Table Of Contents - Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications

Contents
1 Introduction .............................................................................................................. 9
1.1 References ....................................................................................................... 10
1.2 Definition of Terms ............................................................................................ 10
2 Package Mechanical & Storage Specifications .......................................................... 13
2.1 Package Mechanical Specifications ....................................................................... 13
2.1.1 Package Mechanical Drawing.................................................................... 14
2.1.2 Processor Component Keep-Out Zones ...................................................... 14
2.1.3 Package Loading Specifications ................................................................ 15
2.1.4 Package Handling Guidelines.................................................................... 15
2.1.5 Package Insertion Specifications............................................................... 15
2.1.6 Processor Mass Specification .................................................................... 15
2.1.7 Processor Materials................................................................................. 16
2.1.8 Processor Markings................................................................................. 16
2.1.9 Processor Land Coordinates ..................................................................... 17
2.2 Processor Storage Specifications ......................................................................... 18
3 LGA1155 Socket ...................................................................................................... 19
3.1 Board Layout .................................................................................................... 20
3.1.1 Suggested Silkscreen Marking for Socket Identification................................ 22
3.2 Attachment to Motherboard ................................................................................ 22
3.3 Socket Components........................................................................................... 23
3.3.1 Socket Body Housing .............................................................................. 23
3.3.2 Solder Balls ........................................................................................... 23
3.3.3 Contacts ............................................................................................... 23
3.3.4 Pick and Place Cover............................................................................... 23
3.4 Package Installation / Removal ........................................................................... 24
3.4.1 Socket Standoffs and Package Seating Plane.............................................. 25
3.5 Durability ......................................................................................................... 25
3.6 Markings .......................................................................................................... 25
3.7 Component Insertion Forces ............................................................................... 26
3.8 Socket Size ...................................................................................................... 26
4 Independent Loading Mechanism (ILM)................................................................... 27
4.1 Design Concept................................................................................................. 27
4.1.1 ILM Assembly Design Overview ................................................................ 27
4.1.2 ILM Back Plate Design Overview ............................................................... 28
4.1.3 Shoulder Screw and Fasteners Design Overview ......................................... 29
4.2 Assembly of ILM to a Motherboard....................................................................... 30
4.3 ILM Interchangeability ....................................................................................... 32
4.4 Markings .......................................................................................................... 32
4.5 ILM Cover ........................................................................................................ 33
5 LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications .. 37
5.1 Component Mass............................................................................................... 37
5.2 Package/Socket Stackup Height .......................................................................... 37
5.3 Loading Specifications........................................................................................ 38
5.4 Electrical Requirements ...................................................................................... 39
5.5 Environmental Requirements .............................................................................. 40
6 Thermal Specifications ............................................................................................ 41
6.1 Thermal Specifications ....................................................................................... 41
6.1.1 Intel
(Quad Core 95W) Thermal Profile ............................................................. 43
Thermal/Mechanical Specifications and Design Guidelines
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Core™ i7-2000 and i5-2000 Desktop Processor Series
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