Socket Standoffs And Package Seating Plane; Durability; Markings; Package Installation / Removal Features - Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications

LGA1155 Socket
.
Figure 3-7.

Package Installation / Removal Features

3.4.1

Socket Standoffs and Package Seating Plane

Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow and are specified in
Similarly, a seating plane on the topside of the socket establishes the minimum
package height. See
3.5

Durability

The socket must withstand 20 cycles of processor insertion and removal. The max
chain contact resistance from
cycles.
The socket Pick and Place cover must withstand 15 cycles of insertion and removal.
3.6

Markings

There are three markings on the socket:
• LGA1155: Font type is Helvetica Bold - minimum 6 point (2.125 mm). This mark
will also appear on the pick and place cap.
• Manufacturer's insignia (font size at supplier's discretion).
• Lot identification code (allows traceability of manufacturing date and location).
Thermal/Mechanical Specifications and Design Guidelines
Package
Pin 1
Indicator
Alignment
Post
(2 Places)
Appendix
Section 5.2 for the calculated IHS height above the motherboard.
Table 5-4
Orientation
Notch
(2 Places)
Pin 1
Chamfer
C.
must be met when mated in the 1st and 20th
Finger/Tool
Access
(2 Places)
25