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Package Mechanical Specifications
2
Package Mechanical
Specifications
2.1
Package Mechanical Specifications
The Intel
3930K processor, and Intel
Flip-Chip Land Grid Array package that interfaces with the baseboard using the
LGA2011-0 socket. The package consists of a processor mounted on a substrate land-
carrier. An integrated heat spreader (IHS) is attached to the package substrate and
core and serves as the mating surface for processor component thermal solutions, such
as a heatsink.
how they are assembled together. Refer to
the LGA2011-0 socket and ILM.
The package components shown in
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor (die)
4. Package substrate
5. Capacitors
Figure 2-1.
Processor Package Assembly Sketch
Substrate
System Board
Note:
1.
Socket and baseboard are included for reference and are not part of processor package.
Thermal/Mechanical Specifications and Design Guide
®
Core™ i7-3960X, i7-3970X processor Extreme Edition, Intel
®
Core™ i7-3820 processor are packaged in a 2011-land
Figure 2-1
shows a sketch of the processor package components and
DIE
IHS
Chapter
3, 4 and 5 for complete details on
Figure 2-1
include the following:
TIM
®
Core™ i7-
Capacitors
LGA 2011-0 Socket
15
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