCD-DATA X801 PC LINK Q260 32.768kHz XC-OUT LCD-SCK I2C-CLK SWITCH IIC-CLK S833 POWER KEY LCD-CS...

  • Page 46: Printed Wiring Board - Cd Board

    HCD-M10 6-3. PRINTED WIRING BOARD – CD BOARD – • See page 41 for Circuit Boards Location. S101 (LIMIT IN) IC702 (DVC1.65V) (TE) (XPCK) IC101 (RFAC) IC103 MAIN BOARD (Page 53) • Semiconductor Location Ref. No. Location D101 IC101 IC103...

  • Page 47: Schematic Diagram - Cd Board

    HCD-M10 6-4. SCHEMATIC DIAGRAM – CD BOARD – • See page 41 for Waveforms. • See page 70 for IC Block Diagrams.

  • Page 48: Printed Wiring Board - Bd Board

    HCD-M10 6-5. PRINTED WIRING BOARD – BD BOARD – • See page 41 for Circuit Boards Location. DIGITAL DIGITAL BOARD BOARD (Page 54) (Page 54) IC181 IC195 IC190 IC151 IC102 IC101 • Semiconductor • Semiconductor Location Location SIDE A SIDE B Ref.

  • Page 49: Schematic Diagram - Bd Board (1/2)

    HCD-M10 6-6. SCHEMATIC DIAGRAM – BD BOARD (1/2) – • See page 41 for Waveforms. • See page 63 for IC Pin Function Description. • See page 70 for IC Block Diagrams.

  • Page 50: Schematic Diagram - Bd Board (2/2)

    HCD-M10 6-7. SCHEMATIC DIAGRAM – BD BOARD (2/2) – • See page 41 for Waveforms. • See page 64 for IC Pin Function Description. IC153 MSM51V4400E -70FS-K (Page 55) (Page 55)

  • Page 51: Schematic Diagram - Main Oard (1/2)

    HCD-M10 6-8. SCHEMATIC DIAGRAM – MAIN BOARD (1/2) – • See page 66 for IC Pin Function Description.

  • Page 52: Schematic Diagram - Main Board (2/2), Loading Board

    HCD-M10 6-9. SCHEMATIC DIAGRAM – MAIN BOARD (2/2), LOADING BOARD – • See page 71 for IC Block Diagrams.

  • Page 53: Printed Wiring Board - Main Board,Loading Board

    HCD-M10 6-10. PRINTED WIRING BOARDS – MAIN BOARD, LOADING BOARD – • See page 41for Circuit Boards Location. MD DIGITAL BOARD BOARD BOARD MAIN BOARD (Page 56) (Page 54) (Page 60) PANEL BOARD (Page 58) MD DIGITAL BOARD BOARD LOADING BOARD...

  • Page 54: Printed Wiring Board - Md Digital Board -54

    HCD-M10 6-11. PRINTED WIRING BOARD – MD DIGITAL BOARD – • See page 41 for Circuit Boards Location. MAIN BOARD (Page 53) IC201 IC211 BOARD (Page 48) MAIN BOARD (Page 53) BOARD (Page 48) IC871 IC701 IC861 • Semiconductor Location Ref.

  • Page 55: Schematic Diagram - Md Digital Board

    HCD-M10 6-12. SCHEMATIC DIAGRAM – MD DIGITAL BOARD – • See page 41 for Waveforms. • See page 68 for IC Pin Function Description. • See page 71 for IC Block Diagrams. MAIN (2/2) (Page 52) MAIN (2/2) (Page 52)

  • Page 56: Printed Wiring Board - Tc Board

    HCD-M10 6-13. PRINTED WIRING BOARD – TC BOARD – • See page 41 for Circuit Boards Location. TC BOARD MAIN BOARD (Page 53) TAPE MECHANISM DECK TAPE MECHANISM DECK • Semiconductor Location Ref. No. Location D1001 D1002 D1003 1-683-063- (13)

  • Page 57: Schematic Diagram - Tc Board

    HCD-M10 6-14. SCHEMATIC DIAGRAM – TC BOARD – • See page 41 for Waveforms.

