Loading Specifications; Socket & Ilm Mechanical Specifications - Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications

5.3

Loading Specifications

The socket will be tested against the conditions listed in
the ILM attached, under the loading conditions outlined in this section.
Table 5-3
The maximum limits should not be exceeded during heatsink assembly, shipping
conditions, or standard use condition. Exceeding these limits during test may result in
component failure. The socket body should not be used as a mechanical reference or
load-bearing surface for thermal solutions.
Table 5-3. Socket & ILM Mechanical Specifications
ILM static compressive load on processor IHS
Heatsink static compressive load
Total static compressive Load
(ILM plus Heatsink)
Dynamic Compressive Load
(with heatsink installed)
Pick & Place cover insertion force
Pick & Place cover removal force
Load lever actuation force
Maximum heatsink mass
Notes:
1. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top
surface.
2. This is the minimum and maximum static force that can be applied by the heatsink and it's retention
solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated
to these limits.
3. Loading limits are for the LGA1155 socket.
4. This minimum limit defines the static compressive force required to electrically seat the processor onto the
socket contacts. The minimum load is a beginning of life load.
5. Dynamic loading is defined as a load a 4.3 m/s [170 in/s] minimum velocity change average load
superimposed on the static load requirement.
6. Test condition used a heatsink mass of 500gm [1.102 lb.] with 50 g acceleration (table input) and an
assumed 2X Dynamic Acceleration Factor (DAF). The dynamic portion of this specification in the product
application can have flexibility in specific values. The ultimate product of mass times acceleration plus static
heatsink load should not exceed this limit.
7. The maximum BOL value and must not be exceeded at any point in the product life.
8. The minimum value is a beginning of life loading requirement based on load degradation over time.
9. The maximum removal force is the flick up removal upwards thumb force (measured at 45o), not
applicable to SMT operation for system assembly. Only the minimum removal force is applicable to vertical
removal in SMT operation for system assembly.
10. The maximum heatsink mass includes the core, extrusion, fan and fasteners. This mass limit is evaluated
using the POR heatsink attach to the PCB.
38
LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications
provides load specifications for the LGA1155 socket with the ILM installed.
Parameter
Chapter 10
Min
311 N [70 lbf] 600 N [135 lbf]
0 N [0 lbf] 222 N [50 lbf]
311 N [70 lbf] 822 N [185 lbf]
N/A 712 N [160 lbf]
N/A 10.2 N [2.3 lbf]
2.2N [0.5 lbf] 7.56 N [1.7 lbf]
N/A 20.9 N [4.7 lbf] in the
vertical direction
10.2 N [2.3 lbf] in the
lateral direction.
N/A 500g
Thermal/Mechanical Specifications and Design Guidelines
with heatsink and
Max Notes
3, 4, 7, 8
1, 2, 3
3, 4, 7, 8
1, 3, 5, 6
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9
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10