Intel H2000WP Technical Manual page 22

Product Overview
o The system can operate up to 40ºC (ASHRAE Class A3) for up to 900 hours
per year
o The system can operate up to 45ºC (ASHRAE Class A4) for up to 90 hours
per year
o System performance may be impacted when operating within the extended
operating temperature range
o There is no long term system reliability impact when operating at the extended
temperature range within the approved limits

Specific configuration requirements and limitations are documented in the configuration
matrix found in the Intel
Thermal Configuration Guidelines Tool, available as a download tool online at Intel.com.

The CPU-1 processor + CPU heatsink must be installed first. The CPU-2 heatsink must
be installed at all times, with or without a processor installed.

Memory Slot population requirements:
Note: Specified memory slots can be populated with a DIMM or supplied DIMM Blank. Memory
population rules apply when installing DIMMs.
o DIMM Population Rules on CPU-1 – Install DIMMs in order; Channels A, B, C,
and D.
o DIMM Population on CPU-2 – Install DIMMs in order; Channels E, F, G, and H.
o The following system configurations require that specific memory slots be
populated at all times using either a DIMM or supplied DIMM blank.
o System Configuration – 16 x 2.5" hard drive bay or 12 x 3.5" hard drive bay
configuration and Intel

All hard drive bays must be populated. Hard drive carriers can be populated with a hard
drive or supplied drive blank.

With the system operating, the air duct must be installed at all times.

In single power supply configurations, the second power supply bay must have the
supplied filler blank installed at all times.

Thermally, the system can support the following PCI add-in cards:
o Add-in cards with a minimum 100 LFM (0.5 m/s) air flow requirement can be
installed in any available add-in card slot in both Riser Card #1 and Riser Card
for IO Module carrier.
o Add-in cards with a >200 LFM air flow requirement cannot be supported.
Note: Most PCI add-in cards have minimum air flow requirements of 100 LFM (0.5m/s). Some
high power add-in cards have minimum air flow requirements of 200 LFM (1 m/s). System
integrators should verify PCI add-in card air flow requirements from vendor specifications when
integrating add-in cards into the system.

The system top-cover must be installed at all times when the system is in operation.

Supported ambient temperature versus processor TDP is as follows:
8
®
Intel
®
Server Board S2600WP product family Power Budget and
®
Server Board S2600WP (16-DIMM server board).
Intel order number: G52418-006
Server System H2000WP Family TPS
Revision 1.6