  • Page 58: Jack Board

    HCD-M10 6-15. PRINTED WIRING BOARDS – PANEL BOARD, BL (AMBER), BL (WHITE), JACK BOARD – • See page 41 for Circuit Boards Location. MAIN BL (WHITE) BOARD BOARD PANEL BOARD (Page 55) BL (AMBER) BOARD > > M 1-683-064- (13)

  • Page 59: Jack Board

    HCD-M10 6-16. SCHEMATIC DIAGRAM – PANEL BOARD, BL (AMBER), BL (WHITE), JACK BOARD –...

  • Page 60: Amp Board, Power Board

    HCD-M10 6-17. PRINTED WIRING BOARDS – AMP BOARD, POWER BOARD – • See page 41 for Circuit Boards Location. POWER BOARD MAIN BOARD (Page 53) AMP BOARD (CHASSIS) SPEAKER T900 POWER TRANSFORMER • Semiconductor Location Ref. No. Location D901 D902...

  • Page 61: Schematic Diagram - Amp Board

    HCD-M10 6-18. SCHEMATIC DIAGRAM – AMP BOARD – SPEAKER (Page 52) (Page 62)

  • Page 62: Schematic Diagram - Power Board

    HCD-M10 6-19. SCHEMATIC DIAGRAM – POWER BOARD –...

  • Page 63: Ic Pin Function Description

    HCD-M10 6-20. IC PIN FUNCTION DESCRIPTION • IC101 CXA2523AR RF AMPLLFLER (BD BOARD) Pin No. Pin Name Description I-V converted RF signal I input I-V converted RF signal J input Middle point voltage (+1.5V) generation output 4 to 9 A to F...
  • Page 64 HCD-M10 • IC151 CXD2662R DIGITAL SIGNAL PROCESSOR, DIGITAL SERVO SIGNAL PROCESSOR (BD BOARD) Pin No. Pin Name Description Function FOK signal output to the system control (monitor output) MNT0 (FOK) “H” is output when focus is on (Not used) MNT1 (SHCK)
  • Page 65 HCD-M10 Pin No. Pin Name Description AVSS — Ground (Analog) O (3) Phase comparison output for the recording/playback EFM master PLL FILI I (A) Filter input for the recording/playback EFM master PLL FILO O (A) Filter output for the recording/playback EFM master PLL...
  • Page 66 HCD-M10 • IC306 M30622MGA-A83FP MASTER CONTROL (MAIN BOARD) Pin No. Pin Name Description — Not used (ground) POWER-ON Power relay ON/OFF signal output (H=ON,L=OFF) XTSL XTSL signal output for CXD3068Q SIRCS Remote control receiver data signal input DA_MUTE D/A (MD) muting control signal output...
  • Page 67 HCD-M10 Pin No. Pin Name Description H/P_CHECK Headphone detect signal input H/P_MUTE Headphone muting control signal output AMP_MUTE Power amplifier muting control signal output (L=ON,H=OFF) VOL_CLK Volume clock signal output VOL_DATA Volume data signal output STK_POWER Power amplifier ON/OFF signal output (H=ON,L=OFF)
  • Page 68 HCD-M10 • IC701 M30803MG-A07FP SYSTEM CONTROL (MD DIGITAL BOARD) Pin No. Pin Name Description (FLDT) — Not used (FLCK) — Not used (LEVEL-L) — Not used (LEVEL-R) — Not used — — Not used — — Not used — —...
  • Page 69 HCD-M10 Pin No. Pin Name Description D-RESET Digital reset signal output to CXD2662R and Motor driver REC-SW Detection signal input from the recording position detection switch (L: Record) WRPWR Write power ON/OFF output (L:OFF, H: ON) LIMIT-IN Detection signal input from the limit switch (L: Sled limit in, H: Sled limit out)
  • Page 70 HCD-M10 • IC BLOCK DIAGRAMS – CD BOARD – IC101 CXD3068Q IC103 CXA2581N-T4 RW/ROM DC OFST RFDCI – – RFDCO – RW/ROM VOFST APC AMP EQ ON/OFF RFAC EQ IN RW/ROM RFAC AC SUM SUMMING VOFST – – RW/ROM TE BAL RW/ROM –...
  • Page 71 HCD-M10 – MAIN BOARD, MD DIGITAL BOARD – – MAIN BOARD – IC603 BA6956AN (MAIN BOARD) IC301 BU1924F IC871 BA6956AN (MD DIGITAL BOARD) CLOCK TEST DEFFERENTIAL BIPHASE PLL 57KHz CONTROL LOGIC DECODER DECODER 1187.5Hz RDS/ARI 8TH SWITCHED CAPACITOR FILTER – MD DIGITAL BOARD –...

