Environmental Requirements; Flow Chart Of Knowledge-Based Reliability Evaluation Methodology - Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications

Thermal mechanical specifications and design guidelines (tmsdg) for 2nd generation intel core processor family desktop and lga1155 socket
Table of Contents

Advertisement

5.5

Environmental Requirements

Design, including materials, shall be consistent with the manufacture of units that meet
the following environmental reference points.
The reliability targets in this section are based on the expected field use environment
for these products. The test sequence for new sockets will be developed using the
knowledge-based reliability evaluation methodology, which is acceleration factor
dependent. A simplified process flow of this methodology can be seen in
Figure 5-1.

Flow Chart of Knowledge-Based Reliability Evaluation Methodology

Establish the
market/expected use
environment for the
technology
Freeze stressing
requirements and perform
additional data turns
A detailed description of this methodology can be found at: ftp://download.intel.com/
technology/itj/q32000/pdf/reliability.pdf.
40
LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications
Develop Speculative
stress conditions based on
historical data, content
experts, and literature
search
Perform stressing to
validate accelerated
stressing assumptions and
determine acceleration
factors
§
Thermal/Mechanical Specifications and Design Guidelines
Figure
5-1.

Hide quick links:

Advertisement

Table of Contents
loading

Table of Contents