I/O Characteristics; Table A-5 Thermal Package Characteristics; A.1.9 I/O Characteristics - Motorola MC9S12DT256 User Manual

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Num C
1
T Thermal Resistance LQFP112, single sided PCB
Thermal Resistance LQFP112, double sided PCB
2
T
with 2 internal planes
3
T Thermal Resistance LQFP 80, single sided PCB
Thermal Resistance LQFP 80, double sided PCB
4
T
with 2 internal planes
NOTES:
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-2
3. PC Board according to EIA/JEDEC Standard 51-7

A.1.9 I/O Characteristics

This section describes the characteristics of all 5V I/O pins. All parameters are not always applicable, e.g.
not all pins feature pull up/down resistances.

Table A-5 Thermal Package Characteristics

Rating
3
MC9S12DT256 Device User Guide — V03.07
Symbol
Min
θ
2
-
JA
θ
-
JA
θ
-
JA
θ
-
JA
1
Typ
Max
-
54
-
41
-
51
-
41
Unit
o
C/W
o
C/W
o
C/W
o
C/W
95

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