  • Page 72: Exploded Views

    HCD-M10 SECTION 7 EXPLODED VIEWS NOTE: • -XX, -X mean standardized parts, so they may • Abbreviation The components identified by mark 0 or have some differences from the original one. HK : Hong Kong model dotted line with mark 0 are critical for safety.
  • Page 73 HCD-M10 7-2. FRONT PANEL SECTION not supplied FL801 not supplied Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 4-239-731-01 FOOT (FELT) 4-985-672-31 SCREW (+PTPWH M2.6), FLOATING 4-236-664-01 LID (REC) (WHITE) 4-236-664-11 LID (REC) (SILVER) 4-231-954-01 SPRING (LID MD), TORSION...
  • Page 74 HCD-M10 7-3. TOP COVER SECTION not supplied not supplied not supplied Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 4-224-116-01 BRACKET (PUSH) 4-236-674-05 LID (TC) (WHITE) 4-224-117-11 SPRING (PUSH),COMPRESSION 4-236-674-15 LID (TC) (SILVER) 4-236-678-01 CATCHER, PUSH...
  • Page 75 HCD-M10 7-4. CHASSIS SECTION not supplied not supplied not supplied F902 not supplied not supplied MDM-7B4M T900 supplied supplied CDM55A1-K4BD43 not supplied Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 4-236-670-01 PANEL, LOADING (WHITE) A-4727-748-A AMP BOARD, COMPLETE (AEP,UK)
  • Page 76 HCD-M10 7-5. MD MECHANISM DECK SECTION-1 (MDM-7B4M) not supplied supplied not supplied Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 4-996-267-01 BASE (BU-D) A-4680-638-B RETAINER COMPLETE ASSY 4-231-319-01 SCREW (2X6) CZN, +B (P) TRI 4-226-995-01 SLIDER (EJ)
  • Page 77 HCD-M10 7-6. MD MECHANISM DECK-2 (MDM-7B4M) HR901 S102 M101 M102 M103 Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 4-231-319-01 SCREW (2X6) CZN, +B (P) TRI 4-226-992-01 BASE, SL 3-372-761-01 SCREW (M1.7), TAPPING 4-230-716-01 SPRING (SPDL), TORSION...
  • Page 78 HCD-M10 7-7. CD MECHANISM DECK-1 (CDM55A1-K4BD43) M901 BU-K4BD43 Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 4-925-315-31 DAMPER 4-220-234-01 PULLEY (LDG) 4-224-894-01 TRAY 1-674-336-12 LOADING BOARD 4-220-237-01 GEAR (A) 4-220-229-01 LEVER (SW) 4-221-815-01 ROLLER 4-220-239-01 SPRING, TORSION...
  • Page 79 HCD-M10 7-8. CD MECHANISM DECK-2 (BU-K4BD43) Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 4-229-358-01 SHAFT (BU21) 4-229-005-21 INSULATOR 4-231-780-01 HOLDER (213D) 4-985-672-01 SCREW (+PTPWHM2.6), FLOATING 4-229-004-01 SPRING, COMPRESSION 0 558 A-4735-357-A DEVICE,OPTICAL KSM213DHAP/Z-NP A-4728-686-A CD BOARD, COMPLETE 7-685-533-19 SCREW +BTP 2.6X6 TYPE2 N-S...

