Processor Materials; Processor Markings; Processor Top-Side Markings - Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications

2.1.7

Processor Materials

Table 2-3
Table 2-3.

Processor Materials

Integrated Heat Spreader (IHS)
2.1.8

Processor Markings

Figure 2-3
identification of the processor.
Figure 2-3.

Processor Top-Side Markings

16
lists some of the package components and associated materials.
Component
Substrate
Substrate Lands
shows the topside markings on the processor. This diagram is to aid in the
GRP1LINE1
GRP1LINE2
GRP1LINE3
GRP1LINE4
GRP1LINE5
S/N
Package Mechanical & Storage Specifications
Material
Nickel Plated Copper
Fiber Reinforced Resin
Gold Plated Copper
Sample (QDF):
GRP1LINE1: i{M}{C}YY
GRP1LINE2: INTEL CONFIDENTIAL
GRP1LINE3: QDF ES SPEED
GRP1LINE4: COUNTRY OF ORIGIN
GRP1LINE5: {FPO} {e4}
Production (SSPEC):
GRP1LINE1: i{M}{C}YY
GRP1LINE2: BRAND PROC#
GRP1LINE3: SSPEC SPEED
GRP1LINE4: COUNTRY OF ORIGIN
GRP1LINE5: {FPO} {e4}
Thermal/Mechanical Specifications and Design Guidelines