Another Thermal Solution - Heat Spreader - Advantech MIO-6300 User Manual

Intel celeron n2930 3.5" robotics application, ddr3l, 18/24-bit lvds, vga, 3 gbe, 2 full-size mini pcie, smbus, i2c, msata , 12v/24v power input, canbus support
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There are also four screws inside the white box, please install the DRAM in the
SODIMM socket first, then screw the heatsink into place as per illustration below:
2.2.4

Another Thermal Solution - Heat Spreader

MIO-6300 has an optional heat spreader to make whole system more compact.
Using a heat spreader to conduct heat to your chassis can help a lot when the sys-
tem is extra compact or has limited space for heat convection. Here are some guide-
lines for the heat spreader:
1.
For best heat conduction, the gap between the chassis and heat spreader
should be small; the smaller the better.
2.
The height of the existing heat spreader is 11.2mm (Advantech P/N:
1960065074N001). If you need some other height to fit the chassis better,
Advantech can customize it for you. (Please contact our sales department for
details.)
3.
Thermal grease and screws are provided in heat spreader kit. Thermal grease
helps conduction if the chassis is quite close to heat spreader. Another sugges-
tion is to use a thermal pad if the chassis isn't close enough to the heat
spreader. (The gap should be less than 3mm for better heat transfer.)
MIO-6300 User Manual
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