  • Page 80: Electrical Parts List

    HCD-M10 SECTION 8 ELECTRICAL PARTS LIST NOTE: • Due to standardization, replacements in the • CAPACITORS: uF: µF When indicating parts by reference number, parts list may be different from the parts please include the board name. specified in the diagrams or the components •...
  • Page 81 HCD-M10 Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks < THERMISTOR > C166 1-125-891-11 CERAMIC CHIP 0.47uF C167 1-164-245-11 CERAMIC CHIP 0.015uF THP901 1-807-796-11 THERMISTOR C169 1-164-156-11 CERAMIC CHIP 0.1uF C173 1-164-156-11 CERAMIC CHIP 0.1uF < TERMINAL BOARD >...
  • Page 82 HCD-M10 BL (AMBER) BL (WHITE) Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks L143 1-216-296-11 SHORT R134 1-216-821-11 METAL CHIP 1/16W L144 1-216-296-11 SHORT R135 1-216-821-11 METAL CHIP 1/16W L145 1-216-296-11 SHORT L146 1-469-855-21 FERRITE R136...
  • Page 83 HCD-M10 BL (WHITE) Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks < DIODE > C239 1-115-412-11 CERAMIC CHIP 680PF C240 1-115-412-11 CERAMIC CHIP 680PF D815 8-719-079-49 DIODE NSSW450-BRS-TVR C241 1-164-360-11 CERAMIC CHIP 0.1uF D816 8-719-079-49 DIODE NSSW450-BRS-TVR...
  • Page 84 HCD-M10 JACK LOADING MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks R205 1-216-821-11 METAL CHIP 1/16W < RESISTOR > R206 1-216-833-11 METAL CHIP 1/16W R207 1-216-857-11 METAL CHIP 1/16W R850 1-249-417-11 CARBON 1/4W F R851 1-249-421-11 CARBON 2.2K...
  • Page 85 HCD-M10 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks C105 1-104-665-11 ELECT 100uF C374 1-163-009-11 CERAMIC CHIP 0.001uF C110 1-164-004-11 CERAMIC CHIP 0.1uF C460 1-164-004-11 CERAMIC CHIP 0.1uF C111 1-164-004-11 CERAMIC CHIP 0.1uF C600 1-104-665-11 ELECT...
  • Page 86 HCD-M10 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks D923 8-719-988-61 DIODE 1SS355TE-17 Q131 8-729-107-43 TRANSISTOR 2SC3624-L18 D924 8-719-988-61 DIODE 1SS355TE-17 Q260 8-729-025-28 TRANSISTOR 2SK1828 D925 8-719-988-61 DIODE 1SS355TE-17 D926 8-719-988-61 DIODE 1SS355TE-17 Q261 8-729-025-28 TRANSISTOR 2SK1828...
  • Page 87 HCD-M10 MAIN MD DIGITAL Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks R281 1-216-073-00 RES-CHIP 1/10W R458 1-216-025-11 RES-CHIP 1/10W R290 1-216-059-00 METAL CHIP 2.7K 1/10W R466 1-216-049-11 RES-CHIP 1/10W R467 1-216-025-11 RES-CHIP 1/10W R291 1-216-073-00 RES-CHIP...
  • Page 88 HCD-M10 MD DIGITAL Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks C207 1-164-156-11 CERAMIC CHIP 0.1uF < IC > C208 1-164-156-11 CERAMIC CHIP 0.1uF C211 1-164-156-11 CERAMIC CHIP 0.1uF IC201 8-759-675-78 IC UDA1360TS/N1.118 C212 1-124-584-00 ELECT...
  • Page 89 HCD-M10 MD DIGITAL PANEL POWER Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks R871 1-216-829-11 METAL CHIP 4.7K 1/16W R805 1-216-049-11 RES-CHIP 1/10W R872 1-216-824-11 METAL CHIP 1.8K 1/16W R806 1-216-057-00 METAL CHIP 2.2K 1/10W R873 1-216-825-11 METAL CHIP 2.2K...
  • Page 90 HCD-M10 POWER Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 0 C991 1-113-925-11 CERAMIC 0.01uF 250V C1004 1-104-666-11 ELECT 220uF C992 1-126-965-11 ELECT 22uF C1007 1-163-275-11 CERAMIC CHIP 0.001uF C993 1-136-165-00 FILM 0.1uF C994 1-126-936-11 ELECT...
  • Page 91 HCD-M10 < RESISTOR > MISCELLANEOUS ************* R1001 1-216-101-00 METAL CHIP 150K 1/10W R1002 1-216-101-00 METAL CHIP 150K 1/10W 1-569-008-21 ADAPTOR, CONVERSION 2P (SP) R1003 1-216-069-00 METAL CHIP 6.8K 1/10W 1-770-019-11 ADAPTOR, CONVERSION PLUG 3P (HK, UK) R1004 1-216-069-00 METAL CHIP 6.8K...
  • Page 92 HCD-M10 REVISION HISTORY Clicking the version allows you to jump to the revised page. Also, clicking the version at the upper right on the revised page allows you to jump to the next revised page. Ver. Date Description of Revision...

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