Ilm Cover - Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications

Independent Loading Mechanism (ILM)
4.5

ILM Cover

Intel has developed an ILM Cover that will snap onto the ILM for the LGA115x socket
family. The ILM cover is intended to reduce the potential for socket contact damage
from operator and customer fingers being close to the socket contacts to remove or
install the pick and place cap. The ILM Cover concept is shown in
The ILM Cover is intended to be used in place of the pick and place cover once the ILM
is assembled to the motherboard. The ILM will be offered with the ILM Cover pre
assembled as well as offered as a discrete component.
ILM Cover features:
• Pre-assembled by the ILM vendors to the ILM load plate. It will also be offered as a
discrete component.
• The ILM cover will pop off if a processor is installed in the socket, and the ILM
Cover and ILM are from the same manufacturer.
• ILM Cover can be installed while the ILM is open.
• Maintain inter-changeability between validated ILM vendors for LGA115x socket,
with the exception noted below
• The ILM cover for the LGA115x socket will have a flammability rating of V-2 per UL
60950-1.
Note: The ILM Cover pop off feature is not supported if the ILM Covers are interchanged on
different vendor's ILMs.
Thermal/Mechanical Specifications and Design Guidelines
1
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Figure 4-6.
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